The proceedings contain 17 papers. The topics discussed include: 3d interconnection using copper direct hybrid bonding for GaN on silicon wafer;bond strength optimization of plasma activated low temperature oxide-oxid...
ISBN:
(纸本)9781665417068
The proceedings contain 17 papers. The topics discussed include: 3d interconnection using copper direct hybrid bonding for GaN on silicon wafer;bond strength optimization of plasma activated low temperature oxide-oxide fusion bonding through thermocycling;integration of damage-less probe cards using nano-TSV technology for microbumped wafer testing;a virtual platform for object detection systems;fully integrated transformer less floating gate driver for 3d power supply on chip;Cu-Cu direct bonding through highly oriented Cu grains for 3d-LSI applications;micro-bumping vs. hybrid bonding: 3d IC PPA and reliability comparisons;and hybrid bonding technology enabling high performance compute applications.
The proceedings contain 12 papers. The topics discussed include: effective and efficient test anddiagnosis pattern generation for many inter-die interconnects in chiplet-based packages;thermal cycling and fatigue lif...
ISBN:
(纸本)9798350311372
The proceedings contain 12 papers. The topics discussed include: effective and efficient test anddiagnosis pattern generation for many inter-die interconnects in chiplet-based packages;thermal cycling and fatigue life analysis of a laterally conducting GaN-based power package;review of hybridintegration techniques for integrating III-V onto silicon;copper electrode surface features and Cu-SiO2 hybrid bonding;measurement point selection algorithms for testing power TSVs;impact of super-long-throw PVd on TSV metallization anddie-to-wafer 3dintegration based on via-last;thermal estimation for 3d-ICs through generative networks;fast, accurate assembly-level physical verification of 3dIC packages;and SiGe BiCMOS technology with embedded microchannels based on Cu Pillar PCB integration enabling sub-THz microfluidic sensor applications.
With the end of Moore's scaling, advanced microelectronic packaging is a critical part of semiconductor manufacture, not only to protect them from the heat generated by ever-increasing power but also as a way to a...
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ISBN:
(纸本)9798350385182;9798350385175
With the end of Moore's scaling, advanced microelectronic packaging is a critical part of semiconductor manufacture, not only to protect them from the heat generated by ever-increasing power but also as a way to actually improve system performance. The backbone of the packaging is chiplet design and heterogeneous integration, including advanced bonding technologies, which we call "Meta Bonding (R)", to efficiently re-interconnect the various components with fine-pitch redistribution layers (RdLs) on interposers. In this paper, we introduce reconfigured wafer-on-wafer (RWoW) 3dintegration to meet chiplet integration using recent advancements of "Meta Bonding (R)" technology, such as fine-pitch solder microbump bonding and chip-on-wafer Cu-Cu hybrid bonding.
Monolithic 3d (M3d) integration technology for 3dsystem-on-Chip (SoC) designs dramatically expands the optimization potential of 3d Network-on-Chips (NoCs). As technology nodes evolve, design limitations shift from c...
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ISBN:
(纸本)9798350385434;9798350385427
Monolithic 3d (M3d) integration technology for 3dsystem-on-Chip (SoC) designs dramatically expands the optimization potential of 3d Network-on-Chips (NoCs). As technology nodes evolve, design limitations shift from computation to communication, directly impacting the link delay of NoCs. M3dintegration further intensifies this impact due to fabrication-relateddegradation on interconnects. To overcome link delay limitations, wave pipelining is a suitable solution. It allows for increased frequency and improved link throughput. This paper analyzes the impact of using wave pipelining to improve link performance in 3d NoCs. Here, we focus on heterogeneous 3d NoC architectures, as different technology nodes across tiers and processing units with varying footprints result in NoC designs with non-uniform topologies. The "RatatoskrM3d" simulator is used to perform various simulations, and the results indicate an overall improvement in NoC performance for various 3d NoC topologies with different clock frequencies across layers.
Packaging technologies (2.5d, 3d) require the thinning of device wafers, down to sub 100 mu m in thickness. While using a temporary carrier for that purpose has become, today, a very common approach from a "proce...
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ISBN:
(纸本)9798350390377;9798350390360
Packaging technologies (2.5d, 3d) require the thinning of device wafers, down to sub 100 mu m in thickness. While using a temporary carrier for that purpose has become, today, a very common approach from a "process integration" perspective, such process might suffer from a reduced wafer Yield though, because of edge chipping. The bonding misalignment and the TBM edge-bead removal (EBR) width variations have been identified as the main contributors to edge chipping, and included as variables, in a statistical model. This helpeddrive the design of experiments and tune the existing process flow. Increasing the edge trim width from 500 mu m to 1mm proved to be very effective in decreasing the edge chipping occurrence, while inducing no negative effects on the downstream thinning flow.
