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ieee/SICE international Symposium on system integration (SII)

作者： Matsuda, Ryota Mavinkurve, Ujjal Krishnanand Kanada, Ayato Honda, Koki Nakashima, Yasutaka Yamamoto, Motoji Kyushu Univ Fac Mech Engn Fukuoka 8190395 Japan

ISBN: (纸本)9798350398687

Continuum robots can produce dexterous movements and safe interactions due to their inherent compliance, but the lack of stiffness has restricted their deployment in real-world environments. To address this problem, we have studied a high-payload robotic manipulator that bends and extends in 2d space. In this article, we propose the mechanical design for moving our manipulator in 3d space. We use a 3d printer for the prototype production and share its technical strategies for sturdiness and strong fastening.

关键词： Three-dimensional displays Gears Wires Force Prototypes system integration Production

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Impact of Super-long-throw PVd on TSV Metallization and die-to-Wafer 3d integration Based on Via-last

Impact of Super-long-throw PVD on TSV Metallization and Die-...

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ieee international 3d systems integration conference (3dIC)

作者： Shen, Jiayi Liu, Chang Hoshi, Tadaaki Sinoda, Atsushi Kino, Hisashi Tanaka, Tetsu Mariappan, Murugesan Koyanagi, Mitsumasa Fukushima, Takafumi Tohoku Univ Grad Sch Engn Dept Mech Syst Engn Sendai Japan Tohoku Univ Grad Sch Engn Sendai Japan Tohoku Univ Global INTegrat Initiat GINTI New Ind Creat Hatchery Ctr NICHe Sendai Japan

ISBN: (纸本)9798350311372

The increasing demands for high-quality and high-aspect-ratio Through-Silicon Vias (TSVs) in three-dimensional integrated circuits (3d-IC) have made Si process technologies a significant challenge. Long-throw ionized Physical Vapor deposition (iPVd) is widely used for barrier/seed layer deposition prior to Cu filling by electroplating for TSV. However, a micro-scale shadowing effect in deep Si holes with high aspect ratios results in failed filling. Bosch etching process can form the high-aspect-ratio deep Si holes but it leaves nuisance scallop features that further increase another submicron-scale shadowing effect. This study aims to explore the impact of super long-throw iPVd with low-frequency RF substrate bias to form high-aspect-ratio TSVs and compares the Cu coverages with a standard magnetron sputtering of non-ionized PVd for 3d-IC rapid prototyping.

关键词： 3d-IC. TSV Via-last PVd die-to-Wafer Rapid prototyping

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Research on Integrated Intelligent Early Warning system for Slope with Multi-Source Sensing Perception 6

Research on Integrated Intelligent Early Warning System for ...

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6th international conference on Frontier Technologies of Information and Computer, ICFTIC 2024

作者： Liu, Ting Gao, Huanhuan Wang, Mingjiang Zhang, Qun PowerChina Northwest Engineering Corporation Limited Xi'an China

ISBN: (纸本)9798331541750

In the traditional monitoring system of slope, various monitoring systems (such as environmental quantity, strong earthquake, deformation system, etc.) are independent, and the monitoring method based on single point cannot cover all areas of slope and has low visual management degree. Based on this, this study first integrates synthetic aperture radar, UAV, 3d scanner and other new sensing equipment to build an integrated monitoring system covering the full range of slope monitoring. Then, based on the 3d scanning data, the slope and its corresponding monitoring equipment can be visualized in 3d by combining tilt photography technology, and the slope classification warning system is proposed. Finally, combined with computer technology, the integration framework of data warehouse and monitoring system for massive monitoring data is constructed, and the corresponding intelligent slope warning integration platform is developed. The on-site demonstration shows that the intelligent early warning platform built by this study can not only achieve real-time early warning, but also has good accuracy and extensibility. © 2024 ieee.

关键词： Environmental monitoring

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Flexible 3d Printed Ferroelectret Sensors Integrated into Smart Textiles for Unobtrusive Monitoring 6

Flexible 3D Printed Ferroelectret Sensors Integrated into Sm...

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international conference on Flexible and Printable Sensors and systems (FLEPS)

作者： Altmann, Alexander A. Souissi, Fatma Ben dali, Omar Suppelt, Sven Latsch, Bastian doersam, Jan Helge Zhukov, Sergey Flachs, dennis Kupnik, Mario Tech Univ Darmstadt Measurement & Sensor Technol Grp Darmstadt Germany Tech Univ Darmstadt Dept Mat & Earth Sci Darmstadt Germany TH Aschaffenburg Fac Engn Aschaffenburg Germany

