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检索条件"任意字段=International Microsystems Packaging Assembly and Circuits Technology Conference IMPACT"

共 976 条记录，以下是21-30 订阅

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2014 9th international microsystems, packaging, assembly and circuits technology conference: Challenges of Change - Shaping the Future, impact 2014 - Proceedings

2014 9th International Microsystems, Packaging, Assembly and...

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9th international microsystems, packaging, assembly and circuits technology conference, impact 2014

ISBN: (纸本)9781479977277

The proceedings contain 116 papers. The topics discussed include: effect of the crystallinity on the long-term reliability of electroplated copper thin-film interconnections;quality control of grain boundaries in copper thin films used for 3D interconnections;quantitative evaluation of the quality of grains and grain boundaries in copper thin films used for 3D interconnections;palladium deactivation pretreatment process for electroless nickel immersion gold process (ENIG): elimination of metal plating at nonplated through holes (NPTH);fabrication and characterization of thermally conducting laminate using spherical aluminum nitride powders and synthesized twin mesogenic epoxy oligomer;next generation metallization technique for IC package application;and Low power transmitter/receiver circuit for over 25Gbps operation.

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2013 8th international microsystems, packaging, assembly and circuits technology conference - Green and Cloud: Creating Value and Toward Eco-Life, impact 2013 - Proceedings

2013 8th International Microsystems, Packaging, Assembly and...

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2013 8th international microsystems, packaging, assembly and circuits technology conference - Green and Cloud: Creating Value and Toward Eco-Life, impact 2013

ISBN: (纸本)9781479906673

The proceedings contain 84 papers. The topics discussed include: effects of wire type and mold compound on wearout reliability of semiconductor flash fineline BGA package;the evolution of organic solderability preservative (OSP) process in PCB application;characterization and performance study of packaged micropump for drug delivery;analysis of stress buffer effect of polyimide for board level drop test by a finite element analysis;remotely-controlled tensile test of copper-cored lead-free solder joint in liquid using permanent magnet;thermal design method of printed circuit board with effective thermal conductivity;analysis of hot spot temperature in power Si MOSFET with electro-thermal analysis;design and reliability analysis of voltage reference circuit in 180 nm CMOS process;a thermal design approach for natural air cooled electronic equipment casings;and non-etching adhesion promoter for dry film for semiadditive manufacturing - advanced dry film pre-treatment.

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Electrolytic solder deposit for next generation flip chip solder bumping: 2010 international microsystems, packaging, assembly and circuits technology (impact) conference

Electrolytic solder deposit for next generation flip chip so...

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2010 5th international microsystems, packaging, assembly and circuits technology conference, impact 2010 and international 3D IC conference

作者： Kenny, Stephen Roelfs, Bernd Matejat, Kai Magaya, Tafadzwa Massey, Roger Atotech. GmbH Erasmusstrasse 20 10553 Berlin Germany

ISBN: (纸本)9781424497836

Current methods for the formation of pre-solder bumps for flip chip attachment use stencil printing techniques with an appropriate solder paste. The continuing trend towards increasing miniaturisation and the associated decrease in size of solder resist opening, SRO is causing production difficulties in particular associated with achieving sufficient yields with the stencil printing process. Practical experience of current production yields has shown that stencil printing will not be able to meet future requirements for solder bump pitch production below 0.15 mm for these applications. Also the increased costs associated with low yields are an ever present factor. This paper describes a novel approach to replace the stencil printing process by use of an electrolytic deposition of solder. In contrast to stencil printing, use of electrolytic deposition techniques allows production of solder bumps with a pitch below 0.15 mm and with a SRO below 80 μm. The electrolytic deposition of tin requires an electrical connection to each surface for metal deposition;this process is shown as made using an appropriate copper seed layer which is produced onto the structured soldermask. Specially modified activation and electroless copper processes are introduced for this critical process step. Following this the use of a photo sensitive plating resist defines the SRO which is then filled with the electrolytic tin deposit. The associated processes required both for seed layer production and for removal of plating resist and subsequent etching of the seed layer are described and first qualification results are shown from the complete process. Methods for production of electrolytic solder bumps based on pure tin as well as alloys of tin/copper are shown and in particular a method to control the alloy concentration of electroplated tin/copper bumps. Test results with both alloy system and also pure tin bumping are presented together with comparison of the advantages and disadvantages. T

关键词： Tin alloys

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Electrolytic solder deposit for next generation flip chip solder bumping: 2010 international microsystems, packaging, assembly and circuits technology (impact) conference

Electrolytic solder deposit for next generation flip chip so...