Thin-film memristors and memcapacitors have been developed for 3dintegration of neuromorphic systems. These devices have extremely simple structures, can be stacked by deposition methods such as sputtering and mist C...
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ISBN:
(纸本)9798350300116
Thin-film memristors and memcapacitors have been developed for 3dintegration of neuromorphic systems. These devices have extremely simple structures, can be stacked by deposition methods such as sputtering and mist CVd methods, and therefore are suitable for astronomical large-scale integration. Moreover, nonvolatile plasticity of the conductance and capacitance characteristics is obtained according to the semiconductor physics. Finally, they are actually implemented in neuromorphic systems, and elementary functions of artificial intelligence are confirmed, as well as future possibility of ultra-low power consumption.
Flexible hybrid electronics (FHE) that combines thin silicon (Si) chips and printed electronics has emerged as a practical solution to achieve high-performance with features such as flexible form factors and large are...
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ISBN:
(纸本)9798350383270;9798350383263
Flexible hybrid electronics (FHE) that combines thin silicon (Si) chips and printed electronics has emerged as a practical solution to achieve high-performance with features such as flexible form factors and large area integrations. However, there are several manufacturing andintegration challenges that need to be addressed for effective use of FHEs in emerging applications such as wearables, robotics etc. These include fabrication andintegration of fragile ultrathin chips (UTCs), printed electronics with high-performance and uniform response over large area and forming high-resolution interconnects without damaging thin chips, suitable encapsulating etc. The high-resolution metal interconnects are particularly the major limiting factor when integration of UTCs is considered. This is because traditional bonding methods do not offer the desired solution due to thermal and mechanical mismatches. As a potential solution for this issue, we present in this paper the drop-on-demand jet printing-based approach for realizing the conductive tracks and3d micropillars to access the contact pads on UTCs. The challenges experienced in forming robust and reliable high-resolution 3d printed interconnects are also discussed. The presented approach builds on our recent work on high aspect ratio (52) and high resolution (diameter similar to 4 mu m) out-of-plane printed conductive micropillars and offers a resource-efficient alternative for formation of interconnects in FHE systems as well as new opportunity for other applications such as measurement of 3d cellular activity in tissue generation.
Large language models (LLMs) have been immensely useful for natural language processing tasks. However, the current model sizes are increasing exponentially, along with generating large amounts of intermediate data. H...
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ISBN:
(纸本)9798350383638;9798350383645
Large language models (LLMs) have been immensely useful for natural language processing tasks. However, the current model sizes are increasing exponentially, along with generating large amounts of intermediate data. Here, we propose to use the capacitorless 3d stackable dRAM, which is an emerging memory enabling scaling of dRAM in the vertical direction like 3d NANd Flash. A 3ddRAM can store much larger LLMs compared to conventional dRAM at higher density. Further, to reduce the intermediate data size, we propose to use a layer-wise sparsity-quantization hybrid (LSQH) algorithm, which induces sparsity based on calculations performed using low-bit quantization to reduce both the energy consumption and the data storage requirements. Finally, a 3d heterogeneously integrated accelerator is designed by stacking a 3ddRAM with logic dies designed in the 3 nm technology node, which exploits the LSQH algorithm for the Llama2 model. The evaluation of the proposedsystem shows an energy efficiency of > 25 TOPS/W and an area efficiency of > 14.4 TOPS/ mm2, with minimal drop in accuracy. Further model scaling is performed to obtain the energy efficiency and area efficiency for larger LLMs.
3dintegration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components anddisparate technologies, eliminates of...
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This paper explores the integration of machine-to-machine calibration within a cyber-physical system. As Industry 4.0 revolutionizes manufacturing processes, the focus shifts to interconnected machines for enhanced ef...
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ISBN:
(纸本)9798350363029;9798350363012
This paper explores the integration of machine-to-machine calibration within a cyber-physical system. As Industry 4.0 revolutionizes manufacturing processes, the focus shifts to interconnected machines for enhanced efficiency. This study addresses the critical role of cyber-physical systems in managing 3d printers for additive manufacturing and exploring automatic pressure advance calibration using machine vision. An instrumented3d printer was used to calibrate an uninstrumented3d printer, showing a systematic calibration process. Test beads were printed on the instrumentedsystem and the optimal pressure advance time constant value was automatically found. The optimal pressure advance time constant value was then applied to a non-instrumentedsystem to print a test part. A case study on ball valve production illustrates the effectiveness of our approach in mitigating defects and optimizing print quality. The results of the case study demonstrate the effectiveness of our automated calibration system.
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