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检索条件"任意字段=International Microsystems Packaging Assembly and Circuits Technology Conference IMPACT"

共 976 条记录，以下是81-90 订阅

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New Immersion Gold technology for Uniform Au Thickness Distribution (impact-IAAC 2016) 11

New Immersion Gold Technology for Uniform Au Thickness Distr...

引用

11th international microsystems, packaging, assembly and circuits technology conference (impact-IAAC)

作者： Zhang, Jian Hsu, Ivan Li, Crystal Rohm & Haas Elect Mat Asia Ltd 15 On Lok Mun St Fanling Hong Kong Peoples R China Dow Chem Co USA Rohm & Haas Elect Mat Taiwan Ltd 6 Lane 280Chung Shan North Rd Ta Yuan Hsiang Taoyuan Hsien Taiwan

ISBN: (纸本)9781509047697

Electroless Nickel Immersion Gold (ENIG) is one of the important final finish techniques that is used in the printed circuit board industry. Despite its relatively expensive cost compared to other final finishing processes such as OSP and immersion Tin etc., ENIG has many advantages. The low reactivity of Au can protect the underlying Ni and Cu surfaces from oxidation and keeps the board suitable for long storage time. It provides excellent surface planarity suitable for soldering, especially for tiny parts such as BGA and Flip-Chip, and the surface remains solderable even after multiple reflow cycles. It is useful for contact surfaces such as membrane switches and contact points and may also be used for wire bonding.

关键词： Corrosion resistance

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The impact of Carbonization on CAF in UV laser cutting prepreg 16

The Impact of Carbonization on CAF in UV laser cutting prepr...

引用

16th international microsystems, packaging, assembly and circuits technology conference (impact)

作者： Xie, Chen-xi Zou, Hai-cheng Wei-yao Wang, Meng-yang Chinpoon Changshu Elect Co Ltd 98 Huang Pujiang Rd Changshu Jiangsu Peoples R China

ISBN: (纸本)9781665431910

With the rapid development of consumer electronic products, a growing number of rigid flexible board is widely used, such as mobile phones, blue tooth headset, tablet PC. In the production of rigid flexible board, in order to form a good profile in transition zone, it is necessary to use non-flow PP. We need to cut off the corresponding PP in the soft area, which is called conform. In the stage of mass production, the operation mode of PP conform is punch, but in the sample stage, especially when customer need to repeat the production of sample, in order to save the cost of the mold, many companies will use UV laser machine to replace the mold. At present, the market has mature UV laser equipment, although UV laser is a "cold cutting", there is still carbonization at the edge of the PP window, this paper aims the influence of carbonization of PP window on the CAF. Different types of PP and different laser equipment will lead to different degrees of carbonization. In this article, we mainly study the carbonization of nanosecond laser, picosecond laser and femtosecond laser in the cutting of different types of PP. The selected PP contains 1037 RC63, 1067 RC62 and 1078 RC68, and combined with the CAF test pattern, to explore the impact of carbonation on CAF.

关键词： Carbonization

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Strategy for TSV Scaling with Consideration on Thermo-mechanical Stress and Acceptable Delay

Strategy for TSV Scaling with Consideration on Thermo-mechan...

引用

7th international microsystems, packaging, assembly and circuits technology conference (impact)

作者： Ghosh, K. Zhang, J. Zhang, L. Dong, Y. Li, H. Y. Tan, C. M. Xia, G. Tan, C. S. Nanyang Technol Univ Singapore 639798 Singapore ASTAR Singapore Inst Microelect Singapore Singapore Univ British Columbia Vancouver BC Canada

ISBN: (纸本)9781467316385;9781467316354

Based on the 2011 ITRS road map, the greater accessibility of higher number of TSVs in a specified area depends on the smarter miniaturization of the interconnect dimension in 3D IC packaging. Scaling down the TSV dimension has an inevitable effect on resistance, capacitance, signal transmission as well as the thermo-mechanical stress. We report that the lowering of the TSV diameter is permissible under thermo-mechanical stress consideration. However, the signal transmission delay explodes rapidly and could be tunable via controlling the liner layer capacitance or/and using alternative filler materials.

关键词： delays integrated circuit interconnections integrated circuit packaging thermal stresses three-dimensional integrated circuits

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Fabrication and characterization of electroplated nanotwinned-copper films on polymer substrates(impact-IAAC 2016) 11

Fabrication and characterization of electroplated nanotwinne...

