This paper proposes a multi-sampling mode capacitor DAC (CDAC) for a 12-bit 200MS/s pipelined-SAR ADC, addressing the issue of overfitting in neural network-based calibrations. By implementing normal, offset, and prop...
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This paper presents the design of a monolithically integrated Gallium Nitride (GaN)-IC gate driver based on Enhancement-mode p-GaN HEMT technology. The design uses 650V GaN-on-SOI Process designing Kit (PDK). The desi...
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ISBN:
(纸本)9798350361766;9798350361759
This paper presents the design of a monolithically integrated Gallium Nitride (GaN)-IC gate driver based on Enhancement-mode p-GaN HEMT technology. The design uses 650V GaN-on-SOI Process designing Kit (PDK). The design complexity of this technology lies in the absence of p-type devices. Consequently, Resistor-Transistor Logic (RTL) inverters and Push-Pull Buffers are introduced instead of a complementary logic. To effectively handle the power device (650V/10A) switching, the gate driver is sized to achieve 7V in the output. To validate the performance of the proposed gate driver, transistor-level and post-layout simulations are carried out considering an input signal of 2MHz. Turn-on/turn-off time (3.77ns/2.32ns), overall circuit efficiency (99.3%) and temperature variation effects are analysed.
This paper presents an application-specific integratedcircuit (ASIC) front-end, to interface the printed capacitive sensors, using an amorphous Indium-Gallium-Zinc-Oxide (a-IGZO) thin film transistors (TFT) on flexib...
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ISBN:
(纸本)9798350383270;9798350383263
This paper presents an application-specific integratedcircuit (ASIC) front-end, to interface the printed capacitive sensors, using an amorphous Indium-Gallium-Zinc-Oxide (a-IGZO) thin film transistors (TFT) on flexible integratedcircuit (FlexIC) technology. A ring oscillator (RO) based front-end sensor interface is designed with 0.024 mm(2) area using 600 nm channel length of n-type TFTs consuming 183 nW at a supply voltage of 1 V. It generates output frequency sensitive to the change in the input capacitance of the printed coplanar sensor introduced by the moisture variations. Measurement results show that the front-end ASIC can detect the change in capacitance from 10 pF up to 500 pF of the printed coplanar sensor making it suitable not only for moisture detection but also for the evaluation of voided liquid volumes inside diapers to realize economical, disposable and battery-less Internet of Things (IoT) sensor nodes using green energy harvested from urine.
In this paper, modeling and parameter extraction of semiconductor devices for simulation and design optimization of ESD protection circuits on BCD technologies were discussed. Concepts on developing optimal and advanc...
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To further enrich the experimental content of the Electronic Engineering Training course, a design scheme for a radio circuit based on the FT6088 chip is specifically proposed. The paper delves deep into the design ar...
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Customary low-voltage circuit breakers lack integrated chips, making them challenging to enhance with smart capabilities. However, with advancements in chip and data technology, it's now possible to incorporate el...
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This paper presents an innovative approach to sustainable circuitdesign through the development of recyclable printed circuit boards (PCBs). The proposed method involves the direct printing of circuits onto biodegrad...
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ISBN:
(纸本)9798331529475;9798331529468
This paper presents an innovative approach to sustainable circuitdesign through the development of recyclable printed circuit boards (PCBs). The proposed method involves the direct printing of circuits onto biodegradable substrates using a silver-based ink, followed by the integration of components via Ultra Precise Deposition (UPD) for fine wire interconnection of integratedcircuits (ICs). This technique facilitates the assembly of a comprehensive Bipolar Junction Transistor (BJT) circuit. Notably, the circuit incorporates a touch sensor-fabricated using the same silver ink-that modulates the luminance of a surface-mount light-emitting diode (LED). This design not only prioritizes sustainability by ensuring the recyclability of the PCB substrates but also extends to the electronic components and the conductive silver tracks. The approach significantly advances sustainable practices in electronics manufacturing, enabling the complete recycling of all constituent components.
A novel design method of voltage-controlled ring oscillator (VCRO) based on back-gate bias using fully depleted silicon-on-insulator (FDSOI) technology is proposed. This work compares it with traditional front-gate bi...
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Benefiting from the high carrier mobility, the two-dimensional (2D) material borophene is promising to be used in high-speed applications. This paper investigates entirely the I/V characteristics of a borophene field-...
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Voltage reference circuits are crucial for any mixed-signal circuits, providing PVT (Process, Voltage, Temperature) robust output for the system's stability and accuracy. This paper presents a novel voltage refere...
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ISBN:
(纸本)9798350383270;9798350383263
Voltage reference circuits are crucial for any mixed-signal circuits, providing PVT (Process, Voltage, Temperature) robust output for the system's stability and accuracy. This paper presents a novel voltage reference circuit implemented in an indium gallium zinc oxide (IGZO) based thin film transistors (TFT) technology, proposing for the first time a sub-nanowatt, area-efficient circuit realized with only a single N-type TFT in a 600 nm technology. The design occupies a minimal area of 27x37 mu m(2), operates across a broad supply voltage range from 0.5 V to 3 V, and maintains functionality from 0 degrees C to 100 degrees C. The circuit has an ultra-low power consumption between 0.75 nW to 1.2 nW while achieving an output voltage of 454 mV with a temperature coefficient (TC) as low as 28.9 ppm/degrees C. The simulated results, which include process variation, temperature dependence, line sensitivity and power supply rejection ratio measurements, underline the circuit's potential for high-efficiency, low-power applications in next-generation flexible electronics.
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