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检索条件"任意字段=Proceedings of the Conference on Design, Automation and Test in Europe"

共 3808 条记录，以下是131-140 订阅

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Late Breaking Results: SoC-FPGA HW Trojan Leaking Data through EM Covert Channel

Late Breaking Results: SoC-FPGA HW Trojan Leaking Data throu...

引用

design, automation and test in europe conference and Exhibition

作者： Marie-Aïnhoa Nicolas Jordane Lorandel Christophe Moy Univ Rennes CNRS Rennes France

This paper demonstrates an attack exploiting an Electromagnetic (EM) leak coming from the SoC-FPGA I/O. A covert channel is created by a dedicated Hardware Trojan controlling the EM emanations between the DDR3L SDRAM ... 详细信息

ISBN: (数字)9783982674100

ISBN: (纸本)9798331534646

关键词： europe Hardware Pins Trojan horses SDRAM Security Electromagnetics

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A Novel Concept for Identifying Critical test Scenarios for the Validation of Automated Driving Functions

A Novel Concept for Identifying Critical Test Scenarios for ...

引用

2023 IEEE International Automated Vehicle Validation conference, IAVVC 2023

作者： Kurz, Clemens Knoch, Eva-Maria Gauterin, Frank Karlsruhe Institute of Technology Karlsruhe Germany

ISBN: (纸本)9798350322538

With the increasing automation of vehicles, the development and release process has become more elaborate and complex. To increase efficiency, methods have been developed to design targeted test scenarios to validate the function of the automated driving function. In addition, the description of the automated driving function as an operation space has become established. This offers new possibilities to analyze critical points within the ODD in order to test them in specific test scenarios. This paper shows a novel approach to identify test scenarios based on the used environmental sensors mapped on the automated driving function of the ODD. These test scenarios are defined with the 6-Layer-Model and sorted into the overall development process of the V-Model. © 2023 IEEE.

关键词： automation

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Evaluation of Silicon Nitride as Moisture Barrier Layer for Enhanced Reliability of IGBT Modules During HV-H3TRB test

Evaluation of Silicon Nitride as Moisture Barrier Layer for ...

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2023 International Exhibition and conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM europe 2023

作者： Gupta, Shoubhik Su, Arthur Coulbeck, Lee Wang, Yangang Dynex Semiconductor Ltd Lincoln United Kingdom

ISBN: (纸本)9783800760916

The robustness of power semiconductor modules in the harsh operating environment, especially in presence of moisture at high operating voltages is of crucial importance. Moisture can severely affect the module's performance and so it is necessary to design devices that can stop the moisture permeation. In this paper, we present the application of silicon nitride as a moisture barrier layer over the busbars that were not covered by metal. The modules with the nitride layer showed promising results during HVH3TRB test by passing the 1000 hours at 3600V and then later on also passed the residual blocking test. © VDE VERLAG GMBH · Berlin · Offenbach.

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Improving Chip design Enablement for Universities in europe – A Position Paper

Improving Chip Design Enablement for Universities in Europe ...

引用

design, automation and test in europe conference and Exhibition

作者： Lukas Krupp Ian O'Connor Luca Benini Christoph Studer Joachim Rodrigues Norbert Wehn RPTU University of Kaiserslautern-Landau École Centrale de Lyon ETH Zurich University of Bologna Lund University

ISBN: (数字)9783982674100

ISBN: (纸本)9798331534646

The semiconductor industry is pivotal to europe's economy, especially within the industrial and automotive sectors. However, europe faces a significant shortfall in chip design capabilities, marked by a severe skilled labor shortage and lagging contributions in the design value chain segment. This paper explores the role of european universities and academic initiatives in enhancing chip design education and research to address these deficits. We provide a comprehensive overview of current european chip design initiatives, analyze major challenges in recruitment, productivity, technology access, and design enablement, and identify strategic opportunities to strengthen chip design capabilities within academic institutions. Our analysis leads to a series of recommendations that highlight the need for coordinated efforts and strategic investments to overcome these challenges.

