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Silicon Carbide Technology of MESFET-Based Power Integrated circuits

ieee journal OF emerging AND selected topics IN POWER ELECTRONICS 2018年第2期6卷 539-548页

作者： Mogniotte, Jean-Francois Tournier, Dominique Raynaud, Christophe Lazar, Mihai Planson, Dominique Allard, Bruno Univ Lyon INSA Lyon ESTA Sch Business & Technol AMPERE UMR5005CNRS F-69121 Lyon France Univ Lyon CNRS AMPERE UMR5005 INSA Lyon F-69121 Lyon France

This paper presents the start development of a design kit for an innovative technology based on the same lateral topology and the same substrate, which is a dual-gate SiC MESFET. From the electrical characteristic of an initial dual-gate MESFETs, a SPICE model of this device has been established. This model allows developing by simulating a design kit of three devices, which are, respectively, a signal MESFET, a buffer MESFET, and a power MESFET. The signal MESFETs are dedicated to the signal command shaping. The buffer MESFETs would be used as current buffer in the driver circuit for supplying the gate electrode of the power switches. The power MESFETs would be used as power switches. The electrical measurements validate the feasibility of this technology. The characterizations have shown that the technology is operational, and the three devices present the considered electrical behavior. The contact resistance technology must be improved for optimizing the electrical performances. The devices will be used for the design of electronic functions (e.g., ring oscillator and totem pole) in the purpose to consider a full integrated driver in SiC, which could operate in harsh environments.

关键词： Boost integrated circuit integrated power converter MESFET silicon carbide SPICE

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On the Use of the Intrinsic Ripple of a Buck Converter for Visible Light Communication in LED Drivers

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ieee journal OF emerging AND selected topics IN POWER ELECTRONICS 2018年第3期6卷 1235-1245页

作者： Loose, Felipe Teixeira, Lucas Duarte, Renan R. Dalla Costa, Marco A. Barriquello, Carlos H. Univ Fed Santa Maria BR-97105900 Santa Maria RS Brazil

In this paper, we present the analysis of a novel technique to implement visible light communication (VLC) into light emitting diode (LED) drivers with minimum hardware requirements and efficacy degradation. It uses a synchronous buck converter as a circuit for a dual-purpose LED driver for illumination and VLC. The role of the converter is to regulate the average current via the duty cycle value for lighting purposes and to modulate digital data through the phase of its ripple waveform. In this technique, the phase of the pulsewidth modulator acts as an independent variable to modulate the ripple waveform for a binary phase-shift keying modulation and does not affect lighting regulation. Thus, the transmission of wireless digital data uses the remaining ac content present in the waveform of the ripple. By detecting the phase of the ripple, a VLC receiver can decode the data sent by the transmitter. Finally, our experimental results show that the efficacy of the LED is not affected by the value of the ripple when operating outside its nonlinear region, along with minimum global efficacy degradation when compared with a standard synchronous buck converter with the same parameters and no VLC capabilities.

关键词： Digital communication driver circuits light emitting diode (LED) lamps power electronics

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Integrated Silicon Photonic Microresonators: emerging Technologies

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ieee journal OF selected topics IN QUANTUM ELECTRONICS 2018年第6期24卷 1-24页

作者： Yao, Zhanshi Wu, Kaiyi Tan, Bo Xue Wang, Jiawei Li, Yu Zhang, Yu Poon, Andrew W. Hong Kong Univ Sci & Technol Dept Elect & Comp Engn Photon Device Lab Clear Water Bay Hong Kong Peoples R China Inst Integrat Nanosci D-01069 Dresden Germany ASTAR Inst Microelect Singapore 117685 Singapore Univ Calif Davis Dept Elect & Comp Engn Davis CA 95616 USA

