PurposeBased on the micro-electro-mechanical system (MEMS) technology, acoustic emission sensors have gained popularity owing to their small size, consistency, affordability and easy integration. This study aims to pr...
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PurposeBased on the micro-electro-mechanical system (MEMS) technology, acoustic emission sensors have gained popularity owing to their small size, consistency, affordability and easy integration. This study aims to provide direction for the advancement of MEMS acoustic emission sensors and predict their future potential for structural health detection of microprecision instruments. Design/methodology/approachThis paper summarizes the recent research progress of three MEMS acoustic emission sensors, compares their individual strengths and weaknesses, analyzes their research focus and predicts their development trend in the future. FindingsPiezoresistive, piezoelectric and capacitive MEMS acoustic emission sensors are the three main streams of MEMS acoustic emission sensors, which have their own advantages and disadvantages. The existing research has not been applied in practice, and MEMS acoustic emission sensor still needs further research in the aspects of wide frequency/high sensitivity, good robustness and integration with complementary metal oxide semiconductor. MEMS acoustic emission sensor has great development potential. Originality/valueIn this paper, the existing research achievements of MEMS acoustic emission sensors are described systematically, and the further development direction of MEMS acoustic emission sensors in the future research field is pointed out. It provides an important reference value for the actual weak acoustic emission signal detection in narrow structures.
The integration of tactile and proximity sensors enhances our ability to perceive and interact with both touchable and touch-free objects within our environment. Flexible electronics technology, particularly in capaci...
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The integration of tactile and proximity sensors enhances our ability to perceive and interact with both touchable and touch-free objects within our environment. Flexible electronics technology, particularly in capacitive sensing, provides an ideal foundation for developing advanced tactile-proximity sensors. In this study, we present an integrated capacitive tactile-proximity sensor that combines with complementary metal-oxide-semiconductor (CMOS) readout circuitry to achieve enhanced sensitivity and system miniaturization. By utilizing four metal layers from two flexible substrates available through commercial technology, we efficiently fabricate an 8 x 8 tactile sensor array integrated with proximity sensing capabilities. Finite-element simulations are conducted to validate the measured data. Experiment results demonstrate that the tactile sensors achieve an average sensitivity of 2.2 MPa-1 with a resolution of 255 Pa, while the proximity sensing exhibits a detection range of approximately 15 mm with a resolution better than 1.9 mu m. These findings demonstrate the significant potential of flexible tactile-proximity sensors for applications requiring high sensitivity and precision in detection.
Precise patterning of sensing materials, particularly the long-range-ordered assembly of micro/nanostructures, is pivotal for improving sensor performance, facilitating miniaturization, and enabling seamless integrati...
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Precise patterning of sensing materials, particularly the long-range-ordered assembly of micro/nanostructures, is pivotal for improving sensor performance, facilitating miniaturization, and enabling seamless integration. This paper examines the importance of interfacial confined assembly in sensor patterning, including gas-liquid and liquid-liquid confined assembly, wettability-assisted or microstructure-assisted solid-liquid interfacial confined assembly, and tip-induced confined assembly. The application of capillary bridge confined assembly technology in chemical sensors, flexible electronics, and optoelectronics is highlighted. The advantages of capillary bridge confined assembly technology include the ability to achieve high-resolution patterning, scalability, and material arrangement in long-range order. It is, therefore, an ideal processing platform for next-generation sensors. Finally, the broad prospects of this technology in the miniaturization and integration of high-performance multifunctional sensors are discussed.
作者:
Wang, ChangxiWu, TongWang, TingLi, KangSichuan Univ
West China Hosp West China Biomed Big Data Ctr Chengdu 610041 Sichuan Peoples R China Sichuan Univ
Medx Ctr Informat Chengdu Peoples R China Sichuan Univ
Pittsburgh Inst Chengdu Peoples R China Sichuan Univ
West China Hosp Ctr Biostat Design Measurement & Evaluat CBDME Chengdu Sichuan Peoples R China
Multiple sensors are commonly used for accelerated degradation monitoring. Since different sensors may be sensitive at different stages of the accelerated degradation process and each sensor dataset may contain only p...