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international microsystems, packaging, assembly and circuits technology (impact)

作者： Stephen Kenny Bernd Roelfs Kai Matejat Tafadzwa Magaya Roger Massey Atotech GmbH Berlin Germany

Current methods for the formation of pre-solder bumps for flip chip attachment use stencil printing techniques with an appropriate solder paste. The continuing trend towards increasing miniaturisation and the associated decrease in size of solder resist opening, SRO is causing production difficulties in particular associated with achieving sufficient yields with the stencil printing process. Practical experience of current production yields has shown that stencil printing will not be able to meet future requirements for solder bump pitch production below 0.15 mm for these applications. Also the increased costs associated with low yields are an ever present factor. This paper describes a novel approach to replace the stencil printing process by use of an electrolytic deposition of solder. In contrast to stencil printing, use of electrolytic deposition techniques allows production of solder bumps with a pitch below 0.15 mm and with a SRO below 80 jim. The electrolytic deposition of tin requires an electrical connection to each surface for metal deposition; this process is shown as made using an appropriate copper seed layer which is produced onto the structured soldermask. Specially modified activation and electroless copper processes are introduced for this critical process step. Following this the use of a photo sensitive plating resist defines the SRO which is then filled with the electrolytic tin deposit. The associated processes required both for seed layer production and for removal of plating resist and subsequent etching of the seed layer are described and first qualification results are shown from the complete process. Methods for production of electrolytic solder bumps based on pure tin as well as alloys of tin/copper are shown and in particular a method to control the alloy concentration of electroplated tin/copper bumps. Test results with both alloy system and also pure tin bumping are presented together with comparison of the advantages and disadvantages.

关键词： Copper Tin Resists Production Surface treatment Printing

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3-D Finite-Element Modeling of Multi-Finger High-Power Amplifiers With Compact Heat-Dissipation packaging Structures

3-D Finite-Element Modeling of Multi-Finger High-Power Ampli...

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4th international microsystems, packaging, assembly and circuits technology conference

作者： Tseng, H. C. Chen, J. Y. Kun Shan Univ Nanotechnol Res & Dev Ctr Yung Kang 710 Tainan County Taiwan Kun Shan Univ Dept Elect Engn Tainan 710 Taiwan

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Ultrasonic dispersion of nanocomposite solder for microelectronic packaging 17

Ultrasonic dispersion of nanocomposite solder for microelect...

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17th international microsystems, packaging, assembly and circuits technology conference (impact)

作者： Rajendran, Sri Harini Kang, Hyejun Seo, Seong Min Jung, Jae Pil Univ Seoul Dept Mat Sci & Engn 163 Seoulsiripdaero Seoul 02504 South Korea Samsung Elect Suwon South Korea

ISBN: (数字)9781665452212

ISBN: (纸本)9781665452212

With the progress in miniaturization and portability of consumer electronics, devices are expected to be compact and lightweight, demanding more input-output electrical transfer in less space via fine-pitch interconnections. The solder ball diameter used in the ball grid array (BGA) and Flip-chip ball grid array (FCBGA) for joining the integrated circuits, microprocessors, memory chips, etc., to printed circuit boards (PCB) is continuously downsized to meet the current market demands [1, 2].

关键词： Nanoparticles Micromechanical devices Microprocessors Printed circuits packaging Zinc oxide Acoustics

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Establish a Rule for the selection of ion residue testing machines for different ion pollution sources 17

Establish a Rule for the selection of ion residue testing ma...