Silicon photonics is becoming the leading technology for photonic integrated circuits (PICs) due to large-scale integration, low cost, and high-volume productions enabled by complementary metal-oxide-semiconductor (CMOS) fabrication process. Thanks to various material and optical characteristics of crystalline silicon, the silicon-on-insulator platform has become the dominant material platform for silicon photonics. Meanwhile, monolithic or heterogeneous integration of other materials on silicon photonic chips, including the silicon nitride (SiN)-on-insulator platform and the III-V-on-silicon platform, are under rapid developments to enhance the functionalities of silicon photonics. Among the myriad of silicon photonic structures for passive and active components, integrated microresonators are promising for a broad range of applications due to their strong resonance field enhancement, narrowband wavelength selectivity, and compact footprints. In this paper, we review the state of the art and our perspectives on emerging technologies based on integrated silicon photonic microresonators in the technology domains of intradatacenter optical interconnects, integrated nonlinear and quantum photonics, and lab-on-a-chip optical biosensing. We specifically review recent progress and our original work in SOI microring-based crossbar switch fabrics;III-V-on-silicon microresonator lasers;silicon-based microresonator nonlinear and quantum sources;and SiN microresonator-based optical biosensors.

关键词： Integrated lasers integrated photonics microresonators optical biosensing optical interconnects quantum photonics silicon photonics switch fabrics optical transmitters

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A Reconfigurable Multimode Demultiplexer/Switch for Mode-Multiplexed Silicon Photonics Interconnects

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ieee journal OF selected topics IN QUANTUM ELECTRONICS 2018年第6期24卷 1-10页

作者： Priti, Rubana B. Liboiron-Ladouceur, Odile McGill Univ Dept Elect & Comp Engn Montreal PQ H3E 0E9 Canada

We experimentally demonstrate a scalable and broad-band reconfigurable multimode demultiplexer/switch (RMDS) for mode-division multiplexed inter-and intra-chip data communication systems. The RMDS exploits a thermo-optically tuned tapered multimode interference coupler, enabling simultaneous transmission of the fundamental and first order quasi transverse electric modes in C-band. It is used as the building block in a mode demultiplexer with-20 dB crosstalk, which can be reconfigured as a mode selecting switch with 10.9 mu s switching time. An aggregated bandwidth of 2 x 10 Gb/s is achieved by the parallel transmission of two nonreturn-to-Zero (NRZ) PRBS31 data signals at 10(-12) bit-error-rate with 2.8 dB BER power penalty. A 1.55 pJ/bit energy efficiency is estimated for a proposed multimode optical link.

关键词： Silicon photonics Photonic integrated circuits Optical packet switching Optical interconnections

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Wideband N-Beam Arrays Using Low-Complexity Algorithms and Mixed-Signal Integrated circuits

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ieee journal OF selected topics IN SIGNAL PROCESSING 2018年第2期12卷 368-382页

作者： Perera, Sirani M. Ariyarathna, Viduneth Udayanga, Nilan Madanayake, Arjuna Wu, Ge Belostotski, Leonid Wang, Yingying Mandal, Soumyajit Cintra, Renato J. Rappaport, Theodore S. Embry Riddle Aeronaut Univ Dept Math Daytona Beach FL 32114 USA Univ Akron Dept Elect & Comp Engn Akron OH 44325 USA Univ Calgary Dept Elect & Comp Engn Calgary AB T2N 1N4 Canada Case Western Reserve Univ Dept Elect Engn & Comp Sci Cleveland OH 44106 USA Univ Fed Pernambuco Dept Estat Signal Proc Grp BR-50670901 Recife PE Brazil Univ Calgary Dept Elect & Comp Engn Calgary AB Canada NYU NYU WIRELESS Dept Elect & Comp Engn New York NY 10003 USA

This paper proposes a low-complexity wideband beamforming subarray for millimeter wave (mmW) 5G wireless communications. The multibeam subarray is based on using a novel delay Vandermonde matrix (DVM) algorithm to efficiently generate analog true-time-delay beams that have no beam squint. A factorization for the DVM leading to low-complexity analog realizations is provided and complexity analysis for real and complex inputs is derived. The DVM is a special case of a Vandermonde matrix but with complex nodes that lack any special properties (unlike the discrete Fourier transform matrix). Error bounds for the DVM are established and then analyzed for numerical stability. Mixed-signal CMOS integrated circuits designs are proposed for the implementation of DVM multibeam algorithms along with low-complexity digital realizations to achieve hybrid beamforming for mmW applications. Analog-digital hybrid mmW multibeam beamforming circuits and systems are designed, for example, with eight beams at 28 GHz and simulated in cadence for functional verification.