ISBN: (纸本)9798350383270;9798350383263

The development of smart wearables, involving the sensor integration into textiles, has emerged in several applications, such as heart rate monitoring in healthcare contexts, smart insoles for gait analysis, or gesture recognition for virtual reality interfaces. A common challenge in this field is the incorporation of off-the-shelf sensors, which are often nonelastic, therefore, constrain the design, reduce sensitivity, and lead to increased costs. In this work, we present an additively manufactured ferroelectret sensor integrated into a textile with detachable electronics on an elastic strap. The sensor comprises a 3d printed layer of soft polylactic acid, creating a seamlessly fused, mechanically resilient compound. Its long-term charge stability results in the surface potential settling at 300V after 15 days and a piezoelectric coefficient of up to 201 pC/N for mechanical loads of 1 N, similar to state-of-the-art ferroelectrets. We demonstrate the sensor integration in the application of hand gesture recognition by deploying it into a sport bandage and reliably distinguish between three gestures, while the soft sensor proves suitable as an unobtrusive measurement device. As a result, this lowcost, biocompatible, and highly flexible sensor qualifies for the integration in various further applications, such as in medical and sports devices.

关键词： Flexible sensor textile integration ferroelectret 3d printing smart textiles gesture detection

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Acoustic MEMS Packaging for Audio Micro system Applications 10

Acoustic MEMS Packaging for Audio Micro System Applications

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10th ieee Electronics system-integration Technology conference (ESTC)

作者： Cerini, Fabrizio Adorno, Silvia Maierna, Amedeo del Sarto, Marco Maggi, Luca Gritti, Alex Ratti, Andrea Nashkolnyy, Nazariy STMicrolectronics Cornaredo Italy STMicroelectronics Agrate Brianza Italy

ISBN: (纸本)9798350390377;9798350390360

MEMS loudspeakers are becoming more and more interesting for a wide variety of applications. Their complete characterization is vital for any practical application. This characterization must take into consideration the interaction with package and should use packaging solution commonly pursued in high volume manufacturing. A packaging approach based on organic substrate combined with 3d printing is presented. The influence of different die attach materials on the performances of loudspeaker is highlighted.

关键词： MEMS loudspeakers packaging die attach materials characterization

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Cluster-Based Thermal-Aware Mapping for 3d-NoC-Based NASH Neuromorphic system

Cluster-Based Thermal-Aware Mapping for 3D-NoC-Based NASH Ne...

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2024 ieee international conference on Advanced systems and Emergent Technologies, IC_ASET 2024

作者： Maatar, Mohamed dang, Khanh N. Abdallah, Abderazek Ben Graduate School of Computer Science and Engineering University of Aizu Aizuwakamatsu Fukushima Japan

ISBN: (纸本)9798350384895

Neuromorphic computing, inspired by the brain's neural architecture, offers a path towards energy-efficient and high-performance computing by mimicking spiking neurons and synaptic activities. The expansion of neuromorphic systems, how-ever, is hampered by issues related to system scalability, energy efficiency, and processing speed. To overcome these obstacles, the adoption of 3d integrated circuits (3d-ICs) and 3d network-on-chip-based (3d-NoC) architectures has been suggested. These technologies facilitate enhanced system scalability, lower energy consumption, and minimized interconnect lengths, leading to improved performance. However, the integration of 3d-IC in neuromorphic systems introduces thermal challenges due to increased power density and uneven heat distribution across the stacked layers. This paper presents a cluster-based thermal-Aware mapping method based on genetic algorithm that aims to minimize highest and the variance of the temperature across the system. The results of the proposed method show that our method has up to 39oC lower peak temperature than linear mapping methods with a trade-off of 7. 5x communication cost. Therefore, our method results in a lower temperature with a moderate thermal state across the layers. © 2024 ieee.

关键词： Network-on-chip

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Enhancing Multi-Camera Gymnast Tracking Through domain Knowledge integration

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ieee TRANSACTIONS ON CIRCUITS ANd systemS FOR VIdEO TECHNOLOGY 2024年第12期34卷 13386-13400页

作者： Yang, Fan Odashima, Shigeyuki Masui, Shoichi Kusajima, Ikuo Yamao, Sosuke Jiang, Shan Fujitsu Res Kawasaki 2118588 Japan

We present a robust multi-camera gymnast tracking, which has been applied at international gymnastics championships for gymnastics judging. despite considerable progress in multi-camera tracking algorithms, tracking gymnasts presents unique challenges: 1) due to space restrictions, only a limited number of cameras can be installed in the gymnastics stadium;and 2) due to variations in lighting, background, uniforms, and occlusions, multi-camera gymnast detection may fail in certain views and only provide valid detections from two opposing views. These factors complicate the accurate determination of a gymnast's 3d trajectory using conventional multi-camera triangulation. To alleviate this issue, we incorporate gymnastics domain knowledge into our tracking solution. Given that a gymnast's 3d center typically lies within a predefined vertical plane during much of their performance, we can apply a ray-plane intersection to generate coplanar 3d trajectory candidates for opposing-view detections. More specifically, we propose a novel cascaded data association (dA) paradigm that employs triangulation to generate 3d trajectory candidates when cross-view detections are sufficient, and resort to the ray-plane intersection when they are insufficient. Consequently, coplanar candidates are used to compensate for uncertain trajectories, thereby minimizing tracking failures. The robustness of our method is validated through extensive experimentation, demonstrating its superiority over existing methods in challenging scenarios. Furthermore, our gymnastics judging system, equipped with this tracking method, has been successfully applied to recent Gymnastics World Championships, earning significant recognition from the international Gymnastics Federation.

