The following topics are dealt: advanced transistor structure, architecture and process; RF & AMS; low power electronics; reliability; system level technology assessment; DFM/DFT/DFY/DFR; advanced memory devices; ...
The following topics are dealt: advanced transistor structure, architecture and process; RF & AMS; low power electronics; reliability; system level technology assessment; DFM/DFT/DFY/DFR; advanced memory devices; advanced materials; soft error rate; SoC/MPSoC/SIP, IC & platform design & process; and CAD.
conference proceedings front matter may contain various advertisements, welcome messages, committee or program information, and other miscellaneous conference information. This may in some cases also include the cover...
conference proceedings front matter may contain various advertisements, welcome messages, committee or program information, and other miscellaneous conference information. This may in some cases also include the cover art, table of contents, copyright statements, title-page or half title-pages, blank pages, venue maps or other general information relating to the conference that was part of the original conference proceedings.
The following topics are dealt with: microprocessor building blocks and clocking; advanced memory device technology; advanced IC design and integration; advanced materials; process induced damage; ultra-thin gate; des...
The following topics are dealt with: microprocessor building blocks and clocking; advanced memory device technology; advanced IC design and integration; advanced materials; process induced damage; ultra-thin gate; design for manufacturability and statistical approach; advanced transistor structure; low power and process monitoring.
To further enrich the experimental content of the Electronic Engineering Training course, a design scheme for a radio circuit based on the FT6088 chip is specifically proposed. The paper delves deep into the design ar...
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In this paper, a SiP integrateddesign of X-band phased array TR amplitude-phase multi-function chip and GaAs chip is carried out to achieve the purpose of miniaturization of the chip. In the layout of the substrate c...
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