关键词： Delay Vandermonde matrix wideband beam-forming low-complexity algorithm 5G multibeam arrays

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Monolithic 300 Gb/s Parallel Transmitter in InP-Based Generic Photonic Integration Technology

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ieee journal OF selected topics IN QUANTUM ELECTRONICS 2018年第1期24卷 1-11页

作者： Yao, Weiming Smit, Meint K. Wale, Michael J. Tech Univ Eindhoven Dept Elect Engn NL-5612 AZ Eindhoven Netherlands

In order to meet the constantly rising traffic demands in optical transport systems for data and telecommunications, compact, power efficient, and low-cost optical transmitters are needed that offer easy scalability toward higher transmission capacities. Photonic integrated circuit technology based on the InP material has long enabled the monolithic integration of tunable sources with modulators and opened the way toward large-scale wavelength-division multiplexed parallel transmitters. In this paper, we present the design and performance of a monolithic tunable 8 x 40 Gb/s parallel transmitter chip with more than 220 components and state-of-the-art capacity density metric. A generic photonic integration approach was followed, in which the transmitter is constituted from well-developed subcircuits and building blocks, facilitating its design and manufacturing. With the trend toward large-scale integration with increasing component densities and smaller chip sizes, proximity effects in form of crosstalk are limiting further miniaturization efforts. We analyze electrical, thermal, and optical crosstalk effects that are relevant to the transmitter design, discuss appropriate mitigation techniques, and indicate the limitations of the current technology.

关键词： Photonic integrated circuits optoelectronics tunable transmitter WDM transmitter

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ieee circuits and systems Society Information

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ieee journal on emerging and selected topics in circuits and systems 2019年第4期9卷 C3-C3页

Provides a listing of current committee members and society officers.

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ieee circuits and systems Society Information

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ieee journal on emerging and selected topics in circuits and systems 2019年第1期9卷 C3-C3页

Provides a listing of current committee members and society officers.

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Flexible Hybrid Electronic circuits and systems

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ieee journal on emerging and selected topics in circuits and systems 2017年第1期7卷 27-37页

作者： Schwartz, David E. Rivnay, Jonathan Whiting, Gregory L. Mei, Ping Zhang, Yong Krusor, Brent Kor, Sivkheng Daniel, George Ready, Steve E. Veres, Janos Street, Robert A. Palo Alto Res Ctr Palo Alto CA 94304 USA

Printed organic electronics are being explored for a wide range of possible applications, with much of the current focus on smart labels, wearables, health monitoring, sensors and displays. These applications typically integrate various types of sensors and often include silicon integrated circuits (IC) for computation and wireless communications. Organic thin film transistors (TFT), particularly when printed, have performance and yield limitations that must be accommodated by the circuit design. The circuit design also needs to select sensor technology, ICs and other circuit elements to integrate with the TFTs and match the functional and performance requirements of the application. This paper describes organic TFT properties and strategies for circuit and sensor design, with examples from various sensor systems.

关键词： Hybrid circuits organic transistors printed electronics.

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Advanced Baseband Processing circuits and systems for 5G Communications

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ieee journal on emerging and selected topics in circuits and systems 2017年第4期7卷 473-476页

作者： Zhang, Chuan Huang, Yuan-Hao Sheikh, Farhana Wang, Zhongfeng Southeast Univ Natl Mobile Commun Res Lab Nanjing 210096 Jiangsu Peoples R China Natl Tsing Hua Univ Inst Commun Engn Dept Elect Engn Hsinchu 30013 Taiwan Intel Corp Circuit Res Lab Intel Labs Hillsboro OR 97124 USA Nanjing Univ Sch Elect Sci & Engn Nanjing 210046 Jiangsu Peoples R China

This special issue of the ieee journal on emerging and selected topics in circuits and systems (JETCAS) aims at demonstrating the latest research progress on circuits and systems design for efficient baseband realizat... 详细信息

关键词： Special issues and sections Baseband 5G mobile communication Signal processing algorithms MIMO Signal processing Wireless communication

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