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检索条件"任意字段=International Microsystems Packaging Assembly and Circuits Technology Conference IMPACT"

共 976 条记录，以下是71-80 订阅

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Thermal Performance of Various Heat Sinks (impact 2012: US011-1)

Thermal Performance of Various Heat Sinks (IMPACT 2012: US01...

引用

7th international microsystems, packaging, assembly and circuits technology conference (impact)

作者： Yeh, Lian-Tuu Thermal Consultant Dallas Texas USA

ISBN: (纸本)9781467316385;9781467316354

Cooling of electronics has received considerable attention recently. Simplicity and easy maintenance make direct air cooling a most attractive approach in cooling of electronics. Various heat sinks are often mounted to the microelectronic components in order to enhance thermal performance so that the components can be kept below the respective temperature limits. Three different types of the heat sinks, including extrusion fin, plain fin, and cell fin are under considerations. The extruded heat sink is the most popular because it is inexpensive and easy to make. However, this type fin is relatively thick which limits the number of fins on the heat sink. In other words, the surface for the convective heat transfer is limited. The purpose of this study is to obtain the heat transfer coefficient as well as the thermal resistance of the individual heat sinks at various flow velocities. In addition, the effects of the flow by-pass on the heat sink performance will also be examined.

关键词： cooling electronics packaging heat sinks

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Reworking lead-free array packages on double sided printed circuit boards

Reworking lead-free array packages on double sided printed c...

引用

2008 3rd international microsystems, packaging, assembly and circuits technology conference, impact 2008

作者： Wood, Paul OK International United States

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impact Strength of Sn-Ag-Cu/Cu Solder Bumps Formed by an Induction Heating Method 12

Impact Strength of Sn-Ag-Cu/Cu Solder Bumps Formed by an Ind...

引用

12th international microsystems, packaging, assembly and circuits technology conference (impact)

作者： Zhang, Yujian He, Siliang Nishikawa, Hiroshi Osaka Univ Joining & Welding Res Inst 11-1 Mihogaoka Ibaraki Osaka 5670047 Japan Osaka Univ Grad Sch Engn 2-1 Yamadaoka Suita Osaka 5650871 Japan

ISBN: (纸本)9781538647196

To evaluate the impact reliability of solder bumps generated by an induction heating method, the high shear rate impact test was performed on Sn-3.0Ag-0.5Cu/Cu solder bumps soldered by induction heating, and the morphology and thickness of the intermetallic compound (IMC) layer at the interface were examined. The effect of isothermal aging on the impact strength of these solder bumps was investigated, and the fracture surfaces were observed. Compared with the conventional reflow method, a thinner interfacial IMC layer was formed just after soldering by induction heating. The impact strength of Sn-3.0Ag-0.5Cu/Cu solder bumps soldered by induction heating was superior to that of solder bumps soldered by the reflow method.

关键词： Induction heating Aging Isothermal processes Reflow soldering Reliability

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A New Species of IC Package: Via-interconnect Ball-Grid-Array (ViB) 10

A New Species of IC Package: Via-interconnect Ball-Grid-Arra...

引用

10th international microsystems, packaging, assembly and circuits technology conference (impact)

作者： Lu, Charlie Altera Corp 101 Innovat Dr San Jose CA 95134 USA

ISBN: (纸本)9781467383561

ViB, Via-interconnect Ball-Grid-Array, is a new package species which is denominated first in the industry in this paper. This new species involves a new chip-to-package interconnect technology named via-interconnect. Some of WLPs (Wafer Level Packages) and recently developed so-called "fan-out" packages belong to this category. The definition of ViB is a ball-grid-array package whose chip-to-package electrical interconnect is done by "via". The via is a channel formed between chip I/O pads and package inner bonding pads, followed by conductive material filled into the via or metallization done on the sidewall and bottom of the via to electrically connect the die and package. Thus, the assembly process, production equipment, and interconnect failure mechanism of the ViB may be very different from the conventional wire-bonding package, flip-chip-bonding package, and tape-automatic-bonding package. Therefore, from packaging taxonomy point of view, there is a need to differentiate via-interconnect from the conventional technologies. The categorization of chip-to-package interconnect is re-examined in this paper, and the via-interconnect is proposed to be added as a new category.