关键词： Productivity Industries Technological innovation Electronics industry Education europe Stakeholders Chip scale packaging Recruitment Investment

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Programming Companion 2024 - proceedings of the 8th International conference on on the Art, Science, and Engineering of Programming

Programming Companion 2024 - Proceedings of the 8th Internat...

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8th International conference on on the Art, Science, and Engineering of Programming, Programming Companion 2024

ISBN: (纸本)9798400706349

The proceedings contain 20 papers. The topics discussed include: containers for GUI models;towards a DevOps modeling based on context-oriented programming;the next-gen interactive runtime simulator for neural network programming;ironies of programming automation: exploring the experience of code synthesis via large language models;magic markup: maintaining document-external markup with an LLM;faster feedback with AI? a test prioritization study;virtual machines: should we keep doing them?;retro-fitting garbage collection into rust;Tinyrossa: a compiler framework for vertical, verified construction of Smalltalk VMs;BoaSpect: an expressive instrumentation platform for JavaScript;design of flexible code block comparisons to improve code review of refactored code;and implementing Babylonian/G by putting examples into game contexts.

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Research on Load Transfer Law of Artillery Equipment under Complex Boundary Conditions

Research on Load Transfer Law of Artillery Equipment under C...

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2024 lEEE International conference on Advanced Information, Mechanical Engineering, Robotics and automation, AIMERA 2024

作者： Ren, Can Gao, Hua Shan, Chunlai Liu, Jun Gu, Bin Wu, Yingchao Northwest Institute of Mechanical and Electrical Engineering Simulation and Test Technology Xianyang China

ISBN: (纸本)9798350343335

This article focuses on the problem of load transfer during artillery firing under different soil boundary conditions, considering the complex boundary coupling effect and the law of system load transfer and boundary influence. On the basis of traditional dynamic simulation methods, a combination of spatial springs and damping friction is used to simulate the deformation behavior of soil. This system is used to establish equivalent displacement conditions for soil boundaries. Subsequently, efficient and high-precision dynamic modeling research was conducted on artillery. The parameter values of the boundary combination model are determined by solving the fitting test data through dynamic simulation, forming a soil boundary submodel. A large caliber self-propelled gun is tested and compared with the high-speed camera monitoring results of the vehicle displacement, parking hoe displacement, and hydraulic oil pressure monitoring results of the parking hoe during the shooting test. The simulation results meet the accuracy requirements. Compared with the traditional multi-body dynamics model, this method has higher simulation accuracy and does not increase the simulation complexity and computational scale, which can be applied to the development of the same type of artillery equipment to improve the simulation and design efficiency in the process of artillery equipment development. © 2024 IEEE.

关键词： High speed cameras

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design and simulation of hydraulic system of pitch propeller seal test platform 3

Design and simulation of hydraulic system of pitch propeller...

引用

3rd International conference on New Materials, Machinery, and Vehicle Engineering, NMMVE 2024

作者： Hu, Xiangdong Zhu, Xuebiao Wuhan University of Science and Technology School of Mechanical Automation Hubei Wuhan430000 China

ISBN: (纸本)9781510686267

A test bench for testing the sealing performance of pitching paddle is designed, which can perform pressure test on the main sealing parts such as transom and paddle hub. The piston of the digital hydraulic cylinder is connected in series with the piston of the piston of the piston cylinder, and the displacement of the piston of the piston cylinder is controlled by controlling the displacement of the digital hydraulic cylinder, which in turn controls the pressure in the experimental chamber. Simulation study of its hydraulic circuit using AMESim simulation software. The experimental results show that the system can accurately load experimental cavities of different volume sizes, and hold pressure for a certain period of time after loading is completed according to the requirements. Determine whether the sealing performance meets the requirements by comparing the pressure change before and after holding pressure. The device improves detection accuracy and efficiency and guarantees the safety of the shipping process. © 2024 SPIE.

关键词： Propellers

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design of civil aircraft ground function test system based on DDS communication 5

Design of civil aircraft ground function test system based o...

