In this paper, an energy-efficient and high performance ternary content addressable memory (TCAM) are presented. It employs the concept of "green" micro-architecture and circuit co-design. For achieving ener...
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In this paper, an energy-efficient and high performance ternary content addressable memory (TCAM) are presented. It employs the concept of "green" micro-architecture and circuit co-design. For achieving energy-efficient TCAM architecture, hierarchy search-line scheme and butterfly match-line scheme are proposed. Moreover, the match-lines are also implemented by noise-tolerant XOR-based conditional keeper and don't-care based power gating scheme to reduce not only search time but power consumption. In order to reduce increasing leakage power with advanced technologies, furthermore, the proposed TCAM design employs super cut-off power gating technique and multi-mode data-retention power gating technique to reduce leakage currents without reducing search time and destroying noise margin. An energy-efficient 256X144 TCAM array is implemented in TSMC 0.13um and designed in 65nm Berkeley Predictive Technology Model, respectively. The simulation results show the leakage power reduction is 70.7percent and energy metric of TCAM macro is 0.047 fJ/bit/search.
Emerging electronic assemblies are demanding lower cost, lighter weight, miniaturized packages mounted on thin flexible circuit boards and/or flex circuits. However, the flexible nature of these substrates poses new p...
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Emerging electronic assemblies are demanding lower cost, lighter weight, miniaturized packages mounted on thin flexible circuit boards and/or flex circuits. However, the flexible nature of these substrates poses new processing challenges forstandard surface mount assembly equipment A particular challenge issue is fixture tooling. The flexible substrate experiences significant transverse displacements under perpendicular assembly/fixturing forces during solder paste printing and componentplacement processes. The displacement results in mis-registration of the component leads and substrate bond pads, leading to assembly process defect'. Solder reflow process further complicates the issue due to the thermo-mechanical warpage inducedStandard assembly equipment utilizes dedicated tooling designed to handle rigid circuit board assemblies. As electronic assemblies move toward very fine pitch surface mount packages, chip scale packages, and flip chip attachment assembled to thin flexible double-sided circuit boards, reengineered and specialized dedicated tooling for fixturing flexible substrates in standard assembly equipment are becoming extremely important This paper focuses on developing analysis methodologies and theories forimplementing Smart Tooling. The primary goals being to determine the impact of fixturing on assembly process quality and to determine optimum fixturing configurations for thin flexible circuit board assemblies based on circuit design data (CAD). Amathematical model to describe both transverse and perpendicular displacements of flex substrates is developed and its close-form solution for transverse displacements is obtained Using a "near" optimum fixturing configuration to minimize transversedisplacements is verified
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