关键词： Integrated circuit packaging Vertical Integration Building new species encapsulating Metalation Electricity Conducting materials SIDEWALL

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Development of packaging Technologies for SiC Power Module 10

Development of Packaging Technologies for SiC Power Module

引用

10th international microsystems, packaging, assembly and circuits technology conference (impact)

作者： Liu, Chun-Kai Chao, Yu-Lin Li, Wei Tzeng, Chih-Ming Kao, Kuo-Shu Chang, Jing-Yao Fang, Rong-Chang Ind Technol Res Inst Elect & Optoelect Labs Rm 168Bldg 14195Sec 4Chung Hsing Rd Hsinchu 310 Taiwan

ISBN: (纸本)9781467383561

In recent years, SiC power semiconductor devices are emerging as alternatives that outperform Si devices by reduce power loss and high operation temperature (>200 degrees C). However, commercial packaging technologies for Si devices are within limited operation temperature (<150 degrees C). The development of packaging technologies for SiC power module is a critical issue. In this paper, the full SiC power module (SiC MOSFET+ SiC Schottky diode) is developed. Thermal, thermomechanical and electrical characteristics of power module are analyzed. For increase reliability, Cu-Al heavy wire bonding and die bonding with high temperature solder are studied. Finally, the performance of full SiC power module is measured and compared with Si IGBT power module.

关键词： Silicon carbide

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packaging technology by liquid mold-underfill (MUF)material For the advanced mobile devices 10

Packaging technology by liquid mold-underfill (MUF)material ...

引用

10th international microsystems, packaging, assembly and circuits technology conference (impact)

作者： Ishikawa, Yuki Yukimaru, Joji Takao, Tomoya Ikeda, Kazuhiro Yamane, Kazuaki Nakao, Akira Hisanaga, Naokatsu Sanyu Rec Co LTD Semicond Dept 3-5-1 Doucho Takatsuki Osaka Japan

ISBN: (纸本)9781467383561

As one approach of advanced packaging technologies, high reliability Liquid Mold UnderFill (Liquid MUF) materials and unique process will be presented here. Liquid MUF materials have the features of high adhesion, low CTE and low modulus. It is possible to alleviate the stress of the solder of each device mounted in the package, and they have excellent reliability too. These materials are adjusted the workability depending on the application. Moreover, because of low viscosity, the Liquid MUF material could be mold-underfilled with relatively lower stress to large Flip Chip devices with small gap and narrow pitch compared to the conventional solid materials. As for the processes of the liquid materials, printing, dispensing and compression molding are applicable. In this paper, the printing process, especially vacuum printing encapsulation systems (VPES) and pressure curing systems, will be mainly discussed. In addition, module package structure that achieved by these material and process development will be also explained in detail.

关键词： Liquids

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A Constant Voltage Controlled LED packaging Module with a Temperature Compensating Capacitor 10

A Constant Voltage Controlled LED Packaging Module with a Te...

引用

10th international microsystems, packaging, assembly and circuits technology conference (impact)

作者： Huang, Lisheng Liao, Siansyun Tsou, Chingfu Hung, Sanshan Feng Chia Univ Dept Automat Control Engn Taichung 40724 Taiwan

ISBN: (纸本)9781467383561

Due to the thermal energy affects on the electrical property of LED, its driving power requires constant current control to adjust brightness. However, this approach requires extensive electronic parts to conduct signal processing, which will decrease the reliability and lifetime of LED. Moreover, as the packaging volume increases, manufacturing costs become relatively higher. In order to address these issues, a silicon-based LED packaging module with a temperature compensating capacitor is proposed, which can provide stable luminous efficiency, and be applied to the constant voltage driving mode. The packaging module uses 3D stacking technology to integrate LED and a capacitor on a silicon micromachining substrate. The inductor is used for electrical impedance with a capacitor when supplying a constant voltage with periodical switch mode to LED. Based on this configuration, the temperature variation generated by the LED can directly change the capacitance in a series driving circuit;thereby, compensating the resistance variation in the LED to stabilize the driving current. Thus, a miniaturized, low-cost, constant voltage controllable LED module can be achieved.

