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检索条件"任意字段=IEEE Conference on Multi-Chip Module"
540 条 记 录,以下是511-520 订阅
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A multi-chip module for hand-held digital cellular mobile telephone
A multi-chip module for hand-held digital cellular mobile te...
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1992 ieee multi-chip module conference, MCMC 1992
作者: Bang, S.H. Sheu, B.J. Dept. of Electr. Eng. Univ. of Southern California Los AngelesCA90089-0271 United States
The design of a dedicated multichip module (MCM) for hand-held digital cellular telephones is presented. It uses the silicon-on-silicon, flip-chip MCM technology. The MCM contains one gallium arsenide and seven CMOS V... 详细信息
来源: 评论
multichip module enables for high reliability applications
Multichip module enables for high reliability applications
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1992 ieee multi-chip module conference, MCMC 1992
作者: Chu, D. Reber, C.A. Draper, B.L. Sweet, J.N. Palmer, D.W. Sandia Nat. Labs. AlbuquerqueNM87185-5800 United States
To gain uniform, rigorous multichip module (MCM) qualification for high-reliability applications, Sandia has developed: a set of assembly test chips which are available for manufacturers and users to evaluate, charact... 详细信息
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Boundary-scan test structures and test-bench compilation in a multichip module synthesis system
Boundary-scan test structures and test-bench compilation in ...
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1992 ieee multi-chip module conference, MCMC 1992
作者: Vutukuru, R. Subbarao, P. Vmuri, R. Dept. of Electr. and Comput. Eng. Cincinnati Univ. Laboratory for Digital Design Environments OH45221-0030 United States
The authors present a testing methodology for multichip module (MCM) designs, which were automatically generated by a behavioral synthesis system. The testability of the design was enhanced by automatic insertion of b... 详细信息
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Wiring and crosstalk avoidance in multi-chip module design
Wiring and crosstalk avoidance in multi-chip module design
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14th Annual Custom Integrated Circuits conference, CICC 1992
作者: Chen, H.H. Wong, C.K. IBM Research Division Thomas J. Watson Research Center P.O. Box 218 Yorktown Heights NY 10598 United States
This paper presents a channel-based thin-film wiring methodology for multi-chip module design. Crosstalk between adjacent transmission lines are specifically calculated and minimized during routing to avoid excessive ... 详细信息
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An 80 MHz MIPS R6000 CPU using multi chip module technology
An 80 MHz MIPS R6000 CPU using multi chip module technology
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14th Annual Custom Integrated Circuits conference, CICC 1992
作者: Pierson, D. Drobac, S. Parry, D. Control Data Corporation Arden Hills MN United States nCHIP San Jose CA United States MIPS Computer Systems Sunnyvale CA United States
An 80 MHz CPU board has been designed that uses the MIPS R6000 chip set mounted on a silicon circuit board in an air cooled multi chip module (MCM). An existing CPU board design was the departure point with the goal o... 详细信息
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HIGH-SPEED SWITCHING module FOR A LARGE-CAPACITY ATM SWITCHING-SYSTEM
HIGH-SPEED SWITCHING MODULE FOR A LARGE-CAPACITY ATM SWITCHI...
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GLOBAL TELECOMMUNICATIONS CONF ( GLOBECOM 92 ) , INCLUDING COMMUNICA TIONS THEORY MINI-CONF
作者: TOMONAGA, H MATSUOKA, N KATO, Y WATANABE, Y Fujitsu Laboratories Ltd. 1015 Kamikodanaka Nakahara-ku Kawasaki 211 Japan
We have developed an ultrahigh-speed ATM switching module having a highway throughput of 9.6 Gbps using a HEMT process switch IC and a ceramic multi-chip substrate. The switch IC operates at 1.2 Gbps. This module conf... 详细信息
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IMPLEMENTATION OF A PROGRAMMABLE DIGITAL RECEIVER multichip module
IMPLEMENTATION OF A PROGRAMMABLE DIGITAL RECEIVER MULTICHIP ...
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NATIONAL TELESYSTEMS CONF
作者: RINARD, WJ VUJCIC, DD E-Systems Falls Church VA United States
The authors discuss the theory, implementation, and applications of the programmable digital receiver (PDRx) multichip module. The PDRx module comprises four digital receiver channels. The 9-in2 module dissipates less... 详细信息
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Transmission line models of multi-chip module interconnects  5
Transmission line models of multi-chip module interconnects
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5th Annual ieee International ASIC conference and Exhibit, ASIC 1992
作者: Ellis, G.R. Mukund, P.R. Department of Electrical Engineering Rochester Institute of Technology RochesterNY14623 United States
An overview of the important transmission line properties of circuit interconnects is given, and it is shown how these properties can affect the operation of high speed and high density multichip modules (MCMs). Both ... 详细信息
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A multi-chip module for hand-held digital cellular mobile telephone
A multi-chip module for hand-held digital cellular mobile te...
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ieee conference on multi-chip module
作者: S.H. Bang B.J. Sheu Department of Electrical Engineering Signal and Image Processing Institute University of Southern California Los Angeles CA USA
The design of a dedicated multichip module (MCM) for hand-held digital cellular telephones is presented. It uses the silicon-on-silicon, flip-chip MCM technology. The MCM contains one gallium arsenide and seven CMOS V... 详细信息
来源: 评论
Design of a silicon-on-silicon multi-chip module for a high-performance Ps/2 workstation
Design of a silicon-on-silicon multi-chip module for a high-...
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ieee conference on multi-chip module
作者: W.E. Pence D.F. McQueeney J. Mosley Thomas. J. Watson Research Center IBM Corporation Yorktown Heights NY USA Entry Systems Division IBM Corporation Boca Raton FL USA
A silicon-on-silicon multichip module design, which addresses several issues unique to low-end machines, is described. Among these are mixing bipolar and CMOS chips, practicing flip-chip and wirebonding on the same su... 详细信息
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