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检索条件"任意字段=IEEE International Conference on 3D System Integration"

共 15364 条记录，以下是11-20 订阅

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A Quasi-delay-Insensitive 3d Interconnect for Robustness Against delay Uncertainties Using a 7nm Face-to-Face Wafer Bonded Process 31

A Quasi-Delay-Insensitive 3D Interconnect for Robustness Aga...

引用

31st conference on Electronics Circuits and systems

作者： Moreira, Matheus Trevisan Koven, William Yang, Lita Wu, Tony F. Sumbul, H. Ekin Beigne, Edith Meta Real Labs Menlo Pk CA 94025 USA

ISBN: (纸本)9798350377217;9798350377200

We present a quasi-delay-insensitive (QdI) circuit designed to provide a correct-by-construction cross-die link in a 3d augmented reality system-on-chip (SoC) in a 7nm hybrid-bonding face-to-face wafer bonded process. The circuit can operate at sub-threshold voltages, down to 0.235V, with a minimum energy point of 0.141pJ/B at 0.45V. Silicon measurements in 7nm technology demonstrate the circuit's ability to cope with delay variations, which are exacerbated in sub-threshold voltages, and to reach minimum energy voltage, which is not possible in equivalent synchronous links of the SoC.

关键词： 3d-integration asynchronous quasi-delay-insensitive

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Ultra low temperature hybrid bonding: morphological and electrical characterizations 10

Ultra low temperature hybrid bonding: morphological and elec...

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10th ieee Electronics system-integration Technology conference (ESTC)

作者： Faure, Margot dubarry, Christophe Renaud, Pablo Baudin, Floriane dominguez, Sebastien Abadie, Karine Morales, Christophe Matei, Constantin Foumel, Frank Univ Grenoble Alpes Leti CEA Grenoble France

ISBN: (纸本)9798350390377;9798350390360

3d integration is increasingly gaining interest for a wide range of applications such as CMOS Image Sensor, dRAM and High Performance Computing. Low temperature hybrid bonding (< 250 degrees C) is more and more demanded by the industry to reduce the thermal budget of sensitive chips integration, or heterogeneous integrations with glass substrate for instance. This study investigates the effect of reducing the annealing temperature in direct hydrophilic wafer-to-wafer hybrid bonding on the morphology of the bonding interface in relation to the electrical results. This paper demonstrates the possibility of realizing a Cu-SiO2 hydrophilic direct wafer-to-wafer (W2W) hybrid bonding with a 5 mu m pitch interconnections, with a low temperature annealing (between 100 degrees C and 300 degrees C).

关键词： 3d integration low temperature copper silicon oxide hydrophilic bonding

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Into the Third dimension: Architecture Exploration Tools for 3d Reconfigurable Acceleration devices 22

Into the Third Dimension: Architecture Exploration Tools for...

引用

22nd international conference on Field Programmable Technology (ICFPT)

作者： Boutros, Andrew Mahmoudi, Fatemehsadat Mohaghegh, Amin More, Stephen Betz, Vaughn Univ Toronto Dept Elect & Comp Engn Toronto ON Canada

ISBN: (纸本)9798350359114

Recent chip integration processes enable 3d stacking of multiple active dice in the same package, offering higher logic density, lower power consumption, and significant die-to-die bandwidth. Field-programmable gate arrays (FPGAs) can benefit from 3d chip integration either by stacking multiple homogeneous FPGA fabrics to increase logic capacity or by integrating with other heterogeneous application-specific integrated circuits (ASICs). This opens up a myriad of research questions and interrelated design choices. However, we lack the tools necessary to model these 3d reconfigurable devices and quantitatively explore their vast design space. In this work, we enhance existing FPGA architecture exploration tools and build new ones to address this gap, with a cross-stack focus on circuit-level fabric modeling, 3d integration considerations, system-level architecture, and computer-aided design (CAd) tools. We extend the RAd-Gen framework by integrating an upgraded version of the COFFE automatic transistor sizing tool that supports 7 nm FinFETs with a more accurate, metal-aware area model for newer process technologies. We also implement new tools in RAd-Gen for modeling the inter-die connections and power distribution networks of 3d architectures. In addition, we introduce a new version of the Versatile Place & Route (VPR) tool that can model 3d devices, with enhancements to its architecture description language and its placement and routing engines. Finally, we showcase the capabilities of our enhanced tools by modeling and evaluating both homogeneous and heterogeneous 3d reconfigurable devices.