关键词： LED Temperature compensating capacitor Constant voltage control

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Emerald™ UV Laser Drilling System (impact 2015) 10

Emerald™ UV Laser Drilling System (IMPACT 2015)

引用

10th international microsystems, packaging, assembly and circuits technology conference (impact)

作者： Bar-Yaakov, Nimrod Kopel, Hanoch Frommer, Aviv Orbotech Ltd IL-8110101 Shderot Hasanhedrin Yavn Israel

ISBN: (纸本)9781467383561

The Emerald (TM) is a high-accuracy, high-speed UV Laser Drilling system. It creates microvias on a variety of materials such as metal, passivation, mold compounds, and dielectric layers. With a minimal spot size of 15 mu m, the system drills small vias down to 18um with position accuracy down to 6um at Cpk=1.33 (4 sigma) at very high speeds of more than 3,500 vias per second on standard ABF substrates. For fc-BGA we demonstrate high quality vias, smaller than 35 mu m in diameter in ABF with tight position accuracy and >75% taper. For fc-CSP we can produce high quality vias of 45 mu m diameter and below in copper-plated PrePeg with smooth via walls and no hangover, at a high-speed and low TCO, demonstrating a competitive cost per via against CO2-based laser drilling technologies.

关键词： accuracy of position emerald ultraviolet laser light hangover spot size dielectric layer seed drills Drilling Drilling wall Diameter Amphibious bulk fuel system

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Development and Validation of a Semi-Analytical Model for Predicting Asymmetric Warpage of Fan-Out Reconstituting packaging 16

Development and Validation of a Semi-Analytical Model for Pr...

引用

16th international microsystems, packaging, assembly and circuits technology conference (impact)

作者： Lee, Yu-Chin Chen, Chia-Yu Chen, Yi-Sheng Chen, Kuo-Shen Chen, Tang-Yuan Chen, Dao-Lung Tarng, David Natl Cheng Kung Univ Dept Mech Engn Tainan 70101 Taiwan Adv Semicond Engn Inc Grp Corp R&D Kaohsiung 81174 Taiwan

ISBN: (纸本)9781665431910

Fan-out wafer level package (FOWLP) are widely used in advanced packaging technologies. In modeling or curing phases the reconstituted wafers may warp asymmetrically due to numerous thermal and mechanical loadings. Such excessive warpages further impose concerns in subsequent processing and the final yielding and reliability of products. Therefore, it is desirable to develop an efficient evaluation to correlate the bifurcation of asymmetric warping. In this paper, the semi-analytical model is proposed for providing onset temperature of bifurcation prediction. And the finite element simulation of full-scale model serving as the standard reference in the entire work. Consequently, comparing with finite element result and the semi-analytical model prediction with several equivalent strategies, the semi-analytical model with energy method shows highly consistent with the full-scale model in bifurcation temperature.

关键词： Asymmetric warpage Fan-out reconstitution Bifurcation Finite element simulation Semi-analytical formulation

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High-speed Data Center PCB Design Challenges and Findings by Intel ® Automatic In-board Characterization 17

High-speed Data Center PCB Design Challenges and Findings by...

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17th international microsystems, packaging, assembly and circuits technology conference (impact)

作者： Hsu, Jimmy Hung, Gary Tseng, Jim Ho, Brian Lin, Lemon Su, Thonas Intel Microelect Asia LLC Taiwan Branch 20F369Sec 7Zhong Xiao E Rd Taipei 337 Taiwan

ISBN: (数字)9781665452212

ISBN: (纸本)9781665452212

There are more and more PCB design challenges in data center platform design by thousands of signals and higher speed data rate. Designers need to adopt advanced PCB technologies, such as lower loss PCB material, smaller drill size, back drill, higher layer count and so on to accommodate these. How to validate these PCB design and manufacture is very important to ensure the design quality. AIBC is developed for efficient and accurate PCB electrical characterization and efficiently captured design and manufacture qualities, such as PCB drilling, etching quality and manufacture variation. Through full scope in-board impedance and loss measurement, AIBC is very helpful to capture the design defects for design improvement of the next PCB re-spin for customer time-tomarket and the early visibility by AIBC finding is critical to improve PCB vendor quality reducing down-range risk and product quality enhancement.

关键词： Micromechanical devices Drilling Data centers Impedance measurement packaging Loss measurement Product design

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