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38th international conference on VLSI design, VLSID 2025

作者： Mahapatra, Mrinmoy Kekarjawlekar, Prathamesh Ganesh Akshay, K. School of Electrical and Computer Sciences Indian Institute of Technology Bhubaneswar Odisha Khordha752050 India School of Minerals Metallurgical and Materials Engineering Indian Institute of Technology Bhubaneswar Odisha Khordha752050 India

ISBN: (纸本)9798331522445

3D NAND memory has become indispensable for high-density data storage, offering superior scalability and cost-efficiency. However, with shrinking memory cell sizes and increasing cell densities, precise control over fabrication parameters is crucial for optimal performance in advanced memory applications. The variability in string current is a significant concern for device performance and reliability. This paper employs Technology computer-aided design (TCAD) simulations to investigate the impact of the dimensional variations on the string current, which subsequently alters the critical electrical properties of 3D NAND flash memory cells. We investigate variations in cell spacing, tunneling and blocking oxide thickness and channel thickness, that result due to process variations during etching, deposition and lithography. Our study assesses the impact of these factors on critical performance metrics, including on-current (Ion), threshold voltage (Vth), maximum trans-conductance value (Gm) and sub-threshold slope (SS) of memory cells. The results indicate that changes in the plug depth have a negligible effect on the electrical parameters, while variations in cell spacing have a significant impact on these metrics. Under a worst-case 20% process variation in all dimensions, Ion, Vth}}, Gm and SS deviate by approximately 78%, 21%, 38% and 14%, respectively. These results emphasize the need for precise fabrication control and variability-aware design to maintain the reliability and efficiency of high-density 3D NAND memory in advanced applications. © 2025 ieee.

关键词： Threshold voltage

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ieee international conference on computer-aided design

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ieee design & Test of computers 1986年第2期3卷

Provides notice of upcoming conference events of interest to practitioners and researchers.

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ieee international conference on computer-aided design

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ieee design & Test of computers 1985年第4期2卷 100-100页

Provides a listing of upcoming conference events of interest to practitioners and researchers.

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IEEE/ACM International Conference on Computer-Aided Design, ...

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ieee/ACM international conference on computer-aided design, Digest of Technical Papers, ICCAD 2025年

作者： Xiong, Jinjun Department of Computer Science and Engineering University at Buffalo NY United States

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Proceedings - ieee international conference on computer aided design (ICCAD-85) [advertisement]

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ieee design & Test of computers 1986年第3期3卷 30-30页

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An Ensemble MLP-RF Model for the Prediction of DG-MOSFETs: Addressing Fabrication Process Variations 38

An Ensemble MLP-RF Model for the Prediction of DG-MOSFETs: A...

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38th international conference on VLSI design, VLSID 2025

作者： Muthuraman, Vaikunth Sehra, Khushwant Kumari, Vandana Saxena, Manoj College of Engineering Anna University Department of Computer Science and Engineering Guindy Chennai India University of Delhi Faculty of Technology Department of Electronics and Communication Engineering New Delhi110007 India Maharaja Agrasen College University of Delhi Department of Electronics New Delhi India Deen Dayal Upadhyaya College University of Delhi Department of Electronics New Delhi India

ISBN: (纸本)9798331522445

To improve the efficacy of semiconductor device characteristics prediction, this work proposes a machine learning (ML) model that can predict drain current, gate-source capacitance, and drain-gate capacitance. The model displays outstanding accuracy, thus, allowing for the prognosis of device characteristics with reliability. Compared to the simulations in Technology computer-aided design (TCAD), this ML approach can be considered a speedy alternative. To the best of the authors' knowledge, this manuscript specifically proposes a novel approach to utilize the MLP-RF (ensemble of multilayer perceptron (MLP) regressor and random forest (RF) regressor) model for Double-Gate MOSFET. The accuracy of the ensemble model is verified by calculating the mean squared error, root mean squared error, and mean coefficients of determination values. In addition, an MLP-RF classification model was implemented that would take, as input, characteristics of devices whose channel lengths are unknown and classify them into the most probable devices from a set of devices whose channel lengths are known thereby modeling the process variations during the fabrication process. The results thus encourage further interdisciplinary endeavors to benefit the semiconductor industry. © 2025 ieee.

关键词： MOSFET devices

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Multidimensional Load-Pull Extrapolation for Accelerated computer-aided design (CAD) Simulations

Multidimensional Load-Pull Extrapolation for Accelerated Com...