引用

11th international microsystems, packaging, assembly and circuits technology conference (impact-IAAC)

作者： Chang, Liang-Hsien Chen, Chih Hu, Dyi-Chung Tain, Ray Chen, Y. H. Natl Chiao Tung Univ Dept Mat Sci & Engn 1001 Ta Hsueh Rd Hsinchu 30010 Taiwan Natl Chiao Tung Univ New Business Dev Div Unimicron Technol Corp Dept Mat Sci & Engn Hsinchu 300 Taiwan

ISBN: (纸本)9781509047697

Nanotwinned copper (nt-Cu) is drawing wide attention for it simultaneously demonstrates high strength and high ductility, which are thought to be mutually exclusive. According to previous studies, nanotwinned Cu may be the best structure for resisting electromigration damage. In this study, we deposit (111)-oriented nt-Cu using direct current with suitable additives on PCB substrates. Current density and the plating bath are variables. After copper electroplating, XRD, FIB, EBSD were used to observe the microstructure of the films. We found that the as-deposited Cu has > 30% (111)-oriented nt-Cu on the polymer substrate. The microstructures of the highly (111)-oriented nt-Cu will be presented.

关键词： nt-Cu (111)-oriented PCB electroplating

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Thermal Test Effect on Fan-out Wafer Level Package Strength 12

Thermal Test Effect on Fan-out Wafer Level Package Strength

引用

12th international microsystems, packaging, assembly and circuits technology conference (impact)

作者： Xu, Cheng Zhong, Z. W. Choi, W. K. Nanyang Technol Univ Sch Mech & Aerosp Engn 50 Nanyang Ave Singapore 639798 Singapore STATS ChipPAC Pte Ltd Singapore Singapore

ISBN: (纸本)9781538647196

Fan-out wafer level packaging technology becomes more and more popular and attractive of its flexibility for integration of diverse devices in a very small form factor and it is also a cost effective packaging solution. As fan-out wafer level package (FOWLP) is composed of various materials, the proper structural design and material selection are essential to achieve reliability requirements. In this study, FOWLP material especially the epoxy molding compound (EMC) thermal properties are evaluated to understand the effect of thermal factors on EMC strength. The long term thermal test is applied and the EMC flexure strength increases significantly after the high temperature storage test.

关键词： Electromagnetic compatibility Curing Passivation High-temperature superconductors Electronic packaging thermal management Semiconductor device reliability

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Thermal and Thermo-Mechanical Simulations on High Power Diode packaging for a Typical Power Adapter

Thermal and Thermo-Mechanical Simulations on High Power Diod...

引用

8th international microsystems, packaging, assembly and circuits technology conference (impact)

作者： Wu, Pei-Hsuan Wu, Zhong-Yi Tang, Hao-Chun Hu, Annie Kao, Jeff Lee, Robert Chen, Richard Chung, Harrison Lwo, Ben-Je Natl Def Univ Chung Cheng Inst Technol Dept Mechatron Energy & Aerosp Engn Taipei Taiwan Zowie Technol Corp Taipei Taiwan

ISBN: (纸本)9781479906673

To analyze thermal and thermo-stress behaviors of the diode packaging for high power applications, a global-local scheme through finite element simulations are performed in this study. To derive necessary boundary conditions and to verify the simulation results, thermal experiments are carried out for comparisons. New diode packaging designs are next proposed in this paper and their thermal resistance and structure stress are finally compared with the currently used ones to study the improvements.

关键词： Schottky diodes finite element analysis semiconductor device packaging thermal resistance thermomechanical treatment

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Combining Textiles and Electronics: Market Trend and Laundering Testing Challenges of E-Textiles (impact 2018) 13

Combining Textiles and Electronics: Market Trend and Launder...

引用

13th international microsystems, packaging, assembly and circuits technology conference (impact)

作者： Lo, Natalia Chen, Cheng Chih Lee, Dem Yao, Leo Lee, Jeffrey iST Integrated Serv Technol Inc San Jose CA 95131 USA

ISBN: (纸本)9781538656150

Modem wearables technology has evolved from smart watches into the field of e-textiles. E-textiles can be applied to various industries and applications, most notably in sports performance monitoring and digital healthcare, bringing in great opportunities. Compared to other wearables, e-textiles face more mechanical stresses and environmental challenges. While being electronics, e-textiles are also expected to be wearable and washable, just like common clothes. Only products which can withstand those stresses will be able to gain the greatest advantage in the e-textile market. This paper will identify some major applications of e-textiles, illustrating with actual examples in the market, and highlight the major challenges for e-textile development and production.