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17th international microsystems, packaging, assembly and circuits technology conference (impact)

作者： Chang, Shih-Ping Chen, Liang-Pin Siliconware Precis Ind Co Ltd 153Sec 3 Chung Shan Rd Taichung Taiwan

ISBN: (数字)9781665452212

ISBN: (纸本)9781665452212

Flux and other organic solvents are added to the solder during die bonding in advanced packaging process. The primary function of fluxes and other organic solvents is to remove oxides and provide clean solder surfaces in integrated circuit packages. Typically, specific organic acids are added to the flux to enhance chemical activity. To prevent flux residues, cleaning procedures must be performed to reduce residues. Therefore the paper will target different sources of ionic contamination include overall surface/specific location/residue to establish a Rule for the selection of ion residue testing machines for different ion pollution sources These include surface ion residue testing machines, surface cleanliness testing machines and ion chromatography.

关键词： Surface cleaning Solvents Pollution Surface contamination Shape measurement Instruments packaging

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A Study of Material Extraction and Moisture Effect on mmWave Fan-out Package Design 17

A Study of Material Extraction and Moisture Effect on mmWave...

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17th international microsystems, packaging, assembly and circuits technology conference (impact)

作者： Kuo, Chiung-Ying Kuo, Hung-Chun Jhong, Ming-Fong Wang, Chen-Chao Adv Semicond Engn ASE Kaohsiung Inc Elect Lab Prod Design Div Corp R&D 26Chin 3rd Rd Nantze Export Proc Kaohsiung 811 Taiwan

ISBN: (数字)9781665452212

ISBN: (纸本)9781665452212

In order to ensure the performance of high-frequency fan-out package design, especially at mmWave application, the influence of substrate dielectric characteristic is very serious. Polyimide (PI) material is common material used in Fan-out package. The moisture effect of PI is very obvious in stress and electrical performance. Sso this paper introduces the method of dielectric constant (Dk) and dissipation factor (Df) extraction. And then the moisture effect on transmission line loss and phase are also studied in this paper, the frequency is up to mmWave range.

关键词： Power transmission lines Moisture measurement Moisture Polyimides packaging Transmission line measurements Propagation losses

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Image Transfer Solutions for Future Demand

Image Transfer Solutions for Future Demand

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4th international microsystems, packaging, assembly and circuits technology conference

作者： Takahashi, Toru DuPont Kabushiki Kaisha Circuit & Packaging Mat DuPont Elect & Commun Tokyo Japan

ISBN: (纸本)9781424443413

Ever increasing need for smaller and functionally more integrated electronics devices such as smart phone, IC package substrate is forcing changes in materials for PWB imaging. This paper will provide insights how new materials developments are offering improved capabilities to produce such a high-end, fine-line PWBs along with imaging process considerations. The fabrication processes involved in the production of fine-line printed wiring boards will be also reviewed in some detail, between subtractive processes (which will not meet future needs) and semi-additive processes as well as emerging damascene-type of structure. This paper will highlight an overview of the importance that material and process selection has on the capability of PWB fabricators to meet the challenges in the future and provide insights into future direction based on evolving market needs

关键词： Conductors Space technology Wafer scale integration Etching Conducting materials Electronics packaging Integrated circuit packaging Fabrication Consumer electronics Stacking

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An Innovative Customized PCB Surface Printing for Performance Enhancement 17

An Innovative Customized PCB Surface Printing for Performanc...

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17th international microsystems, packaging, assembly and circuits technology conference (impact)

作者： Hsu, Jimmy Chang, Ryan Ye, Xiaoning Su, Thonas Liu, Zoe Intel Microelect Asia LLC Taiwan Branch 20F369Sec 7Zhong Xiao E Rd Taipei 11561 Taiwan

ISBN: (数字)9781665452212

ISBN: (纸本)9781665452212

In this paper, a novel and effective approach by the innovative customized PCB surface printing was proposed to reduce far-end crosstalk (FEXT) in multiple microstrip lines. A new type of solder mask with higher dielectric constant up to 8, instead of the conventional one with around 4, was developed for PCB surface printing. The test coupons with the proposed customized solder mask are built and validated, and the measured FEXT was significantly reduced. The design strategy with the optimized structures was clearly addressed, and this innovation can effectively enhance the microstrip electrical performance for high-speed application.

关键词： Printing Micromechanical devices Technological innovation Dielectric constant Crosstalk packaging Dielectric measurement

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