This book contains revised contributions by the speakers of the 1st ieee Workshop on Wireless Communication circuits and systems, held in Lucerne, Switzerland, from June 22-24, 1998. The aim of the workshop was to dem...
ISBN:
(纸本)9781441949592
This book contains revised contributions by the speakers of the 1st ieee Workshop on Wireless Communication circuits and systems, held in Lucerne, Switzerland, from June 22-24, 1998. The aim of the workshop was to demonstrate the vast expertise of the CAS Society in the area of circuit and system design to the rapidly growing field of wireless communications. The workshop combined presentations by invited experts from academia and industry with panel and informal discussions. The following topics were covered: RF System Integration (single-chip systems, CMOS RF circuits), RF Front-End circuits (CMOS RF oscillators, broadband design techniques), Wideband Conversion for Software Radio (A/D conversion issues, wideband sub-sampling, low-spurious A/D conversion), Process Technologies for Future RF systems (Si, SiGe, GaAs, CMOS, packaging technologies), DSP for Wireless Communications (DSP algorithms, fixed-point systems, DSP for baseband applications), Blind Channel Equalization (adaptive interference suppression, design techniques, channel estimation). A carefully selected combination of tutorial-like papers as well as papers on specialized and advanced topics is included. Thus, newcomers to the field of wireless communications will benefit from the overview of emerging technologies in circuits and systems, and specialists will benefit from the thought-provoking details presented in this book.
Modeling of waveguide junctions using transmission lines and lumped circuit elements is common practice in microwave networks. By the help of the scattering matrix formalism, it is possible to describe junction effect...
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Modeling of waveguide junctions using transmission lines and lumped circuit elements is common practice in microwave networks. By the help of the scattering matrix formalism, it is possible to describe junction effects in a very concise way. Such a representation is crucial for the design of complex systems containing many interacting parts. Using scattering matrices, we characterize symmetric junctions between 2-D metal-insulator-metal (MINI) waveguides with optical signals at infrared frequencies (1550 nm) propagating in them. We verify our characterization by perfectly matching a wavelength-sized MIM waveguide to a subwavelength-sized one using a Smith chart. We then map the scattering matrix description to an equivalent lumped circuit representation and discuss the physical significance of its elements. We show that the simplified characteristic impedance model is appropriate for the deep subwavelength regime. The scattering matrix model for the MIM junctions leads to simplified analysis that can be integrated into circuit modeling software packages, such as SPICE.
An introduction to the special issue on the ieee 2007 custom integrated circuits conference is presented. The special Issue of the ieeejournal OF SOLID-STATE circuits is a selection of papers published in the ieee 20...
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An introduction to the special issue on the ieee 2007 custom integrated circuits conference is presented. The special Issue of the ieeejournal OF SOLID-STATE circuits is a selection of papers published in the ieee 2007 Custom Integrated circuits Conference (CICC). The issue consists of 14 papers that cover a wide range of technical areas, including wireless and RF circuit design, mixed-signal and analog design, digital IC design, integrated power regulation, memory design and biological applications of IC technology. The selected papers demonstrate state-of-the-art performance in power, area, or integration along with innovative circuit implementations and techniques. The first paper in this special issue relates to the emerging area of millimeter-wave CMOS circuits. The next paper, by Locher et al., presents a direct conversion transceiver IC for the WiBro/WiMAX standards, incorporating MIMO/diversity techniques.
The state-of-the-art of the development and fabrication of advanced 1.55-mu m/40-GHz pulse laser modules with a monolithic InP-based mode-locked distributed Bragg reflector (DBR) MQW laser chip inside is reported, wit...
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The state-of-the-art of the development and fabrication of advanced 1.55-mu m/40-GHz pulse laser modules with a monolithic InP-based mode-locked distributed Bragg reflector (DBR) MQW laser chip inside is reported, with respect to the future applications in high-speed optical communications. We emphasize the latest improvements for hybrid mode-locked devices, which integrate a saturable absorber or an electroabsorption modulator. We further illustrate different technical approaches that enable meeting predetermined frequencies and wavelengths, and which are at the same time promising with respect to high fabrication yields.
An overview of commercially available large-scale photonic integrated circuits (PICs) in indium phosphide is provided. Results of 100-Gb/s PICs that are field-deployed in wavelength-division-multiplexing (WDM) network...
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An overview of commercially available large-scale photonic integrated circuits (PICs) in indium phosphide is provided. Results of 100-Gb/s PICs that are field-deployed in wavelength-division-multiplexing (WDM) networks is provided, along with development results showing scaling of both channel count and channel bit rate to implement next-generation PICs with an aggregate capacity of 1.6 Tb/s. Use of PIC-enabled WDM systems allows affordable optical-electrical-optical (OEO) conversion and the implementation of "digital" optical networks with enhanced sub-wavelength reconfigurable bandwidth management, digital performance monitoring, and protection features. PICs will enable the continued capacity scaling required for next-generation IP core networks and support of high-bandwith 40-G and 100-GbE service connectivity between core routers.
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