关键词： Monitoring Biomedical monitoring Intelligent sensors Medical services Textiles Reliability

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Multi-Chiplet Placement Design for 3D Integration 17

Multi-Chiplet Placement Design for 3D Integration

引用

17th international microsystems, packaging, assembly and circuits technology conference (impact)

作者： Chau, Mak Hoi Pan, Chung-Long Huang, Yu-Jung I Shou Univ Dept Elect Engn 1Sec 1Syuecheng Rd Kaohsiung 84001 Taiwan

ISBN: (数字)9781665452212

ISBN: (纸本)9781665452212

The main development trend of modern microelectronics is to continuously reduce product mass and dimension, and also increase their performance and reliability. The wide application of multichiplet architecture in high-performance computing clusters has aroused great interest. The multi-chiplet placement can influence the signal transmission behavior in a 3D integration architecture. Interchip communication has remained a major design factor due to the diverse traffic requirements in heterogeneous multi-chiplet systems. In general, to exploit the capabilities of a multi-chiplet architecture without I/O bottlenecks, dense vertical connections in stacked chips become of increasing importance in modern semiconductor technology. Consider a heterogeneous or homogeneous multi-chiplet architecture with a dense vertical connection system that gains a performance per energy benefit from fast state migration between these chiplets. In this paper, we study the effects of signal transmission on different chiplet placement designs, in which wirelessly connected multi-chiplets modules are proposed. The inter-chip wireless heterogeneous or homogeneous multi-chiplet architecture is modeled using a high-frequency structure simulator, in particular, the placement effect of the side differential vertical signal transmission is analyzed.

关键词： Wireless communication Micromechanical devices Three-dimensional displays Computer architecture packaging Market research Scattering parameters

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Non-Etching Adhesion Promoter for Dry Film for Semi-additive Manufacturing - Advanced Dry Film Pre-treatment

Non-Etching Adhesion Promoter for Dry Film for Semi-additive...

引用

8th international microsystems, packaging, assembly and circuits technology conference (impact)

作者： Tews, D. Michalik, F. Haidar, R. Thoms, M. Goh, Mengliau Li, Simon Atotech Deutschland GmbH Erasmusstr 20 D-10553 Berlin Germany Atotech China Chem Guangzhou 511356 Peoples R China

ISBN: (纸本)9781479906673

The technological development of new gadgets is a competitive race that consists of a continuous striving for additional features, higher performance and cost minimization. These needs drive the permanent requirement for new and revolutionary developments, especially in the IC-packaging industry. In this paper, findings from the development of a Non Etching Adhesion Promoter (NEAP) process, specifically for dry film pretreatment, are described and discussed. It also outlines detailed results that were obtained on process performance and the clear benefits to the industry of this new and innovative approach.

关键词： adhesion etching integrated circuit packaging

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The Experimental Measurement of Wire Sag of Long Wire Bonds for 3-dimensional and Multi-chip Module packaging

The Experimental Measurement of Wire Sag of Long Wire Bonds ...

引用

4th international microsystems, packaging, assembly and circuits technology conference

作者： Kung, Huang-Kuang Chen, Hong-Shong Jou, Jwo-Ming Hsu, Hsiang-Chen Cheng Shiu Univ Inst Engn Mech Taipei Taiwan I Shou Univ Dept Mech & Automat Engn Kaohsiung Taiwan

ISBN: (纸本)9781424443413

Concerns about wire sweep and wire sag on the applications of the 3-dimensional packaging technology in the multi-chip module systems have been highly raised recently. Because the interconnection distance of the multi-chip modules is usually longer than that in single-chip system. It had been proved by authors' previous studies that the longer the bond length and the higher the bond height of a wire bond, the smaller the sweep stiffness of the bond system. The lower sweep stiffness of the wire bond will always cause higher risk of wire sweep which may induce device shorting and/or current leakage leading to IC failure. Therefore, most of the studies in the literature focus on how to precisely predict the wire sweep for a specific profile of wire bond. For 3-dimensional and multi-chip packaging, excessive wire sag can lead to wire touch to the lower layer and then cause short circuit and failure of chips. This paper will mainly study the wire sag problem for long wire bonds applied in 3-dimensional and/or multi-chip module packaging. A definition of the sag stiffness of a wire bond will be proposed to represent the sag resistance of a specific profile of wire bond. Furthermore, the wire sag experiments of wire bonds will be conducted to verify with numerical analysis.

关键词： Microprocessor chips

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