Several related technologies are required to design and manufacture a successful multichipmodule product. Technology selection depends on how certain parameters are weighted. Decision parameters include module size, ...
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Several related technologies are required to design and manufacture a successful multichipmodule product. Technology selection depends on how certain parameters are weighted. Decision parameters include module size, number of input/output signals, performance, power, ambient temperature environment, availability of semiconductors other than wirebond-compatible, and cost. The authors describe the electrical analysis performed on a 6-chip evaluation module designed and built within Motorola. Results of the module electrical analysis are compared with estimates of the same circuit function built with single chip packages on a printed circuit board.< >
To gain uniform, rigorous multichipmodule (MCM) qualification for high-reliability applications, Sandia has developed: a set of assembly test chips which are available for manufacturers and users to evaluate, charact...
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To gain uniform, rigorous multichipmodule (MCM) qualification for high-reliability applications, Sandia has developed: a set of assembly test chips which are available for manufacturers and users to evaluate, characterize, and compare the particular MCM technology in terms of materials, chemical aging, geometries, stress state, thermal management, and assembly techniques; standard interconnect test structures as test coupons on the MCM substrate to determine the aging reliability through accelerated aging and lot quality through statistics; and exhaustive chip pretest methodology through prepackaging in a way compatible with today's military IC packaging assembly lines. The MCM substrate test structures and packaging for chip pretest are discussed.< >
The authors present a testing methodology for multichipmodule (MCM) designs, which were automatically generated by a behavioral synthesis system. The testability of the design was enhanced by automatic insertion of b...
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The authors present a testing methodology for multichipmodule (MCM) designs, which were automatically generated by a behavioral synthesis system. The testability of the design was enhanced by automatic insertion of boundary scan architecture in every chip of the MCM design. The test vectors for the synthesized design were automatically derived from the behavioral test vectors, which were used to validate the behavioral model of the design. The test vectors were transformed into a serial format as required by the test structures and finally represented in WAVES.< >
An overview of the important transmission line properties of circuit interconnects is given, and it is shown how these properties can affect the operation of high speed and high density multichipmodules (MCMs). Both ...
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An overview of the important transmission line properties of circuit interconnects is given, and it is shown how these properties can affect the operation of high speed and high density multichipmodules (MCMs). Both frequency and time domain issues are addressed. The effects of line-caused delay and signal noise on MCM layouts are reported.< >
A description is given of the architecture and operation of an 1149.1 based digital bus monitor (DBM) IC. The ability of the DBM to monitor the at-speed signal transfers between ICs in real time provides a method of m...
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ISBN:
(纸本)0818691565
A description is given of the architecture and operation of an 1149.1 based digital bus monitor (DBM) IC. The ability of the DBM to monitor the at-speed signal transfers between ICs in real time provides a method of monitoring the functional operation of circuits assembled on board and multi-chipmodule substrates. Such tests can be used to reveal timing sensitive and/or intermittent failures that would otherwise not be detectable without the use of external testers and mechanical probing fixtures. This test approach may, in some cases, reduce the cost to manufacture and support a product by reducing the need for test equipment in both factory and field environments.
We discuss substrate short/open fault detection in MCM manufacturing, and propose a complete open fault coverage algorithm which generates a minimum number of tests required to completely cover all open faults. The al...
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ISBN:
(纸本)0780301013
We discuss substrate short/open fault detection in MCM manufacturing, and propose a complete open fault coverage algorithm which generates a minimum number of tests required to completely cover all open faults. The algorithm generates only about half of the test size compared to that of ordinary approaches. multi-dimensional TSP algorithms are devised to optimize probe routes with quite encouraging results.
Discusses substrate short/open fault detection in MCM manufacturing, and propose a complete open fault coverage algorithm which generates a minimum number of tests required to completely cover all open faults. The alg...
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Discusses substrate short/open fault detection in MCM manufacturing, and propose a complete open fault coverage algorithm which generates a minimum number of tests required to completely cover all open faults. The algorithm generates only about half of the test size compared to that of ordinary approaches. multi-dimensional TSP algorithms are devised to optimize probe routes with quite encouraging results.< >
P-terphenyltetracaboxylic dianhydride (p-TPDA), which has a rodlike structure, has been developed as a raw material for polyimides in order to reduce the propagation delay time associated with polyimide packaging for ...
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P-terphenyltetracaboxylic dianhydride (p-TPDA), which has a rodlike structure, has been developed as a raw material for polyimides in order to reduce the propagation delay time associated with polyimide packaging for multichipmodules. The coefficient of thermal expansion (CTE) of the polyimides derived from p-TPDA is approximately 2 × 10-6. This is much lower than that of conventional polyimides derived from bisphenyltetracoboxylic dianhydride (BPDA), which have a CTE of 8 × 10-6 K-1. Another attribute that these polyimides have is low dielectric constant, with a typical value of about 2.9. As a result, this polyimide can give improved performance when used in multichipmodule applications.
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