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检索条件"任意字段=IEEE International Conference on 3D System Integration"

共 15364 条记录，以下是81-90 订阅

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Performance Optimization of Gigawatt-Class dFC-PowerChip Laser system Through Bonding Technology 8

Performance Optimization of Gigawatt-Class DFC-PowerChip Las...

引用

8th international Workshop on Low Temperature Bonding for 3d integration, LTB-3d 2024

作者： Kausas, Arvydas Yahia, Vincent Odaka, Hideho Taira, Takunori RIKEN SPring-8 Center Harima Branch 1-1-1 Kouto Sayo-cho Sayo-gun679-5148 Japan Division of Research Innovation and Collaboration IMS 38 Nishigonaka Myodaiji Okazaki444-8585 Japan

We report on the development of an amplifier laser system for compact particle accelerators, operating at room temperature. The active medium of the amplifier is comprised of periodically bonded Nd3+:YAG and sapphire ... 详细信息

ISBN: (纸本)9798331519919

关键词： Sapphire

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Reconfigurable 3d Edge Sensing system of Carbon Nanotube Sensing and Silicon CMOS from a Commercial Manufacturing Facilities 37

Reconfigurable 3D Edge Sensing System of Carbon Nanotube Sen...

引用

2024 international Workshop on Signal Processing systems

作者： Amer, Aya G. Hills, Gage Kyriazidis, Georgios Chandrakasan, Anantha P. Shulaker, Max M. MIT Dept Elect Engn & Comp Sci Cambridge MA 02139 USA Harvard SEAS Dept Elect Engn Cambridge MA USA Analog Devices Inc Wilmington MA USA NYU Grossman Sch Med New York NY USA

ISBN: (纸本)9798350373769;9798350373752

In this work, we present a reconfigurable edge sensing system leveraging monolithic three-dimensional (3d) integration to integrate tens of thousands of sensors directly over conventional silicon CMOS circuitry, fabricated entirely within major commercial semiconductor manufacturing facilities. Owing to the dense and fine-grained 3d integration, our demonstrated IC can rapidly adapt its architecture to trade-off spatial sampling resolution, temporal sampling resolution, and bit resolution optimized to the current environment sensed by the chip. Within milliseconds, the chip can modulate the amount of data captured per sensing operation by >2,000X, corresponding with a >16,000 range in power consumption. While this demonstration integrates carbon nanotube (CNT)-based FETs (CNFETs) as gas sensing elements on the upper-layer of the chip, this reconfigurable edge sensing IC can be implemented with a wide variety of emerging sensing technologies and thus is a platform for future intelligent sensing at the edge.

关键词： Edge Sensing Carbon Nanotube (CNT) Monolithic 3d Integrated Circuit (3d IC)

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Extremely Large 3.5d Heterogeneous integration for the Next-Generation Packaging Technology 73

Extremely Large 3.5D Heterogeneous Integration for the Next-...

引用

ieee 73rd Electronic Components and Technology conference (ECTC)

作者： Lee, Ilbok Nam, Soohyun Kim, Sungeun Shin, Sangho Kim, Younglyong Seo, Sun-Kyoung Yu, Hae Jung Kim, dae-Woo Samsung Elect Co Ltd AVP TD Team Cheonan Si Chungcheongnam South Korea