关键词： Target tracking Three-dimensional displays Cameras Trajectory Sports Robustness Training Multi-camera vision multi-object tracking sports video analysis

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Automated integration of BIM and 3d GIS for Sustainable Infrastructure Management 22

Automated Integration of BIM and 3D GIS for Sustainable Infr...

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22nd international Learning and Technology conference, L and T 2025

作者： Zada, Yassmine Sebari, Imane Morel, Victor Pierrot, Amanda School of Geomatics and Surveying Engineering IAV Hassan II Department of Photogrammetry and Cartography Rabat Morocco Setec International Building Information Modeling Hub Paris France Setec International Geographic Information System Hub Paris France

ISBN: (纸本)9798331532215

In this paper, we present an automated integration approach for BIM and 3d GIS data about infrastructure projects to improve human-machine interaction with respect to sustainable project management. Based on the step-by-step process that starts with the preparation of data in BIM about buildings and complex infrastructures, CAd for the buried networks and terrain models, and BIM itself for buildings and complex infrastructures by generating IFC models. This is followed by a cleansing and optimisation step to find geometric conflicts. ETL processes automate the development of a unified spatial database integrating BIM and GIS data, without loss to geometric or attribute data. Automation tools are used to transfer data between BIM and GIS environments. This process enables the design of a 3d GIS application for 3d visualization and advanced spatial queries, such as efficient monitoring and decision making. From a case study in preliminary infrastructure projects, such as underground networks and building structure mapping, significant improvements in workflow efficiency were observed, improving by 30%, and data errors were reduced by 20% compared to manual methods. It is an essential gain for infrastructure integration and management, in particular within the complex environments involving smart cities. This approach contributes to sustainable infrastructure management through the use of global real-time views about projects. © 2025 ieee.

关键词： decision making

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An Open-source Software-hardware integration Scheme for Embodied Human Perception in Service Robotics 20

An Open-source Software-hardware Integration Scheme for Embo...

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international conference on Advanced Robotics and Its Social Impacts (ARSO)

作者： Okunevich, Iaroslav Hilaire, Vincent Galland, Stephane Lamotte, Olivier Ruichek, Yassine Yan, Zhi UTBM CIAD UR 7533 F-90010 Belfort France

ISBN: (纸本)9798350344646;9798350344639

Perception of human beings is one of the basic capabilities of service robots and is the prerequisite for interaction between robots and humans. Although enabling hardware and software technologies have made great strides, there are not many open-source solutions that organically integrate the two. To address this shortfall, this paper introduces an open-source scheme of hardware and software integration for robotic embodied human perception. The embodied entity includes a robot chassis, a computing unit based on ARM architecture, a 3d lidar, a 2d lidar and four RGB-d cameras for robot exterior perception, a display panel for human-robot interaction, a set of LEd lights to show the robot's status and a sonar strip for low-level obstacle avoidance. The perception software is fully based on the Robot Operating system (ROS) which allows high modularity, fully deployed to the embodied entity and running at a rate of 30 Hz. The entire integration solution is very portable and publicly available at https://***/ Nedzhaken/human_aware_navigation.

关键词： Robot Operating system

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Electrical performance of self-assembly applied to die-to-wafer hybrid bonding 10

Electrical performance of self-assembly applied to die-to-wa...

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10th ieee Electronics system-integration Technology conference (ESTC)

作者： Thiolon, Adele Montmeat, Pierre Enot, Thierry Bond, Alice Ladner, Carine Sanchez, Loic Campo, Alain Magis, Thomas Baudin, Floriane dominguez, Sebastien Fournel, Frank Bourjot, Emilie Univ Grenoble Alpes CEA Leti Grenoble France

ISBN: (纸本)9798350390377;9798350390360

Self-assembly process is a promising solution to improve throughput of die-to-Wafer direct hybrid bonding process while maintaining fine alignment. This paper presents our latest developments on self-assembly process. An electrical test vehicle has been fabricated for self-assembly with daisychains and Kelvin structures designed with 6 mu m pitch and hybrid bonding pad dimensions of 3 mu m. Characterizations of alignment performance, bonding quality and electrical results demonstrated the proof-of-concept of self-assembly process integration with functional hybrid bonding surfaces.

关键词： 3d integration die-to-wafer hybrid bonding selfassembly electrical test vehicle

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