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Analysis and design of a novel microstrip-to-waveguide transition/combiner

Analysis and design of a novel microstrip-to-waveguide trans...

引用

Microwave, MTT-S International symposium

作者： D.I. Stones TRW Electronic Systems Group Redondo Beach CA USA

This paper describes the analysis and design of a microstrip-to-waveguide transition/combiner that is eminently suitable for millimeter wave power amplifier application. Analytical and experimental work at Ka band on a two-way combiner showed an insertion loss of 0.5 dB. The port VSWR's were less than 1.6:1 and the input-to-input port isolation was greater than 16 dB over a 3 GHz band. This novel design is highly manufacturable and compatible with integration of monolithic amplifiers and other circuits.< >

关键词： Microstrip Power amplifiers Insertion loss Integrated circuit manufacture

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Rapid prototyping using laser created interconnects

Rapid prototyping using laser created interconnects

引用

ieee/CHMT(CPMT) International electronics Manufacturing Technology symposium

作者： R. Lee W. Moreno N. Saini Center for Microelectronics Research University of South Florida Tampa FL USA

The Laser Restructuring Laboratory at the Center for Microelectronics Research (CMR) has pursued rapid prototyping technologies for electronic systems using novel laser restructuring techniques. Laser restructuring of electronic circuits offers great potential for a low-cost, quick turn around alternative to customized product verification before commitment to mass production. Laser created interconnects in integrated circuits (ICs) at the wafer or packaged chip level is accomplished by creating low electrical resistance links between conductor lines. The primary focus of this paper is to report a new interconnect that has been developed at CMR. This new interconnect has the potential for not only quick prototyping of electronics circuit applications but also for substrate level interconnect routing in multichip modules. The developed laser vertical link (LVL), the 4/sub -/2 LVL, has resistance values below 5 /spl Omega/ and shows no leakage to substrate after laser processing. A new test chip TC8.1 was designed at CMR and fabricated with 7 different viable interconnects. The test structures were designed with four point probe capabilities for accurate resistance measurements. Using design of Experiment techniques supported by statistical data analysis this interconnect was studied. The optimum set of laser parameters were arrived at by optimizing the statistical model. Results of the full characterization of this interconnect are presented.< >

关键词： Prototypes Integrated circuit interconnections electronic circuits Laboratories Microelectronics Integrated circuit technology Mass production electronics packaging Integrated circuit packaging Electric resistance

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An efficient VLSI implementation of vector-radix 2-D DCT using mesh-connected 2-D array

An efficient VLSI implementation of vector-radix 2-D DCT usi...

引用

ieee International symposium on circuits and systems (ISCAS)

作者： Kyung-Wook Shin Heung-Woo Jeon Yong-Seum Kang Department of Electronic Engineering Kum-Oh National University of Technology Kumi South Korea

This paper describes an efficient array algorithm for parallel computation of vector-radix two-dimensional (2-D) discrete cosine transform (VR-DCT), and its VLSI implementation. By mapping the 2-D VR-DCT onto a 2-D array of processing elements (PEs), the DCT is efficiently computed with high concurrency and local data exchanges between PEs. The proposed array algorithm features architectural modularity, regularity and locality, so that it is very suitable for VLSI realization. Also, no transposition memory is required. It has the time complexity of O(N+N/sub NZD//spl middot/log/sub 2/N) for (N/spl times/N) 2-D DCT, where N/sub NZD/ is the number of non-zero digits in the canonic-signed digit (CSD) representation of DCT kernel. Based on the proposed array algorithm, an array processor for (8/spl times/8) 2-D DCT is designed using 1.5 /spl mu/m double metal CMOS technology. From simulation results, it is estimated that (8/spl times/8) 2-D DCT (with N/sub NZD/=4) can be computed in about 0.88 /spl mu/sec at 50 MHz clock frequency, resulting in the throughput rate of about 72 Mega pixels/sec.< >

关键词： Very large scale integration Discrete cosine transforms Concurrent computing CMOS technology Frequency estimation Two dimensional displays Kernel Algorithm design and analysis CMOS process Computational modeling

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Dual-use manufacturing at HE Microwave

Dual-use manufacturing at HE Microwave

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Microwave, MTT-S International symposium

作者： J.J. Owens H E Microwave Corporation Tucson AZ USA

HE Microwave was formed in July 1990 as a joint venture between Hughes Aircraft and Delco electronics, to design and build radar modules for military and commercial applications. Its products are small electronics "modules" containing microwave substrates loaded with electronic components such as integrated circuits. Located in Tucson, Arizona, HE Microwave has established a flexible manufacturing facility capable of building commercial and military modules with equal ease. Automotive collision avoidance systems have been developed using military radar technology, while T/R modules for phased array military radar have benefited from commercial manufacturing methodology. Taken together, HE Microwave is a prime example of the successful implementation of dual-use manufacturing.< >

关键词： Manufacturing Helium Aerospace electronics Military aircraft Phased arrays International collaboration Aircraft manufacture Airborne radar Radar applications electronic components

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A gripper and sensor system for controlled slip and force

A gripper and sensor system for controlled slip and force

引用

ieee International symposium on Industrial electronics (ISIE)

作者： A. Rupp S.A. Velastin Department of Electronic and Electrical Engineering King''s College London UK