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Multiple sensors are commonly used for accelerated degradation monitoring. Since different sensors may be sensitive at different stages of the accelerated degradation process and each sensor dataset may contain only partial information of the unit degradation, then integration approaches of the accelerated degradation data from multiple sensors can effectively improve degradation modeling and life prediction accuracy. We present a non-parametric approach that assigns weights to each sensor based on the dynamic clustering of the sensors' observations. Missing data are common in degradation data acquisition, especially when multiple sensors are used. We provide two approaches for data interpolation: the nonlinear Brownian bridge and the inverse Gaussian bridge when the underlying degradation paths follow the Brownian motion process and inverse Gaussian process, respectively. The stochastic bridges capture the nonlinearity and uncertainties of the degradation processes. The data integration model and stochastic bridge models are validated with real accelerated fatigue crack growth data monitored with multiple NDT sensors. The proposed models provide an accurate accelerated degradation path and reliability prediction.
The automotive industry's advancements in road safety through sensors, actuators, and customized networks are challenged by increasing accidents, particularly in vehicles operating in autopilot mode. A significant...
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The automotive industry's advancements in road safety through sensors, actuators, and customized networks are challenged by increasing accidents, particularly in vehicles operating in autopilot mode. A significant concern is the ability to tamper with sensor data through low-power electromagnetic interference (EMI) without physical contact. This article focuses on the physical layer of vehicular networks, investigating the risk of misleading sensor data caused by deliberate EMI targeting critical subsystems. Through experiments on ultrasonic and crankshaft sensors, we developed an EMI injection unit and detection unit to evaluate the potential for sensor hacking and its impact on vehicle safety. Our findings reveal that current onboard diagnostics (OBDs) cannot detect these EMI-based attacks. To address this gap, we propose SecureTrack, an EMI detection and alert system that effectively identifies interference attempts in real time. Using a microantenna system and an embedded advanced virtual reduced instruction set computer (AVR) microcontroller, our system measures EMI strength and resonant voltage. Furthermore, the Internet of Things (IoT)-based integration enhances vehicle safety by enabling OBD and central control centers to tackle such threats. To the best of authors' knowledge, this is the first system developed to detect and alert against EMI attacks on automotive sensors, marking a significant advancement in the field of vehicular security.
The demand for optically transparent temperature sensors in intelligent devices is ***,the performance of these sensors,particularly in terms of their sensitivity and resolution,must be further *** study introduces a ...
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The demand for optically transparent temperature sensors in intelligent devices is ***,the performance of these sensors,particularly in terms of their sensitivity and resolution,must be further *** study introduces a novel transparent and highly sensitive temperature sensor characterized by its ultrathin,freestanding design based on a Mn-Co-Ni-O *** Mn-Co-Ni-O-based sensor exhibits remarkable sensitivity,with a temperature coefficient of resistance of−4%℃^(−1),and can detect minuscule temperature fluctuations as small as 0.03℃.Additionally,the freestanding sensor can be transferred onto any substrate for versatile application while maintaining robust structural stability and excellent resistance to interference,indicating its suitability for operation in challenging *** practical utility in monitoring the surface temperature of optical devices is demonstrated through vertical integration of the sensor and a micro light-emitting diode on a polyimide ***,an experiment in which the sensor is implanted in rats confirms its favorable biocompatibility,highlighting the promising applications of the sensor in the biomedical domain.
In the transformation of future smart agriculture paradigms, Internet of Things (IoT) technology is regarded as a pivotal factor driving environmental perception in farming. Chipless radio frequency identification (CR...
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In the transformation of future smart agriculture paradigms, Internet of Things (IoT) technology is regarded as a pivotal factor driving environmental perception in farming. Chipless radio frequency identification (CRFID) technology is a potential technology that will bring huge added value to advanced passive IoT-based sensing systems. However, developing CRFID sensors with controllable modes and integrated multiparameter integration remains a major challenge. In this article, we propose a novel reconfigurable four-port antenna-based sensor with multiparameter characteristics. By integrating multiple sensor arrays designed with special sensitive materials on the same plane, we achieve flexible channel reuse and sensing mode reconstruction. The sensor is completely passive and reusable, enabling long-term synchronous sensing and information transmission in critical areas where power supply is difficult to obtain. The small dimensions of the sensor increase susceptibility to coupling interference in multichannel and multiple sensing unit array designs. Therefore, we jointly optimize the sensor's structure and layout to enhance isolation between sensor elements. Finally, we design and demonstrate a passive sensing system for monitoring relative humidity (hereafter called humidity) and pH levels, and verify the potential value of the passive multiparameter sensing system in future precision agriculture (PA) applications through experiments.
