The proceedings contain 203 papers. The topics discussed include: global outlook for embedded device packaging;enabling MSL-1 capability for QFN and other design leadframe packages;process and characterization of ultr...
ISBN:
(纸本)9781424497836
The proceedings contain 203 papers. The topics discussed include: global outlook for embedded device packaging;enabling MSL-1 capability for QFN and other design leadframe packages;process and characterization of ultra-thin film packages;increasing bondability and bonding strength of gold BMPS thermosonic bonding to flex substrates by depositing a nickel layer;application of self-assembled monolayer (SAM) in low temperature bump-less Cu-Cu bonding for advanced 3D IC;the contact characteristics and NMOS performance of ACF-Bonded ultra-thin chip-on-flex (UTCOF) interconnects for bendable electronics;packaging technologies for 3D integration;strength determination of light-emitting diodes and chip structure design;nanofiber based composites for thermal management;thermal cycling analysis of microgyroscope chip embedded with through-silicon vias by finite element method.
The proceedings contain 90 papers. The topics discussed include: vibration reliability characteristics of board-to-board connector pins;thermomechanical analysis and reliability performance of a semiconductor package ...
ISBN:
(纸本)9781467383561
The proceedings contain 90 papers. The topics discussed include: vibration reliability characteristics of board-to-board connector pins;thermomechanical analysis and reliability performance of a semiconductor package using a single gauge leadframe design;packagingtechnology by liquid mold-underfill(MUF)material for the advanced mobile devices;advanced 3D EWLB-POP (embedded wafer level ball grid array - package on package) technology;reliability lifetime predictions on long term biased humidity reliability of Cu ball bonds;thermal performance evaluation of power QFN package with stacked and side by side die configuration;fabrication of a hermetic sealing device having I-structure TGV;structural analysis and static responses of electrostatic actuators for 3-DOF micromanipulators in phonomicrosurgery;low temperature direct bonding of polyether ether ketone (PEEK) and Pt;and effects of additives on filling blind vias for HDI manufacture.
The proceedings contain 73 papers. The topics discussed include: flexible and highly sensitive pressure sensor using multi-walled carbon nanotubes;turtle base with fin perforated heat exchangers for the 2.5D and 3D IC...
ISBN:
(纸本)9781538647196
The proceedings contain 73 papers. The topics discussed include: flexible and highly sensitive pressure sensor using multi-walled carbon nanotubes;turtle base with fin perforated heat exchangers for the 2.5D and 3D IC structures;development of high-quality graphene nano-ribbon fabrication process for high sensitivity strain sensor;evaluation of the relationship between the tensile strength of a grain boundary in electroplated copper thin films and the crystallinity of the grain boundary using micro tensile test;relationship between mechanical properties and micro texture of electroplated gold thin films;graphene nano-ribbon-base highly sensitive pressure sensor using area-arrayed pillar structure;impact strength of Sn-Ag-Cu/Cu solder bumps formed by an induction heating method;studies of tin whisker growth under high external pressure;development of high-performance ultra large scale 3D processor with high reliability packaging design;differential impedance controlling of rigid flexible board;die attach delamination study of electronic stability control device used in harsh automotive environment;a verification of resonant clock driver design for the IoT era;and crystallinity control of the electroplated copper thin film interconnections for advanced electronic devices.
The proceedings contain 104 papers. The topics discussed include: crosstalk and SSO noise minimize optimization of high speed and high-pincount 3D PKG-vertical connection unit;a potential silver catalyst system for ne...
