The future challenges for electronic printed circuit boards in automotive applications is further miniaturization, while increasing reliability and reducing costs. Conventional approaches are limited by the latest cir...
详细信息
The proceedings contain 68 papers. The topics discussed include: effects of isothermal heat treatment on microstructure evolution of microfluidic electroless Ni-P interconnection structure;the hidden Markov model with...
ISBN:
(纸本)9781728198514
The proceedings contain 68 papers. The topics discussed include: effects of isothermal heat treatment on microstructure evolution of microfluidic electroless Ni-P interconnection structure;the hidden Markov model with proximity capacitive sensor to detect user gesture;study of DSP (TMS320F2812) chip for advanced photovoltaic power generation maximum power point tracking control system;direct current tester (DCT) applied to 2.5D IC defect analysis;enabling MSL1 zero delamination through advanced packaging solutions for robust automotive power package;low loss interconnection solutions of chip-to-antenna for millimeter-wave antenna-in-package application;and high strength nanotwinned copper foils for PCB and current collectors in lithium ion battery.
The proceedings contain 103 papers. The topics discussed include: reworking lead-free array packages on double sided printed circuit boards;an elimination design for drift rate effects of MEMS-based inertial devices;f...
ISBN:
(纸本)9781424436248
The proceedings contain 103 papers. The topics discussed include: reworking lead-free array packages on double sided printed circuit boards;an elimination design for drift rate effects of MEMS-based inertial devices;fine line/space technology for flip chip substrate;a novel halogen-free, phosphorous-free and heat resistant material for copper clad laminate;the composition of intermetallic compounds in Sn-Ag-Bi-In solders on Cu substrates;photoresist removal requirements for advanced wafer level packagingtechnology;high thermal resistant polyimide coating applications on intelligent electronic devices;a high performance leadframe design for memory application;time delay control methodology for high speed substrate design;and permanent non-etching adhesion promotion system for solder mask applications.
The proceedings contain 53 papers. The topics discussed include: parallelizing time-delay recurrent neural network modeling technique on multi-core architectures;integrating parallel computation technique to state-spa...
ISBN:
(纸本)9781665431910
The proceedings contain 53 papers. The topics discussed include: parallelizing time-delay recurrent neural network modeling technique on multi-core architectures;integrating parallel computation technique to state-space dynamic neural network modeling of optical fiber;optimization of epoxy molding compound for Cu wire HTRB robustness;investigation and optimization of mold flow impact to leadless SMD package delamination;optimizing the nano wiring and klettsintering parameters for low-temperature die to DCB attach of power electronic chips;hybrid bonding enhancement system for ultra-low signal loss PCB manufacturing;plasma treatment for robust interface adhesion of wafer level packaging;and nitrogen plasma treatment on titanium dioxide films applied in self-cleaning glass.
The proceedings contain 121 papers. The topics discussed include: effect of preformed IMC layer on electromigration of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump;influen...
ISBN:
(纸本)9781457713880
The proceedings contain 121 papers. The topics discussed include: effect of preformed IMC layer on electromigration of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump;influence of IMC surface geometry and material properties on micro-bump reliability of 3D chip-on-chip interconnect technology;advanced high density interconnection substrate for mobile platform application;design and characterization of a copper-pillar flip chip test vehicle for small form-factor packages using 28nm ELK die and bump-on-trace (BOT);novel method for pth soldering driven by the thermal restrictions of a PTH LCD device;limitations of gluing as a replacement of ultrasonic welding: attaching lithium battery contacts to pcbs;and comparsion of Au/Al and Cu/Al in wirebonding assembly and reliability.
The proceedings contain 99 papers. The topics discussed include: advancements in electroless copper plating for via shrinking technology trend;design of microstrip gap waveguide based on dual-layer UC-EBG structure (I...