关键词： 3d integration FPGA Interposer reconfigurable acceleration devices

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SiGe BiCMOS Technology with Embedded Microchannels based on Cu Pillar PCB integration Enabling sub-THz Microfluidic Sensor Applications

SiGe BiCMOS Technology with Embedded Microchannels based on ...

引用

ieee international 3d systems integration conference (3dIC)

作者： durmaz, Emre Can Heine, Carl Cao, Zhibo Lehmann, Jens Kissinger, dietmar Wietstruck, Matthias IHP Dept Technol Leibniz Inst innovat Mikroelekt D-15236 Frankfurt Germany Univ Ulm Inst Elect Devices & Circuits Ulm Germany IHP Leibniz Inst innovat Mikroelekt Syst Architectures Dept D-15236 Frankfurt Germany

ISBN: (纸本)9798350311372

This paper presents a novel copper pillar based microfluidic integration within a high performance SiGe BiCMOS technology. An embedded calorimetric thermal flow sensor as key microfluidic component has been implemented based on a standard BiCMOS BEOL metallization. The integration concept has been analyzed in terms of technological development as well as it has been established via microfluidic characterization of the designed flow meter sensor. The BiCMOS microfluidic technology platform will be utilized as a sensor platform for sub-THz microfluidic sensor applications.

关键词： embedded microchannel copper pillar PCB integration microfluidic sensor

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Active Learning through integration of Informativeness and diversity for Monocular 3d Object detection

Active Learning through Integration of Informativeness and D...

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2024 conference on Visual Communications and Image Processing

作者： Jeong, Hyunwook Oh, Gyuseok Hyundai Mobis Yongin South Korea

ISBN: (纸本)9798331529543;9798331529550

Monocular 3d object detection plays a critical role for autonomous driving and robot navigation. The lack of depth information in a single 2d image, makes this task highly challenging, necessitating a substantial amount of data to achieve high performance. To minimize the annotation cost, active learning has been employed effectively in various vision tasks. Addressing this challenge, we propose a novel strategy called integration of Informativeness and diversity for Active Learning (IIdAL) for monocular 3d object detection. In the first stage, the candidate samples are selected based on interaction of informativeness and image-level diversity. In the second stage, the final samples are selected based on the diversity between the candidate set and the labeled set to eliminate redundant samples. Furthermore, we introduce a novel initialization strategy to prevent "cold-start" problem. Our framework is model-agnostic requiring no modifications to the detector architecture, and can be seamlessly applied to other monocular 3d object detectors. Extensive experiments on the KITTI dataset demonstrate the effectiveness of IIdAL over baseline methods. Our approach achieves a 20% reduction in annotation costs and outstanding performance, particularly when using less than 50% of the data.

关键词： Active Learning Monocular 3d object detection Informativeness diversity

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Research on the development of 3d Garment Virtual design 3

Research on the Development of 3D Garment Virtual Design

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3rd international conference on Artificial Intelligence and Computer Information Technology, AICIT 2024

作者： Li, Chao Saite International Fashion Institute Shandong Vocational College of Light Industry Shandong Province Zibo China

ISBN: (纸本)9798350365443

3d garment virtual design technology is an important part of the digital production system of garment enterprises, and it is the important directions for the development of the garment industry. This article starts with the development and trends of 3d garment virtual design technology, analyzes the characteristics of 3d garment virtual design technology, explores the problems and development trends in practical use, explores the promotion of comprehensive integration of talent supply chain and fashion industry chain, and assists in the cultivation of 'fashion+digital' composite talents under the integration of industry and education. © 2024 ieee.

关键词： Virtual environments

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Study of Storage Capacity of Charge Trap EAROM NANd Memory designed for integration with VeSTIC Technology 31

Study of Storage Capacity of Charge Trap EAROM NAND Memory D...

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31st international conference on Mixed design of Integrated Circuits and system (MIXdES)

作者： dec, Bartosz Pfitzner, Andrzej Warsaw Univ Technol Inst Microelect & Optoelect Warsaw Poland

ISBN: (纸本)9798350375701;9788363578268

This paper presents a study of increased information storage capabilities of single memory cell of new 3d design. Memory was designed for integration with VeSTIC (Vertical Slit Transistor-based Integrated Circuits) technology, to increase the circuit density to effectively use available space. This memory operates in relative environment, with control voltage not exceeding 9 V. Test simulations of memory cell indicate, that it has the capability to hold even more than 2 bits of information data. This design opens new possibilities for integration of advanced integrated circuits with dedicated non-volatile memory in a single chip with maximum device density.

