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To develop high-peak-power ultrashort pulse laser systems in the ultraviolet region, a large Ce/sup 3+/:LiCaAlF/sub 6/ (Ce:LiCAF) crystal, a tunable ultraviolet laser medium with large saturation fluence and broad gai...
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To develop high-peak-power ultrashort pulse laser systems in the ultraviolet region, a large Ce/sup 3+/:LiCaAlF/sub 6/ (Ce:LiCAF) crystal, a tunable ultraviolet laser medium with large saturation fluence and broad gain spectrum width, was grown successfully with a diameter of more than 70 mm. To demonstrate high small signal gain, a four-pass confocal amplifier with 60 dB gain and 54 /spl mu/J output energy was constructed. Chirped pulse amplification (CPA) in the ultraviolet region was demonstrated using Ce:LiCAF for higher energy extraction. A modified bow-tie-style four-pass amplifier pumped by 100-mJ 266-nm 10-Hz pulses from a Q-switched Nd:YAG laser had 370-times gain and delivered 6-mJ 290-nm pulses. After dispersion compensation, the output pulses can be compressed down to 115 fs. This is the first ultraviolet, all-solid-state high-peak-power CPA laser system using ultraviolet gain media, and this demonstration shows further scalability of the Ce:LiCAF CPA system. Additionally, a new gain medium, Ce/sup 3+/:LiSr/sub 0.8/Ca/sub 0.2/AlF/sub 6/, with longer fluorescence lifetime and sufficient gain spectrum width over 18 nm was grown to upgrade this system as a candidate for a final power amplifier gain module.
The ieeejournal of selectedtopics in Quantum Electronics (JSTQE) invites manuscript submissions in the area of Silicon Photonics. Silicon photonics has been the subject of intense research activity in both industry ...
The ieeejournal of selectedtopics in Quantum Electronics (JSTQE) invites manuscript submissions in the area of Silicon Photonics. Silicon photonics has been the subject of intense research activity in both industry and academia as a compelling technology paving the way for next generation energy-efficient high-speed computing, information processing and communications systems. The trend is to use optics in intimate proximity to electronic circuits, which implies a high level of optoelectronic integration. This evolution towards silicon-based technologies is largely based on the vision that silicon provides a mature integration platform supported by the enormous existing CMOS manufacturing infrastructure which can be used to cost-effectively produce integrated optoelectronic circuits for a wide range of applications. The deadline for submission of manuscripts is October 1, 2013.
In the above article [1] , according to our institution, the text in project funding (bottom left on the first page) requires a minor modification. The following text:
In the above article [1] , according to our institution, the text in project funding (bottom left on the first page) requires a minor modification. The following text:
A successful design, fabrication and test of silicon photonic circuits requires design tools, process design kits (PDKs), foundries for fabrication, and test facilities. This paper describes the complete design flow o...
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A successful design, fabrication and test of silicon photonic circuits requires design tools, process design kits (PDKs), foundries for fabrication, and test facilities. This paper describes the complete design flow of photonic circuits using rapid-prototyping multiproject wafer foundry processes available in the SiEPIC program. The focus of this paper is on rapid prototyping based on electron beam lithography as an alternative and complementary to what is available via deep-UV lithography-based foundries. We describe in detail the PDK and the use of open-source and commercial tools for the design of optical filters, sensors, neuromorphic photonic processors, optical switches, and discuss test and packaging approaches for these designs. We demonstrate that a "germanium less" process can be used to build small systems featuring photoconductive detectors, electronics, and phase shifters.
This paper demonstrates how the PIXAPP Photonics Packaging Pilot Line uses its extensive packaging capabilities across its European partner network to design and assemble a highly integrated silicon photonic-based opt...
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This paper demonstrates how the PIXAPP Photonics Packaging Pilot Line uses its extensive packaging capabilities across its European partner network to design and assemble a highly integrated silicon photonic-based optical transceiver. The processes used are based on PIXAPP's open access packaging design rules or Assembly Design Kit (ADK). The transceiver was designed to have the Tx and Rx elements integrated on to a single silicon photonic chip, together with flipchip control electronics, hybrid laser and micro-optics. The transceiver used the on-chip micro-optics to enable a pluggable fiber connection, avoiding the need to bond optical fibers directly to the photonic chip. Finally, the packaged transceiver module was tested, showing 56 Gb/s loop-back modulation and de-modulation, validating both the transmitter and receiver performance.
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