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2025 United States National Committee of URSI National Radio Science Meeting, USNC-URSI NRSM 2025

作者： Swindell, Jonathan E. Goad, Adam C. Egbert, Austin Latham, Casey Ozalas, Matthew Howard, Andy McClearnon, Daren Baylis, Charles Marks, Robert J. Baylor University WacoTX United States Keysight Technologies Santa RosaCA United States

ISBN: (纸本)9781946815200

computer-aided design (CAD) is widely used in the design and optimization of power amplifiers. Often CAD tasks require many simulations and the time required can be a limiting factor. Additionally, there are many difficulties with characterizing the behavior of high-power and high-frequency power amplifier devices. The work presented reduces the time required for CAD simulations and can use data collected from a device in a measurable region to approximate behavior under difficult-to-measure operating conditions. This work improves on the Wasserstein Generative Adversarial Network (WGAN) Load-Pull Extrapolation network trained for 2d load-pull extrapolation (A. Egbert, C. Baylis, and R. J. Marks, "Extrapolation of Load-Pull Data: A Novel Use of GAN Artificial Intelligence Image Completion, " ieee Transactions on Microwave Theory and Techniques, vol. 70, no. 11, pp. 4849-4856, Nov. 2022) and extends it to support a 3rd dimension, input power. This work can extrapolate as few as 16 simulation queries to 24, 176 output powers while predicting the optimal reflection coefficient over changing input power to within a median vector error of 0.1098. © 2025 USNC-URSI.

关键词： Extrapolation

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1984 ieee international conference on computer-aided design

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ieee design & Test of computers 1984年第1期1卷 70-70页

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers.

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Using Immersive Virtual Environments for Intercultural Learning Experiences 3

Using Immersive Virtual Environments for Intercultural Learn...

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3rd international conference on Intelligent and Innovative Technologies in Computing, Electrical and Electronics, IITCEE 2025

作者： Giri, Nandhini Purdue University Department of Computer Graphics Technology West LafayetteIN United States

ISBN: (纸本)9798331515911

This case study paper presents results from a pilot study to test the use of immersive virtual environments as a pre-departure training module in study abroad programs for intercultural learning experiences. Insights from the pilot study are used in developing a scenario-based immersive pre-departure training module for further testing and refinement. Study abroad programs introduce students to novel cultural experiences that lead to enriched learning experiences, friendships, and a lifetime of memories. Our study presents insights on the current student experiences in these programs and how immersive technologies can enhance their experiences through prior virtual cultural exposure and interactions. For the pilot study, six students from a computer graphics technology program who had previously enrolled in study abroad programs were recruited. Participants were guided through an exploratory tour of popular locations in Google earth VR. Once participants got comfortable using the VR headset and controller, they were asked to explore their prior study abroad destination and share their experiences in those foreign destinations. The VR session lasted for roughly 20 minutes followed by filling out a post-session questionnaire. The insights gained through this pilot study show that 1. Participants appreciated the visual immersion of the VR experience. However, participants preferred real-life experiences over virtual ones. They did see the VR module as preparation for real-world cultural exploration. 2. There was a lack of cultural interaction in the VR space. Participants valued experiences that help them better understand differences in the way of life and values of people, more than just viewing eye-catching monuments. These insights informed the design of a scenario-based immersive pre-departure training module in VR for students to explore virtual scenarios and encounters with cultural ambassadors in the foreign destination. © 2025 ieee.

关键词： Virtual environments

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Implantable Sinusoidal-Shaped Antenna for Body Centric Wireless Communication 4

Implantable Sinusoidal-Shaped Antenna for Body Centric Wirel...

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4th international conference on Robotics, Electrical and Signal Processing Techniques, ICREST 2025

作者： Arifur Rahman, H.M. Ishraq, Sadman Biswas, Kishor Ahmed, Md. Sibbir Ahasan, Sk Raziul Khan, Mohammad Monirujjaman North South University Department of Electrical and Computer Engineering Dhaka Bangladesh

ISBN: (纸本)9798331530938

This paper presents a unique design of an implantable antenna with a sinusoidal-shaped patch radiator that operates in the 2.4 GHz Industrial, Scientific, and Medical (ISM) band. To avoid discomfort for the subject, the substrate material has been chosen as a flexible one, Rogers RO3210, with a high dielectric constant of 10.8. The wavy shape and high relative permittivity aided in its miniaturization. A preliminary calculation conducted in free space results in an impedance bandwidth of 212 MHz and a return loss of over 21 dB around 2.41 GHz. In addition, an artificial human body model with layers of muscle, fat, and skin was created digitally, and the antenna was placed 4.2 mm within the muscle layer to do in-body analysis. In in-body circumstances, the antenna yields intriguing findings, similar to those observed in free space. The radiation pattern antenna performs well, and it might be used in implantable applications without a major divergence in characteristics like the reflection coefficient, gain, and directivity. The design could be a potential candidate for in-body applications under body centric wireless communication (BCWC). © 2025 ieee.

关键词： 2.4 GHz antenna implantable in-body ism band sinusoidal

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