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2023 5th International conference on Information Science, Electrical, and automation Engineering, ISEAE 2023

作者： Zhang, Bo Wang, Changfa Yang, Qinghua School of Mechanical Engineering and Automation Shanghai University Shanghai200444 China

ISBN: (纸本)9781510667440

With the increasing automation of aircraft ground assembly integration testing, the progress of aircraft ground function testing is severely impacted by the multitude of devices, types, and interfaces present at civil aircraft final assembly sites. Some devices even lack communication interfaces. Embedded system-based interlayer cooperative interaction is a general trend and the future development direction. It is urgent to enable data interaction between the hardware and software layers using advanced embedded microprocessor technology. To address this challenge, this paper proposes a Mirco XRCE-DDS (EXtremely Resource Constrained Environments DDS) solution based on eProsima that adheres to the OMG (Object Management Group) specification and is suitable for resource-limited equipment, to facilitate the design of civil aircraft ground function testing systems © COPYRIGHT SPIE. Downloading of the abstract is permitted for personal use only.

关键词： Integration testing

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Spatial Modeling with Automated Machine Learning and Gaussian Process Regression Techniques for Imputing Wafer Acceptance test Data

Spatial Modeling with Automated Machine Learning and Gaussia...

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2025 design, automation and test in europe conference, DATE 2025

作者： Wei, Ming-Chun Shen, Chun-Wei Hsieh, Hsun-Ping National Cheng Kung University Department of Electrical Engineering Tainan Taiwan Academy of Innovative Semiconductor and Sustainable Manufacturing National Cheng Kung University Tainan Taiwan

ISBN: (纸本)9783982674100

The Wafer Acceptance test (WAT) is a significant quality control measurement in the semiconductor industry. However, because the WAT process can be time-consuming and expensive, sampling test is commonly employed during production. This makes root cause tracing impossible when abnormal products have not been tested. Therefore, in our study, we focus on establishing a reliable method to estimate WAT results for non tested shots, including both intra and inter-wafer prediction. Notably, we are the first to combine the use of Chip Probing data with WAT to improve the predictions. Our proposed method first extracts valuable features from Chip Probing test results by using the Automated Machine Learning technique. We then employ Gaussian Process Regression to capture the spatiotemporal correlation. Finally, we adopted the linear regression model to ensemble two components and proposed a SMART-WAT model to effectively estimate the wafer acceptance test data. Our method has been tested on a real-world dataset from the semiconductor manufacturing industry. The prediction results of four key WAT parameters indicate that our proposed model outperforms the state-of-the-art methods in both intra and inter-wafer prediction. © 2025 EDAA.

关键词： Acceptance tests

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RESEARCH on the application of BIT technology in the test and launch control system of new generation launch vehicle 4

RESEARCH on the application of BIT technology in the test an...

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4th International conference on Mechanical, Electronics, and Electrical and automation Control, METMS 2024

作者： Xu, Cong Xu, Pengfei Ling, Zhen Sui, Qiangqiang Weng, Zeyu Li, Na Xu, Min Beijing Aerospace Automatic Control Institute Beijing No.50 Yongding Road Haidian District Beijing100854 China Xi'an North Huian Chemical Industries co. Ltd. YuXia town Huyi District Xi'an710302 China

ISBN: (数字)9781510679887

ISBN: (纸本)9781510679870

In response to the urgent need for high-density launches, rapid testing, and cost-effective operations in launch vehicle technology, heightened requirements have been placed on test and launch control system in terms of miniaturization, universality, standardization, testability, and maintainability. test and launch control system based on LRM (Line Replaceable Modules) modules have emerged as a primary development direction for the new generation of launch vehicle systems. A critical issue to address is the application of BIT (Built-In test) technology in LRM-based systems. This paper introduces the architecture of the LRM-based test and launch control system, followed by an in-depth analysis of the application of BIT technology in terms of design principles, foundational theories, and operational modes. We propose a Three-Level BIT approach for the test and launch control system, providing a detailed description of its implementation. Applied to a specific model of launch vehicle test and control system, our testing results demonstrate that this method significantly enhances the system's self-diagnostic capabilities. This research offers robust technical support for the development and operation of high-quality, efficient, and cost-effective next-generation launch vehicle test and launch control system, underscoring their significant value and wide-ranging potential applications in the field of aerospace. © 2024 SPIE.

关键词： Launch vehicles

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