ISBN: (纸本)9798350334982

2.5d silicon interposer for multi-die heterogeneous integration is the mainstream package architecture for a high-performance computing (HPC) and an artificial intelligence (AI) application. In this study, 3.5d package is demonstrated to combine 2.5d silicon interposer and 3d architecture to obtain high-performance and high-density interconnection with the small footprint system package. Extremely large Si interposer (4x reticle size) was manufactured and integrated with multi logic test chips with 12-HBMs, 3-chiplets and 3d-ASIC. 3d-ASIC was manufactured by vertical interconnection of two partitioned chips by Cu-Cu hybrid bonding. 3d-ASIC will be able to overcome effectively the single chip reticle size limitation and large die yield issue in Si fabrication. Furthermore 12-HBMs and 3-chiplets were assembled on silicon interposer using Chip on Wafer (CoW) process for higher system bandwidth. 3d-ASIC was attached on silicon interposer by solder reflow bonding process with 40um bump pitch. To avoid underfill void on narrow chip gap and die to die space, vacuum devoid process was introduced and the underfill void under multi-chip was completely removed. The extremely large molded Si interposer with multi-die was assembled on organic substrate successfully showing the reliable joint quality by controlling molded Si interposer and substrate warpage effectively. The interfacial stress between various multi-heterogeneous chips was analyzed through finite element method (FEM) simulation and the impact on reliability will be discussed.

关键词： 2.5d 3d 3.5d Si interposer 3d ASIC Heterogeneous integration Reliability

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Reshaping system design in 3d integration: Perspectives and Challenges 23

Reshaping System Design in 3D Integration: Perspectives and ...

引用

international Symposium on Physical design (ISPd)

作者： Chen, Hung-Ming Ho, Chu-Wen Wu, Shih-Hsien Lu, Wei Huang, Po-Tsang Chang, Hao-Ju Liu, Chien-Nan Jimmy Natl Yang Ming Chiao Tung Univ Inst Elect Hsinchu Taiwan Natl Yang Ming Chiao Tung Univ SoC Res Ctr Hsinchu Taiwan Ind Technol Res Inst Elect & Optoelect Syst Res Labs Tainan Taiwan Natl Yang Ming Chiao Tung Univ Inst Elect Hsinchu Taiwan Natl Yang Ming Chiao Tung Univ ICST Hsinchu Taiwan Natl Yang Ming Chiao Tung Univ Int Coll Semicond Technol Hsinchu Taiwan

In this paper, we depict modern system design methodologies via 3d integration along with the advance of packaging, considering system prototyping, interconnecting, and physical implementation. The corresponding chall... 详细信息

ISBN: (纸本)9781450399784

关键词： 3d integration Fast system prototyping 3d interconnection architecture d2d design

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Research on Multimedia Graphic design system Based on Computer 3d Vision Communication 24

Research on Multimedia Graphic Design System Based on Comput...

引用

3rd international conference on Cryptography, Network Security and Communication Technology (CNSCT)

作者： Xu, Qi Wuchang Shouyi Univ Wuhan 430064 Peoples R China

ISBN: (纸本)9798400716959

This article delves into the application of computer 3d vision technology in multimedia graphic design systems, aiming to explore how to improve design quality by enhancing the depth and interactivity of visual communication. By integrating advanced 3d graphics processing algorithms, this study successfully developed a highly modular design system that can achieve complex 3d model rendering, support real-time lighting effects, and provide a user-friendly interactive interface. The system adopts GPU (General Processing Unit) acceleration technology, optimizes rendering pipelines, and ensures efficient graphics rendering performance. The research results indicate that in the testing of system response, it can be found that the response time is shorter than that of the improved system, with an average response time of 0.48 seconds, while the average response time of traditional systems is 1.2 seconds. It can be seen that the system in this article operates smoothly in the UI (User Interface), and can maintain a good user experience even when dealing with complex design tasks. The results of this study not only broaden the application scope of computer 3d vision in the field of multimedia design, but also lay the foundation for subsequent research and development of related technologies.

关键词： Computer 3d vision Multimedia graphic design system integration Visual communication efficiency

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design and development of a shape measurement system for 3d construction printing with a manipulator 20

Design and development of a shape measurement system for 3D ...

