We have constructed a 640 x 512 pixel Liquid Crystal on Silicon microdisplay. We shall describe the application driving the device development, the display device and the technologyenhancements implemented for this a...
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A new thermosonic flip-chip bonding technology has been developed. It is compatible with wire bonding and eliminates the need of solder bumping on wafers. As a result, this technology could be applied to enhance Senio...
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A new thermosonic flip-chip bonding technology has been developed. It is compatible with wire bonding and eliminates the need of solder bumping on wafers. As a result, this technology could be applied to enhance Senior Design type of courses using flip-chip assembly to design, assemble and test innovative systems. The technology will be described with a list of different modules prototyped for microelectronics, optoelectronics, microwave/millimeter-wave, and microelectromechanical systems. We are looking for collaborators to investigate different possible curricular enhancements using this new technology.
We are constructing a head up display for an automotive application based on a smart pixel liquid crystal on silicon microdisplay. We describe the application driving the device development, the display device and the...
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We are constructing a head up display for an automotive application based on a smart pixel liquid crystal on silicon microdisplay. We describe the application driving the device development, the display device and the technologyenhancements implemented for this application.
The Conference materials contain 31 papers addressing optical techniques that have the potential for novel applications in computing. A majority of the papers address optical interconnects and optoelectronic arrays th...
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ISBN:
(纸本)0819406910
The Conference materials contain 31 papers addressing optical techniques that have the potential for novel applications in computing. A majority of the papers address optical interconnects and optoelectronic arrays that will enable electronic circuits to have optical I/O. Holographic and bit-addressable optical memories as well as optical computer architectures are the topics of the remaining papers.
Summary form only given. Load expert system (LES) formulates loads for individual infantry personnel at the squad level. The LES project was motivated by the historic soldier load problem an the Army's ongoing SIP...
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Summary form only given. Load expert system (LES) formulates loads for individual infantry personnel at the squad level. The LES project was motivated by the historic soldier load problem an the Army's ongoing SIPE (soldier integrated protective ensemble) project. Currently running on PCs and the SIPE computer, LES can be used to plan soldier loads and provide instruction in principles governing load planning. Two versions of load expert system have been fielded: a standard desktop version and a soldier's computer version. Several enhancements are projected for LES. Preliminary results suggest LES is a viable solution to both the traditional soldier load problem and special cases, such as the SIPE configuration. Proven expert system technology has been applied to a non-trivial problem to yield a tool that can increase the probability of mission success by anticipating the soldier's ideal load for given METT-T (mission, enemy, terrain, troops, time) conditions.< >
Vertical cavity surface emitting lasers (SELs) offer many desirable features that are suitable for applications in optical interconnect, optical signal processing, and opticalcomputing. We describe a GaAs vertical ca...
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ISBN:
(纸本)0819406910
Vertical cavity surface emitting lasers (SELs) offer many desirable features that are suitable for applications in optical interconnect, optical signal processing, and opticalcomputing. We describe a GaAs vertical cavity SEL with a novel structure and discuss those key laser performance characteristics, such as threshold current, power output, efficiency, far field divergence, and modulation response, that are important to these potential applications.
Epitaxial liftoff permits the integration of III-V films and devices onto arbitrary material substrates. This paper reviews Bellcore's work on optoelectronic integration of III-V optical transmitter and receiver d...
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ISBN:
(纸本)0819406910
Epitaxial liftoff permits the integration of III-V films and devices onto arbitrary material substrates. This paper reviews Bellcore's work on optoelectronic integration of III-V optical transmitter and receiver devices onto LiNbO3, glass, Silicon, and sapphire substrates.
Multimode stripe waveguides for optical interconnections in signal processors were fabricated in BGG31-glass and in 6F44-polyimide. The fabrication technologies were field assisted ion exchange for waveguides in glass...
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ISBN:
(纸本)0819406910
Multimode stripe waveguides for optical interconnections in signal processors were fabricated in BGG31-glass and in 6F44-polyimide. The fabrication technologies were field assisted ion exchange for waveguides in glass and spin coating followed by dry etching for polymeric waveguides. The waveguide dimensions were between 20 and 30 μm for the height and between 30 and 40 μm for the width. The attenuation was found to be 0.1 dB/cm in glass and 0.8 dB/cm in polyimide. Bends and intersections have been characterized.
In computing, trends toward parallel processing, multiprocessor computers, higher operating speeds, and larger as well as denser very large scale integrated (VLSI) circuits have provided an impetus for the development...
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ISBN:
(纸本)0819406910
In computing, trends toward parallel processing, multiprocessor computers, higher operating speeds, and larger as well as denser very large scale integrated (VLSI) circuits have provided an impetus for the development of advanced interconnection technology. optical interconnections have been of interest at all levels in digital computers for applications between mainframes, modules, boards, chips, and even points within a chip. optical interconnections are viewed both as a technology to be used in conjunction with electrical interconnections and electronic logic circuits and as an enabling technology for optical computers. These interconnections are expected to provide advantages in situations that require high speed, high interconnection density, high connectivity, and long distance. This paper is a review of Lincoln Laboratory work on free-space board-to-board optical interconnections.
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