The paper describes the development of a robot gripper, sensors and associated electronics suitable for controlling slippage and contact force. A typical application is the handling of glass test tubes in an automated medical analysis laboratory. Through force control, the gripper first holds an object, then repeatedly releases and regrasps it for controlled slip. The basic mechanical principle consists of a rolling cylinder in direct contact with the (cylindrical) object, forming a cylinder-cylinder pivot with 5 degrees of freedom. A stable grasp is achieved by a finger/counter-finger arrangement with 3 contact points. In the left finger, contact force is reflected in the pivots of the roll and measured by piezoresistive force sensors. In the right finger, motion is measured by optical encoders. Analog electronics deal with gripper motor control and signal processing for the force sensors. Digital circuits handle the motion measurement from the optical encoders, A/D conversion of force sensor outputs and force feedback for motor control and communications with an external computer. The proposed design has been built and tested using an industrial SCARA robot.< >

关键词： Force control Grippers Sensor systems Control systems Force sensors Automatic control Fingers Optical signal processing Medical control systems Robot sensing systems

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The development of an automated rework cell for printed wiring assemblies

The development of an automated rework cell for printed wiri...

引用

ieee/CHMT(CPMT) International electronics Manufacturing Technology symposium

作者： M.H. Merrick L.R. Ruff D.L. Millard Design and Manufacturing Institute Rensselaer Polytechnic Institute USA

As the piece cost of completed circuit boards increases and production quantities decrease, rework of defective boards has become an important part of the production process. Surface mount component lead pitch has also been decreasing, which has required increased training and skill level of the rework operators. Automated rework provides a more cost-effective and reliable solution to these problems. The function of the rework cell is to remove and replace individual surface mount components from a fully populated circuit board without damaging the board, surrounding components, or solder joints of the surrounding components. The solder used is tin-lead with a eutectic melting temperature of 183/spl deg/ Celsius. It encapsulates the steps of circuit board assembly, which is normally done by separate machines in an assembly line, into a single machine, as well as add two additional operations. Further, the tooling must be able to handle a wide range of component sizes and pitches creating an operating environment that approaches a product batch size of one.< >

关键词： Wiring Assembly Cameras Printed circuits Databases Production Lead Soldering Robot vision systems Heat transfer

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A MMIC chip set for V-band crosslink communication systems

A MMIC chip set for V-band crosslink communication systems

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Microwave, MTT-S International symposium

作者： K. Minot M. Aust R. Kasody R. Katz H. Wang P. Rodgers D. Smith L. Shaw K. Tan N. Wang S. Dow B. Allen Electronic Systems & Technology Division TRW Space and Defense Sector Redondo Beach CA USA

V-band communication crosslink systems are being developed to take advantage of high atmospheric-attenuation characteristics. Because of strict weight, volume, and cost constraints of modern satellites, MMIC technology was chosen over conventional MIC approaches to deliver lighter, smaller, and higher performance communication systems. Through the MIMIC Phase 2 program, sponsored by ARPA and the Army Research Laboratory, TRW has developed a chip set for such a crosslink. Requirements from several insertion programs have been integrated to design an architecture that is generic, but flexible enough for expansion or reconfiguration to support these programs. The chip set includes nine highly integrated, multi-function MMICs configured to provide a complete V-band transceiver system.< >

关键词： MMICs Costs Artificial satellites Microwave integrated circuits Laboratories Transceivers

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Proceedings of the 1993 ieee International symposium on circuits and systems

Proceedings of the 1993 IEEE International Symposium on Circ...

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Proceedings of the 1993 ieee International symposium on circuits and systems

ISBN: (纸本)0780312813

The symposium fourth volume contains 158 papers on networks, systems and applications. The topics covered contain neural networks, power networks and systems, networks and cellular mobile communications, general circuits and systems, power electronic networks, nonlinear circuits and systems, robust control systems, graphs and applications, power network analysis, linear networks and systems, Petri nets and applications, and VLSI design and hardware implementation.

关键词： Circuit theory

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OFFSET-COMPENSATED AREA-EFFICIENT SWITCHED-CAPACITOR SUM-GAIN AMPLIFIER

OFFSET-COMPENSATED AREA-EFFICIENT SWITCHED-CAPACITOR SUM-GAI...

引用

1993 ieee INTERNATIONAL SYMP ON circuits AND systems

作者： LIN, JF EDWARDS, T SHAMMA, S Univ of Maryland College Park United States

ISBN: (纸本)0780312813

Two new area-efficient switched-capacitor sum-gain amplifiers (SGA's) are proposed. A parasitic-insensitive area-efficient sum-gain amplifier is presented, which reduces the capacitance spread ratio in high-gain applications. This reduction in capacitance spread ratio translates to a corresponding reduction in silicon area usage. As an improvement of the above circuit, we also present a second SGA design, which employs an offset-storage capacitor to reduce the output offset voltage, while preserving the reduced capacitance spread ratio of the first *** output offset voltage of this improved SGA is reduced by a factor more than max The advantages of such designs are demonstrated through simulation results with SWITCAP-II and measured responses from discrete IC components.

关键词： Amplifiers (electronic)

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EDA in digital design - means or ends?

EDA in digital design - means or ends?

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Proceedings of the 36th Midwest symposium on circuits and systems

作者： Smiarowski Jr., Adam Catholic Univ of America Washington United States

ISBN: (纸本)0780317610

Early introduction of electronic design Automation (EDA) in computer engineering curriculum becomes a growing concern in academia. Deficient standards and lack of uniform suit of tools call for educated selection from available multitude and thus discourage emphasis on EDA, in particular early on in undergraduate studies. However, during advanced courses, EDA is not only a necessary means but frequently becomes the goal of a project or graduate research. This paper attempts to reconcile these propensities.

关键词： Computer aided design

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