关键词： VeSTIC 3d Technology 3d NANd EAROM EEPROM 2-bit Memory Transistor

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Zero-Shot dual-Path integration Framework for Open-Vocabulary 3d Instance Segmentation

Zero-Shot Dual-Path Integration Framework for Open-Vocabular...

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ieee/CVF conference on Computer Vision and Pattern Recognition (CVPR)

作者： Ton, Tri Hong, Ji Woo Eom, SooHwan Shim, Jun Yeop Kim, Junyeong Yoo, Chang d. Korea Adv Inst Sci & Technol KAIST Daejeon South Korea Chung Ang Univ Seoul South Korea

ISBN: (纸本)9798350365474

Open-vocabulary 3d instance segmentation transcends traditional closed-vocabulary methods by enabling the identification of both previously seen and unseen objects in real-world scenarios. It leverages a dual-modality approach, utilizing both 3d point clouds and 2d multi-view images to generate class-agnostic object mask proposals. Previous efforts predominantly focused on enhancing 3d mask proposal models;consequently, the information that could come from 2d association to 3d was not fully exploited. This bias towards 3d data, while effective for familiar indoor objects, limits the system's adaptability to new and varied object types, where 2d models offer greater utility. Addressing this gap, we introduce Zero-Shot dual-Path integration Framework that equally values the contributions of both 3d and 2d modalities. Our framework comprises three components: 3d pathway, 2d pathway, and dual-Path integration. 3d pathway generates spatially accurate class-agnostic mask proposals of common indoor objects from 3d point cloud data using a pre-trained 3d model, while 2d pathway utilizes pre-trained open-vocabulary instance segmentation model to identify a diverse array of object proposals from multi-view RGB-d images. In dual-Path integration, our Conditional integration process, which operates in two stages, filters and merges the proposals from both pathways adaptively. This process harmonizes output proposals to enhance segmentation capabilities. Our framework, utilizing pre-trained models in a zero-shot manner, is model-agnostic and demonstrates superior performance on both seen and unseen data, as evidenced by comprehensive evaluations on the ScanNet200 and qualitative results on ARKitScenes datasets.

关键词： grouping and shape analysis Segmentation

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development of the Arm Type 3d Printer for Scaffold Construction in Regenerative Medicine

Development of the Arm Type 3D Printer for Scaffold Construc...

引用

ieee/SICE international Symposium on system integration (SII)

作者： Wanibuchi, Moe Ikeda, Atsutoshi Kindai Univ Fac Sci & Engn Dept Energy & Mat 3-4-1 Kowakae Higashiosaka Osaka 5778502 Japan

ISBN: (纸本)9798350398687

In recent years, automation technologies in the medical field, such as surgical robots and rehabilitation robots, have become commonly used. In the field of regenerative medicine, automation technologies are being developed to create the scaffolds for tissue formation and the organs. The challenges of implementing these technologies include high installation costs, hiring engineers, and installation space. The goal of this study is to develop 3d printing technology of a scaffold for the tissue formation in clinical sites, aiming to reduce medical doctors' workloads. In this paper, we report on the movement performance and cleanliness of our arm-type 3d printer. We analyze the vibration characteristics of the arm-type 3d printer to ensure stable 3d printing. We also designed a cover to eliminate dust emissions from the arm-type 3d printer and measure its cleanliness. Experimental results show our arm-type 3d printer is enough specification to be installed in a clean bench at a clinical site.

关键词： Vibrations Three-dimensional displays Automation Vacuum systems system integration Vibration measurement Manipulators

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Enhancing 3d Printer Functionality through HId-Based Control system development 11

Enhancing 3D Printer Functionality through HID-Based Control...

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11th ieee international conference on Consumer Electronics - Taiwan (ICCE-Taiwan) - Empower of Innovative Consumer Technology

作者： Lee, Seung Jun Lee, Woo Bin Chung Ang Univ Seoul South Korea Seoul Natl Univ Seoul South Korea

ISBN: (纸本)9798350386851;9798350386844

We propose the use of the USB protocol to increase the convenience and expandability of adding features to 3d printers. To implement this, we developed a Human Interface device (HId) and an Octoprint plug-in for feature addition. This approach has made it easier to add features to existing 3d printers via USB and has confirmed the improved expandability through compatibility with various 3d printers.

关键词： HId MCU USB Octoprint plug-in 3d printer

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