An analytic approach to the design of high efficiency tuned power oscillator is presented. By employing large-signal S-parameters, theoretical conditions for optimum operation of the oscillator have been formulated an...
详细信息
An analytic approach to the design of high efficiency tuned power oscillator is presented. By employing large-signal S-parameters, theoretical conditions for optimum operation of the oscillator have been formulated and discussed. Loss due to non-zero switching time, saturation resistance etc of the transistor employed will be accounted for. Various oscillators at 900MHz were designed using the derived theory. Experimental results showed that the measured data are in good agreement with the predicted data.
The demand for increasing miniaturization of electronicsystems enforces component manufacturers to develop new generations of small-sized components to cope with the required high component density. Reducing the size...
详细信息
The demand for increasing miniaturization of electronicsystems enforces component manufacturers to develop new generations of small-sized components to cope with the required high component density. Reducing the size of individual components beyond the 0402 size seems not to be the best solution, as further miniaturization is limited by interconnection and placement requirements. In the design of ceramic multicomponent modules (CMM's), a different approach is followed. Employing well-accepted technologies, based on a high quality ceramic multilayer technology and thick- (or thin-) film resistor networks, customer specific modules are realized through the integration of capacitors and resistors into a single ceramic module. In addition, active elements can be mounted on top. In this way a high density of (passive) functions can be obtained in an easy mountable package. The CMM concept will be explained. In addition, the possibilities for miniaturization are addressed. Furthermore, the aspect of interconnecting the CMM to the printed circuit board (PCB) will be discussed.
A front-end transimpedance amplifier for an optical receiver is designed, fabricated through MOSIS 1.2μm digital CMOS foundry, and tested. The amplifier meets the specification of FDDI physical layer. Test shows that...
详细信息
A front-end transimpedance amplifier for an optical receiver is designed, fabricated through MOSIS 1.2μm digital CMOS foundry, and tested. The amplifier meets the specification of FDDI physical layer. Test shows that the bandwidth of the circuit is more than 100MHz and overall transimpedance gain is about 10,000Ω with 50Ω load resistor. Power dissipation is about 20mW.
In this paper the effects of thermal noise in transistors on timing jitter in CMOS ring-oscillators composed of source-coupled differential resistively-loaded delay cells is investigated. The relationship between dela...
详细信息
In this paper the effects of thermal noise in transistors on timing jitter in CMOS ring-oscillators composed of source-coupled differential resistively-loaded delay cells is investigated. The relationship between delay element design parameters and the inherent thermal noise-induced jitter of the generated waveform are analyzed. These results are compared with simulated results from a Monte Carlo analysis with good agreement. The analysis shows that timing jitter is inversely proportional to the square root of the total capacitance at the output of each inverter, and inversely proportional to the gate-source bias voltage above threshold of the source-coupled devices in the balanced state. Furthermore, these dependencies imply an inverse relationship between jitter and power consumption for an oscillator with fixed output period. Phase noise and timing jitter performance are predicted to improve at a rate of 10 dB per decade increase in power consumption.
The engineering of power electronicsystems has become a mature art. Reliability and lifetime cost predictions are usually required, with increasingly high standards. To be competitive, safety margins to cover ignoron...
详细信息
Almost 30-50% of fabrication costs in electronics production are caused by testing and repair operations. The reasons for that problem are many. First of all, there is still a lack of knowledge concerning the conditio...
详细信息
Almost 30-50% of fabrication costs in electronics production are caused by testing and repair operations. The reasons for that problem are many. First of all, there is still a lack of knowledge concerning the conditions for robust process control. On the other hand. uncertain specification of product quality causes unnecessary inspection, testing, and repair actions. Thus, a strategy for yield improvement requires strong dedication to causal relationships and specification of process and product quality. In the first step, critical process parameters and their causal effects on product quality must be analyzed. In the second step, once critical process parameter are addressed, control strategies can be developed to assure high first pass yields. This paper gives an overview of ongoing work that has been performed to establish a SMT production line with closed loop quality control via direct process monitoring capabilities and integrated inspection operations. For different inspection tasks, 3-D laser and x-ray inspect on is applied. Process parameters as well as test and inspection results are gathered on line. Thus, interrelationships between different process steps, beginning from material inspection, solder paste application, components placement, reflow soldering, and final inspection, can be analyzed. Moreover, variation of process parameters conforming to different approaches to design of experiments (DOE) can be performed while running production. On-line diagnosis of process parameters and inspection results enables a closed loop quality control.
Tools which permit the synthesis of hardware from high-level specifications are vital for reliable design on an acceptable timescale, and are opening up exciting possibilities in the use of custom coprocessors, rapid ...
详细信息
Tools which permit the synthesis of hardware from high-level specifications are vital for reliable design on an acceptable timescale, and are opening up exciting possibilities in the use of custom coprocessors, rapid prototyping and the design of flexible mixed hardware-software systems. We are exploring a method for the translation of standard ADA code into hardware, by compiling ADA into a standard HDL format which can be synthesised by existing commercial packages. This paper sets out our approach of using an Intermediate Table Format (ITF) for high-level transformations and compilation into synthesisable HDL code.< >
A new way of implementing a cellular neural network cell using simple differential stages is described. Also some aspects for implementing associative memory with this new structure are discussed.
A new way of implementing a cellular neural network cell using simple differential stages is described. Also some aspects for implementing associative memory with this new structure are discussed.< >
This paper describes the theoretical basis for a design methodology which enables control of the fundamental tradeoff between speed, dynamic range, and power consumption in switched current cells. The presented method...
详细信息
This paper describes the theoretical basis for a design methodology which enables control of the fundamental tradeoff between speed, dynamic range, and power consumption in switched current cells. The presented methods are applied to the design of a very high dynamic range current memory cell and simulation results are given.< >
A new hybrid design approach for high frequency, high gain transconductors is proposed. The idea is based upon the combination of FETs and optical devices. Measured results of a high frequency high Q active filter and...
详细信息
A new hybrid design approach for high frequency, high gain transconductors is proposed. The idea is based upon the combination of FETs and optical devices. Measured results of a high frequency high Q active filter and a high DC gain FET operational amplifier are presented, employing the optoelectronic approach.< >
暂无评论