引用

ieee 20th international conference on Automation Science and Engineering (CASE)

作者： Nakanishi, Reina Ogura, Hiroki Yamamoto, Shinya Abe, Hiroyuki Kikuchi, Ryu Shimizu Corp Inst Technol Robot Res Ctr Shiomi Koto Tokyo 1350052 Japan Shimizu Corp Inst Technol Ctr Social Syst Engn Shiomi Koto Tokyo 1350052 Japan

ISBN: (纸本)9798350358513;9798350358520

We describe a 3d construction printing system comprising an industrial robot with a six-degrees-of-freedom manipulator and a pump that supplies mortar. Printing is realized by linking the manipulator to the pump. To measure and evaluate printed object shapes, we attached a time-of-flight camera with +/- 2-mm measurement accuracy to an end effector mounted on the manipulator, thereby acquiring point-cloud data for printed objects. Using software developed to control the manipulator, and an open-source robotics middleware suite as the robot operating system, we merge the obtained point clouds. After printing mortar objects, we use the developed system to measure their shapes. Experimental results show that point clouds for printed objects have errors of 0 to 10 mm, while data from a conventional stationary 3d laser scanner has measurement accuracy of +/- 1 mm. Although merged point clouds show increased errors, measurement times decreased to approximately one-sixth those of conventional scanners. The increased error is likely due to factors such as the manipulator's weight and its installation at the end effector and the sensor. We use a total station to measure deflections to confirm the manipulator's positioning accuracy.

关键词： End effectors

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digital Twin system for Smart Buildings Integrated with Blockchain and Mixed Reality Technology 1

Digital Twin System for Smart Buildings Integrated with Bloc...

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1st ieee international Symposium on Consumer Technology, ISCT 2024

作者： Hidayat, Wahyu Nur Hakim, Oktafian Sultan Sukaridhoto, Sritrusta Zainuddin, Muhammad Agus Prayudi, Agus Arissabarno, Cahyo Achmad, Zacky Maulana Budiarti, Rizqi Putri Nourma Politeknik Elektronika Negeri Surabaya Department of Informatics and Computer Engineering Indonesia Universitas Nahdlatul Ulama Surabaya Indonesia

ISBN: (纸本)9798350365191

The integration of 3d innovation, Mixed Reality (MR), and blockchain in smart buildings has revolutionized the IoT sector. Visualization using 3d technology and immersive interfaces allows users to control and interact with devices within smart building environments. Users can use hand gestures or controllers in a 3d environment to adjust lighting, monitor energy consumption, or manage other smart devices. When combined with MR, the capabilities of 3d technology are enhanced with virtual elements overlaying onto the real-world environment. Within smart buildings, MR can visualize real-time sensor data, display device statuses, and provide intuitive visual feedback. The integration of blockchain in this ecosystem adds layers of security, transparency, and trust by securely recording and verifying device data, control commands, and user interactions. Blockchain technology enables secure peer-to-peer communication and smart contracts for automated device interactions and control. User testing results for controlling smart buildings with Mixed Reality (MR) technology showed high user satisfaction with an average score of 4.48. Users appreciated the performance and functionality of the system, as well as the new experience provided by the natural and immersive MR interface for interacting with smart building controls. © 2024 ieee.

关键词： Smart homes

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ACCURATE SEGMENTATION FOR PATHOLOGICAL LUNG BASEd ON integration OF 3d APPEARANCE ANd SURFACE MOdELS 30

ACCURATE SEGMENTATION FOR PATHOLOGICAL LUNG BASED ON INTEGRA...

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30th ieee international conference on Image Processing (ICIP)

作者： Sharafeldeen, Ahmed Alksas, Ahmed Ghazal, Mohammed Yaghi, Maha Khelifi, Adel Mahmoud, Ali Contractor, Sohail van Bogaert, Eric El-Baz, Ayman Univ Louisville Dept Bioengn Louisville KY 40292 USA Abu Dhabi Univ Elect Comp & Biomed Engn Dept Abu Dhabi U Arab Emirates Abu Dhabi Univ Comp Sci & Informat Technol Dept Abu Dhabi U Arab Emirates Univ Louisville Dept Radiol Louisville KY 40292 USA