The aerospace industries demand for advanced materials necessitates stringent quality control measures, particularly for composite structures to ensure optimal curing and structural integrity. Traditional methods like...
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The aerospace industries demand for advanced materials necessitates stringent quality control measures, particularly for composite structures to ensure optimal curing and structural integrity. Traditional methods like differential scanning calorimetry (DSC) and dynamic mechanical analysis, while useful, are limited to laboratory settings. This study explores the use of a printed paper-based sensor for real-time cure monitoring of glass fiber-reinforced phenol-formaldehyde (PF/GF) prepregs. The sensor, composed of a cellulose paper substrate with screen-printed electrodes, offers flexibility, ease of integration, and cost-effectiveness compared to commercial polymer-based dielectric sensors. Real-time monitoring with the printed paper-based sensor was conducted at temperatures ranging from 130 to 180 degrees C, both with and without pressure, and validated against DSC and Fourier-transform infrared (FTIR) spectroscopy. The results showed a strong correlation between real-time monitoring and the DSC prediction model, as well as FTIR spectroscopy. Notably, the real-time monitoring revealed a shorter curing cycle on the production line than the predicted cure kinetic model, which is crucial for large-scale production, such as fabricating honeycomb panels for aircraft interiors. This research underscores the importance of innovative sensor technologies in improving quality control and manufacturing efficiency in aerospace *** Cure Monitoring of PF-based prepregs was carried out using paper-based sensor. sensor offered reproducibility and seamless integration in composites. sensor data showed a strong correlation with DSC and FTIR spectroscopy results. Paper sensors enable online monitoring of composite in aerospace manufacturing.
This work presents a high-sensitivity angular displacement sensor using microstrip technology. The sensor configuration includes a stator that incorporates a quarter-wavelength angular segment, which is short-circuite...
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This work presents a high-sensitivity angular displacement sensor using microstrip technology. The sensor configuration includes a stator that incorporates a quarter-wavelength angular segment, which is short-circuited through a via-hole. The rotor is designed as a transmission line, precisely aligning with the stator's angular segment to ensure optimal interaction. This article provides a comprehensive description of the design methodology and presents the equivalent electrical circuit. In addition, detailed simulation and measurement results are included. To ensure accuracy, the sensor underwent multiple measurements, which were statistically analyzed. The sensor achieves a dynamic range (DR) of 160 degrees, exhibiting excellent linearity across this range and a high sensitivity of 4.7 MHz/degrees. It also demonstrates a resolution of 2 degrees and maintains precision for each indicated angle, with an average standard deviation of 2.243 x 10(-2) GHz. Due to its single-port design, this sensor is particularly well-suited for seamless integration as a sensor node within wireless sensor networks (WSNs).
A displacement measurement technology that integrates a sensor structure with the component being tested is proposed to address the challenges posed by limited sensor installation in small and compact spaces, and comp...
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A displacement measurement technology that integrates a sensor structure with the component being tested is proposed to address the challenges posed by limited sensor installation in small and compact spaces, and complex electromagnetic environments with intelligent equipment. The sensor comprises a moving-grid shaft and two static-grid rings, wherein the capacitance varies with displacement when they undergo relative motion. By gathering data from two capacitors, a mapping relationship between the sets of capacitors and unique displacements is established, enabling displacement calibration. The feasibility of the sensor is demonstrated through the development of a mathematical model, simulation, and experimental validation. The results demonstrate that the measured capacitance aligns with the simulated value, confirming that our dual-channel capacitance test and calibration scheme are feasible at the same time, and the error between the displacement test and the true value is less than 6% in the selected range. This reasonable and feasible displacement testing scheme combines a capacitive grid sensor with the reciprocating linear motion of the shaft components to achieve integration between a sensor structure and the measured component.
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