A multichipmodule technology has been developed in which the module's power planes cover the entire module surface and are separated by 0.15 μm of anodized aluminum (Al2O3). The module provides 50nF/cm2 decoupli...
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ISBN:
(纸本)0818635401
A multichipmodule technology has been developed in which the module's power planes cover the entire module surface and are separated by 0.15 μm of anodized aluminum (Al2O3). The module provides 50nF/cm2 decoupling capacitance across the power supply planes with negligible series inductance. The large capacitance eliminates the need for most if not all discrete capacitors, thereby saving space, reducing delays and increasing packing density. The negligible inductance yields modules having less inductive voltage drop between power levels than any equivalent module relying on discrete decoupling capacitors.
A new set of I/O CMOS buffers for MCM is described. When simulation results of the MCM buffers are compared against conventional Standard Cell CMOS buffers, several advantages emerge. The results indicate that the new...
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ISBN:
(纸本)0818635401
A new set of I/O CMOS buffers for MCM is described. When simulation results of the MCM buffers are compared against conventional Standard Cell CMOS buffers, several advantages emerge. The results indicate that the new buffers dissipate 5 times less power, reduce propagation delay from chip core to another core from 3 - 6 nsec, and increase the frequency of operation by 2.5X when compared to conventional CMOS buffers. Actual measurements between these buffers confirm these simulation results.
This paper describes the use of boundary scan based tests and embedded built in test (BIT) software in the manufacturing defects testing of a 100 MHz, high density, surface mount multi-chip-module, parallel processing...
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This paper describes the use of boundary scan based tests and embedded built in test (BIT) software in the manufacturing defects testing of a 100 MHz, high density, surface mount multi-chip-module, parallel processing computer.< >
In this paper, the authors introduce a new tool to assist in ensuring Electro-Magnetic Compatibility (EMC): an expert system for measuring EMC design rules during Printed Circuit Board (PCB) or multi-chipmodule (MCM)...
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ISBN:
(纸本)0818643528
In this paper, the authors introduce a new tool to assist in ensuring Electro-Magnetic Compatibility (EMC): an expert system for measuring EMC design rules during Printed Circuit Board (PCB) or multi-chipmodule (MCM) layout, The nature of the tool and its place in the design process are discussed. In conclusion, the perceived merits of this approach are presented.
A set of design tools tailored specifically for multi-chipmodule (MCM) development has been developed by Mentor Graphics as an integrated design system for layout, routing, signal-integrity analysis, etc. We have tak...
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ISBN:
(纸本)0930815378
A set of design tools tailored specifically for multi-chipmodule (MCM) development has been developed by Mentor Graphics as an integrated design system for layout, routing, signal-integrity analysis, etc. We have taken an active role in evaluating and validating the design aspects of this tool as a prelude to its generalized use in product design. Comparison with experimental results demonstrate that the AutoTherm integrated thermal analyzer tool, is capable of producing good thermal performance predictions when the analyst supplies good component thermal data.
multi-chipmodules (MCMs) offer an opportunity to satisfy increasing customer requirements for higher performance telecom and signal-processing-systems with broadened capabilities. This paper outlines the development ...
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ISBN:
(纸本)0930815378
multi-chipmodules (MCMs) offer an opportunity to satisfy increasing customer requirements for higher performance telecom and signal-processing-systems with broadened capabilities. This paper outlines the development of an adaptable signal processing MCM and addresses the cost-benefit tradeoffs in designing such an MCM. Lessons learned from this development will greatly influence the design decisions of the next MCM project.
High voltage gated diode crosspoint(GDX) devices (operational at 375 V) in AT&T's No. 5ESS, require exceptional protection. Heat curable silicone elastomer exceptional protection. Heat curable silicone elastom...
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ISBN:
(纸本)0780307941
High voltage gated diode crosspoint(GDX) devices (operational at 375 V) in AT&T's No. 5ESS, require exceptional protection. Heat curable silicone elastomer exceptional protection. Heat curable silicone elastomer appears to be the ideal material for this application. The material formulation includes small amounts of a silane coupling agent which increases material adhesion to the potted hybrid integrated circuit (HIC) structure. However, residual silicone couple agents tends to defuse to outer casings thereby contaminating leads and preventing further lead attach assembly. Titanate modified silicone elastomer was developed which prevents silane coupling agent contamination and also further improves adhesion within the potted structure. This paper begins with a FT-IR GC/MS analyses of the contamination and also further improves with a chemical application towards the final solution to achieving a robust potted GDX HIC. Furthermore, laser ionization mass spectra analysis (LIMA) was used to elucidate the additional titanate interaction with the potting compound.
A membrane multichipmodule fabricated on a silicon substrate by utilizing conventional IC processing techniques is discussed. A chip attachment technology to make electrical connections between the wires on a chip an...
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A membrane multichipmodule fabricated on a silicon substrate by utilizing conventional IC processing techniques is discussed. A chip attachment technology to make electrical connections between the wires on a chip and those on the substrate in the membrane area is described. The contacts between the chips and the module are defined by conventional IC photolithography and formed by metal deposition so that they can be very small and dense. The contacts can be located anywhere over an entire chip and not limited just to the edges. The strong bonding of polyimide can ensure the reliability of the modules. The resistance of 10*10- mu m/sup 2/ and 20*20- mu m/sup 2/ contacts is 0.060 Omega /contact and 0.024 Omega /contact, respectively. multiple-layers of metals are embedded into the membrane to increase the flexibility of routing between chips.< >
The multichipmodule (MCM) design of standard video compression algorithms is presented based on the currently available known good dies. The CCITT H.261 chip sets include chips for motion estimation, DCT and IDCT, fo...
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The multichipmodule (MCM) design of standard video compression algorithms is presented based on the currently available known good dies. The CCITT H.261 chip sets include chips for motion estimation, DCT and IDCT, forward and inverse quantization, Huffman coding and decoding, error correction, and loop filtering. The data compression standard is implemented in several separate chips instead of a giant chip to achieve high manufacturing yields. To realize a compact hardware design, the MCM approach is most suitable. The designs are focused on chip sets that are based on the data compression standard for videophone and video-conferencing applications.< >
A set of I/O CMOS buffers for MCM is described. When simulation results of the MCM buffers are compared against conventional standard cell CMOS buffers, several advantages emerge. The results indicate that the new buf...
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A set of I/O CMOS buffers for MCM is described. When simulation results of the MCM buffers are compared against conventional standard cell CMOS buffers, several advantages emerge. The results indicate that the new buffers dissipate 5 times less power, reduce propagation delay from chip core to another core from 3-6 nsec, and increase the frequency of operation by 2.5 times when compared to conventional CMOS buffers. Actual measurements between these buffers confirm these simulation results.< >
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