ISBN:
(纸本)9798331532246
The proceedings contain 99 papers. The topics discussed include: advancements in electroless copper plating for via shrinking technology trend;design of microstrip gap waveguide based on dual-layer UC-EBG structure (impact 2024);electrical characterization and analysis of high-speed data center platforms utilizing diverse de-embedding methodologies;approaches to streamline manufacturing in flexible hybrid printed electronics (FHPE);estimating warpage of fan-out panel-level packages under different manufacturing processes using a viscoplastic model;fracture analysis of micro-vias with low to high void existence at electroless Cu plated layers after thermal shock reliability cycle test;and developing pad design rule for wafer-level package through pad size effect analysis.
The proceedings contain 83 papers. The topics discussed include: characteristics of copper-to-silicon diffusion in copper wire bonding;LED package design for high optical efficiency and low viewing angle;the measureme...
详细信息
ISBN:
(纸本)9781424416370
The proceedings contain 83 papers. The topics discussed include: characteristics of copper-to-silicon diffusion in copper wire bonding;LED package design for high optical efficiency and low viewing angle;the measurement developing of wafer level MEMS microphone;impact of low-K wire bond stacked Flip Chip CSP package material on reliability test;open top mold package technology for wide range frequency optical sensors;high efficiency silicon-Based high power LED package integrated with micro- thermoelectric device;measurement of mechanical properties of optical diffuser films by Bugle Test and Finite element method;high sensitivity silicon-based condenser microphone design;future lead-free alloys- meeting challenges of miniaturization;dissolution and interfacial reaction between Cu and Sn-Ag-Cu solders;and solder joint strengths and interfacial reactions in various Pb free solder joints.
The proceedings contain 71 papers. The topics discussed include: novel thermal model development for system level thermal performance;fuzzy proximity capacitive gesture recognition system analysis and implement;corros...
ISBN:
(纸本)9781538656150
The proceedings contain 71 papers. The topics discussed include: novel thermal model development for system level thermal performance;fuzzy proximity capacitive gesture recognition system analysis and implement;corrosion resistance of surface finishes for high reliability devices;classification of solder joints via automatic mistake reduction system for improvement of AOI inspection;effects of substrate structure on the warpage of flip chip IC packages;variation of the strength and fracture mode of a grain and a grain boundary in polycrystalline copper thin films;combining textiles and electronics: market trend and laundering testing challenges of e-textiles (impact 2018);and the proximity capacitive gesture recognition for recursive Chebyshev neural network.
The proceedings contain 70 papers. The topics discussed include: root cause of analysis on the FCCL delamination of rigid flexible board;high temperature resistant protection tape for panel level embedded chip package...
ISBN:
(纸本)9781665452212
The proceedings contain 70 papers. The topics discussed include: root cause of analysis on the FCCL delamination of rigid flexible board;high temperature resistant protection tape for panel level embedded chip package on substrate;effect of package singulation parameters on dual flat non-leaded package delamination;impact of via structure toward wire bond interconnect quality;printed circuit board (PCB) routing optimization with an innovative edge connector for PCI-express 5.0 and beyond;the effects of voids on solder joint reliability in first level interconnect;board design architecture and optimization for high-power 48V voltage regulator;and a laser release temporary bonding tape for hybrid bonding having high thermal resistance and excellent thickness uniformity.
The proceedings contain 98 papers. The topics discussed include: reliability challenges of Cu wire deployment in flash memory packaging;study on manufacturing process of semi-flex printed circuit board using buried ma...
ISBN:
(纸本)9781467316385
The proceedings contain 98 papers. The topics discussed include: reliability challenges of Cu wire deployment in flash memory packaging;study on manufacturing process of semi-flex printed circuit board using buried material;research on the effect of inorganic components on brightener in horizontal pulse plating solution by cyclic voltammetric stripping method;bonding properties of low-temperature wafer bonding using sub-micron gold particles with different particle sizes;effect of stacking chips and fluid/structure interaction simulation in 3D stacked flip-chip encapsulation process;development of novel electroless nickel for selective electroless nickel immersion gold applications;strategy for TSV scaling with consideration on thermomechanical stress and acceptable delay;high-dielectric-constant graphite oxide-polyimide composites as embedded dielectrics;and inelastic analysis for singular stresses around TSV under reflow or power ON/OFF thermal load.
暂无评论