ISBN:
(纸本)9781509047697
The proceedings contain 104 papers. The topics discussed include: crosstalk and SSO noise minimize optimization of high speed and high-pincount 3D PKG-vertical connection unit;a potential silver catalyst system for new generation of electroless Cu process as a palladium substitution;high performance cyanide-free immersion gold;study of LiTaO3/ST-quartz bonding with amorphous interlayer assisted by VUV/O3treatment for SAW device;novel approach for search engine;development of liquid, granule and sheet type epoxy molding compounds for fan out wafer/panel level package;new immersion gold technology for uniform Au thickness distribution (impact-IAAC 2016);evaluation of bonding strength of thin copper wire and lead-free solder by pullout tests;thin profile flip chip package-on-package development;simultaneous fabrication of a through-glass interconnect via and bumps using dry filling process of submicron gold particles;transient electro-thermal simulation of multi-channel power switch device in enhanced SOIC package;effect of electroless Ni-P thickness on EFTECH 64-Ni, EFTECH 64-Cu and C194-Ni bump;board level reliability improvement in EWLB (embedded wafer level BGA) packages;CFD analysis about surface roughness dependence of thermal contact resistance;investigations in selective laser melting as manufacturing technology for the production of high-temperature mechatronic integrated devices;one-time deformable thermoplastic devices based on flexible circuit board technology;and multiplate- from wafer to panel-new solutions for electrolytic Cu deposition in advanced packaging.
The future challenges for electronic printed circuit boards in automotive applications is further miniaturization, while increasing reliability and reducing costs. Conventional approaches are limited by the latest cir...
详细信息
The future challenges for electronic printed circuit boards in automotive applications is further miniaturization, while increasing reliability and reducing costs. Conventional approaches are limited by the latest circuit substrate requirements. Therefore innovative integration concepts and packaging technologies must be evaluated. For this purpose, Continental has managed VISA, a three-year project funded by the Federal Ministry for Education and Research, where electronic components are embedded into PCBs. The so-called i 2 Board concept was favourized, developed by Schweizer Electronic AG, in which active and/or passive components are mounted and connected onto an electrical substrate material comparable to a flex foil and already can be functionally tested. Afterwards, the assembly is embedded between the inner layers of the PCB and integrated into the PCB's set up. Successful developments were conducted with regard to novel ferrite materials for the embedding of inductivities. Also results for bare dies embedded with new connection technologies, e.g. Cu-pillar-bumping for application for transmission control units are outlined.
The proceedings contain 42 papers. The topics discussed include: advanced VSCEL package for 3D sensor application by using attached ceramic spacer technology;copper electroplating processes for advanced HDI applicatio...
ISBN:
(纸本)9781728160702
The proceedings contain 42 papers. The topics discussed include: advanced VSCEL package for 3D sensor application by using attached ceramic spacer technology;copper electroplating processes for advanced HDI applications;characterizing wideband permittivities of 5G CCL and FCCL using split cylinder resonators;a novel horizontal copper pattern plating system with high throughput;study on the assemblytechnology of die-first / face-down type FO-PLP;innovative system in package design by laser ablation technology;and study of the high-tech process mechanical integrity and electrical safety.
The proceedings contain 77 papers. The topics discussed include: reliable study for fine line RDL fan out multi-chip module;3D fan-out wafer level packaging with embedded chip;improvement of adhesion between high-freq...
ISBN:
(纸本)9798350384123
The proceedings contain 77 papers. The topics discussed include: reliable study for fine line RDL fan out multi-chip module;3D fan-out wafer level packaging with embedded chip;improvement of adhesion between high-frequency-compatible substrates with low dielectric constants and electroless plated copper films using a vacuum ultraviolet treatment;reliability performance study of molding compounds on high voltage molded leaded package;noise analysis and improvement of power supply network based on power integrity;All-GaN HEMTs and planar transformer based 48V voltage regulator common module (VRCM) design;analysis of panel warping for multilayer RDL process and extraction of dielectric properties of photosensitive polyimide on fan-out panel level packaging;Kalman Hidden Markov model detect user gesture on proximity capacitive sensor;in-line sputtered copper/aluminum-doped zinc oxide films on glass prepared for energy-saving and antibacterial function;and development of a semi-automatic probe card adjustment equipment.
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