ISBN: (纸本)9781728198354

A novel unsupervised-based segmentation method is introduced to accurately delineate the lung region in 3d CT images based on appearance and geometric models. First, a probabilistic model that utilized a linear combination of Gaussian (LCG) tuned by a modified expectation maximization (EM) algorithm, is employed to model the density distribution of 3d CT chest volume. Subsequently, the initial labeling of the 3d CT chest volume is mapped to a probability distribution based on a 3d Markov Gibbs random field (MGRF) for refining. Finally, a geometric model is employed to refine the proposed segmentation by interpolating/connecting two points on its boundary with high curvature. The effectiveness of the proposed approach on 3d computed tomography (CT) chest scans of 26 patients diagnosed with different severity of coronavirus disease 2019 (COVId-19) is evaluated using four different metrics: overlap coefficient, dice similarity coefficient (dSC), absolute lung volume difference (ALVd), and 95(th)-percentile bidirectional Hausdorff distance (95(th) Hd). The proposed method achieved 94.89%(+/- 2.39%), 97.36%(+/- 1.27%), 1.79(+/- 1.89), and 4.75(+/- 2.3), respectively. Compared to three state-of-the-art methods based on deep learning approaches, the proposed method achieved superior performance in segmenting pathological lung tissues, demonstrating the promising of the proposed segmentation system.

关键词： Computed Tomography (CT) Unsupervised Segmentation MGRF LCG Curvature

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Simple Fabrication and integration of 3d Electrodes for High-Sensitivity droplet detection 38

Simple Fabrication and Integration of 3D Electrodes for High...

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38th ieee international conference on Micro Electro Mechanical systems, MEMS 2025

作者： Oh, Byeolnim Son, Moon Sung Park, Jaewon Lee, Kang-Ho Kim, Hyun Soo Kwangwoon University Korea Republic of Korea University Korea Republic of Korea Institute of Machinery and Materials Korea Republic of

ISBN: (纸本)9798331508890

This study introduces a simple and low-cost approach for fabricating and integrating 3d electrodes into droplet microfluidic detector using liquid metal. These 3d electrodes provide high sensitivity by ensuring a uniform electric field throughout the detection region and by being fully exposed within the channel, enabling direct contact with the sample. This combination significantly enhances detection performance, making the detector ideal for label-free analysis of droplet contents. Unlike traditional 2d electrodes, the 3d electrode integrated detector achieves comprehensive droplet analysis, allowing for sensitive detection. Experimental results demonstrate the high-sensitivity detection performance of the 3d electrodes, with significant improvements for cell growth measurement within droplets. © 2025 ieee.

关键词： Microfluidics

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Enhanced Condition Assessment of IGBTs Through 3d Segmented Reconstruction Simulation 7

Enhanced Condition Assessment of IGBTs Through 3D Segmented ...

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7th ieee Student conference on Electric Machines and systems, SCEMS 2024

作者： Yuan, Bin Yu, Yan Cen, Yongqi Sun, Zhenxin Li, Meiqiao Sun, Yixiao Su, Yanqi Wang, donglai School of New Energy Shenyang Institute of Engineering Shenyang China State Grid Liaoning Extra High Voltage Company Shenyang China Shenyang Institute of Engineering Key Laboratory of Regional Multi-energy System Integration and Control of Liaoning Province Shenyang China

ISBN: (纸本)9798350366945

The condition assessment method of the Insulated Gate Bipolar Transistor (IGBT) devices is investigated in this paper. Simulation models in 2d and 3d are constructed based on the finite element models, and the differences between the two models are compared. To improve the accuracy of the 2d model and meet the requirements of digital twin technology, based on the 3d simulation physical model to correct the 2d computational results, the 3d segmented reconstruction method was proposed. By constructing a mathematical model, the output results of the 2d and 3d models were segmented and fitted to derive the corresponding relationship formulas for each segment. Using these formulas to optimize the computational results of the 2d model significantly improved the simulation speed while ensuring high accuracy, meeting the real-time and accuracy requirements of digital twin technology. © 2024 ieee.

关键词： 3d reconstruction

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