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applications of Electronic Imaging Systems 1978

作者： Hirschberg, Irving Imaging Systems Division Fairchild Camera and Instrument Corp. SyossetNY11791 United States

A solid state (Charge Coupled Device) imaging system is described which satisfies the requirement for multispectral, high resolution, real time imagery. The system, using an earth resources survey satellite as its platform is configured to yield a 10 meter ground resolution with a 50 kilometer swath width at approximately 1000 km altitude. Four spectral bands ranging from 0.5 to 1.1 μm have been selected and are implemented by optically butting three 1728 pixel linear arrays (5184 pixel per band) on appropriate beam splitting prisms. The device employed, the Fairchild CCD 121H, shown in Figure 1, is a monolithic self-scanned image sensor utilizing two phase, buried n-channel CCD technology. The device has an element-to-element pitch of 13 μm (approximately 2000 pixel/inch) and has been demonstrated to have a wide dynamic range (2500:1), Figure 2, low noise equivalent exposure and dimensionally precise photosite spacing. Consideration of focal plane design, geometric accuracy, image registration, temperature control, optical design, and noise figures are discussed. Particular emphasis has been placed on the unique properties of CCD detectors which allow for specialized post processing of the video for dealing with low contract scenarios. The paper concludes with new trends in specialized time delay and integration (TDI) mode imaging systems now under study and development at Fairchild. © 1978 SPIE. All rights reserved.

关键词： Charge coupled devices

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A Scalable and Adaptable Probabilistic Model Embedded in an Electronic Nose for Intelligent sensor Fusion 11

A Scalable and Adaptable Probabilistic Model Embedded in an ...

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11th IEEE Annual Biomedical Circuits and Systems Conference (BioCAS)

作者： Tang, Chen-Ting Huang, Cheng-Ming Tang, Kea-Tiong Chen, Hsin Natl Tsing Hua Univ Dept Elect Engn Hsinchu 30013 Taiwan

ISBN: (纸本)9781479972340

The electronic nose (eNose) mimicking the mammalian olfactory system has each sensor respond to different odours to different extents. However, the real environment contains multiple odours interacting with each other, such that the sensory signals of an eNose exhibit high variability and the responses to different odours usually overlap with each other. This paper presents the development of a scalable and adaptable probabilistic model for recognising eNose signals and realising the model as customer- designed integrated circuits. The scalability refers to interconnecting multiple chips to form a large network of probabilistic model for processing high-dimensional sensory signals, or to form a multi-expert system that is able to estimate the likelihood of belonging to different types of odours. The latter case could provide extra information for clinical diagnosis. Furthermore, on-chip adaptability is incorporated to learn new data distribution or variability in real time. By integrating the adaptable probabilistic model with eNose sensor arrays, analog-to-digital converters, and a digital processor on a single chip, an intelligent eNose microsystem will be formed for a variety of biomedical applications.

关键词： probabilistic models recognising eNose signals scalable architecture on-chip learning ability

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Antenna-coupled microbolometers for multi-spectral infrared imaging

Antenna-coupled microbolometers for multi-spectral infrared ...

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32nd Conference on Infrared Technology and applications

作者： Weling, Aniruddha S. Henning, Patrick F. Neikirk, Dean P. Han, Sangwook Foster Miller Inc 195 Bear Hill Rd Waltham MA 02451 USA Univ Texas Austin Dept Elect & Comp Engn Austin TX 78712 USA

ISBN: (纸本)0819462624

Although the rapid development of 2-D focal plane arrays of thermal infrared (IR) detectors has led to remarkable progress in uncooled IR imaging technology, a major limitation of these sensors is the lack of true on-chip spectral discrimination. Multi-spectral detection capabilities enable rapid, efficient and multi-dimensional scene interpretation that is especially beneficial to advanced IR imaging systems for early threat warning and target recognition applications. We propose a novel design for a monolithic micromachined array of bolometric detectors capable of multi-spectral imaging in the long-wave IR (7-14 mu m) region. The central ingredient of this approach is to employ planar multi-mode antenna structures to efficiently couple incident electromagnetic radiation to a microbolometeric sensing element that is much smaller than the IR wavelength. The wavelength selectivity of such an antenna-coupled detector can be tuned by optimizing its multiple geometric parameters. We present a planar microbolometer design that can accomplish 3-color LWIR imaging with no moving parts analogous to solid-state color videography in the visible region. The proposed effort targets applications of uncooled color IR imaging where the benefits in space, power, weight and complexity will have a significant impact.

关键词： infrared imaging multi-spectral thermal detector microbolometer array FPA sensor

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High-resolution 3D imaging laser radar flight test experiments

High-resolution 3D imaging laser radar flight test experimen...

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Conference on Laser Radar Technology and applications X

作者： Marino, RM Davis, WR Rich, GC McLaughlin, JL Lee, EI Stanley, BM Burnside, JW Rowe, GS Hatch, RE Square, TE Skelly, LJ O'Brien, M Vasile, A Heinrichs, RM MIT Lincoln Lab Lexington MA 02420 USA

ISBN: (纸本)0819457760

Situation awareness and accurate Target Identification (TID) are critical requirements for successful battle management. Ground vehicles can be detected, tracked, and in some cases imaged using airborne or space-borne microwave radar. Obscurants such as camouflage net and/or tree canopy foliage can degrade the performance of such radars. Foliage can be penetrated with long wavelength microwave radar, but generally at the expense of imaging resolution. The goals of the DARPA Jigsaw program include the development and demonstration of high-resolution 3-D imaging laser radar (ladar) sensor technology and systems that can be used from airborne platforms to image and identify military ground vehicles that may be hiding under camouflage or foliage such as tree canopy. With DARPA support, MIT Lincoln Laboratory has developed a rugged and compact 3-D imaging ladar system that has successfully demonstrated the feasibility and utility of this application. The sensor system has been integrated into a UH-1 helicopter for winter and summer flight campaigns. The sensor operates day or night and produces high-resolution 3-D spatial images using short laser pulses and a focal plane array of Geiger-mode avalanche photo-diode (APD) detectors with independent digital time-of-flight counting circuits at each pixel. The sensor technology includes Lincoln Laboratory developments of the microchip laser and novel focal plane arrays. The microchip laser is a passively Q-switched solid-state frequency-doubled Nd:YAG laser transmitting short laser pulses (300 ps FWHM) at 16 kilohertz pulse rate and at 532 nm wavelength. The single photon detection efficiency has been measured to be > 20% using these 3202 Silicon Geiger-mode APDs at room temperature. The APD saturates while providing a gain of typically > 106. The pulse out of the detector is used to stop a 500 MHz digital clock register integrated within the focal-plane array at each pixel. Using the detector in this binary response mode simp

关键词： sensors LIDAR 3D image processing Camouflage Pulsed laser operation Staring arrays Stereoscopy Imaging systems 3D acquisition Avalanche photodetectors

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Novel all-silicon sensor structure with integrated poly-Si electrodes

Novel all-silicon sensor structure with integrated poly-Si e...

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18th Annual International Conference of IEEE Engineering-in-Medicine-amd-Biology-Society

作者： Montelius, L Ling, TGI Tegenfeldt, JO Univ Lund Dept Solid State Phys S-22100 Lund Sweden

ISBN: (纸本)078033812X

The interest in miniaturization of modern chemical and medical sensors is steadily increasing. However, when employing methods and fabrication procedures especially developed for microelectronics, one may encounter new and unpredictable problems for applications in aqueous media. For instance, in microelectronics often a dual metal layer system is employed for making electrical contacts. In a solution such a contact may result in galvanic reactions and/or may dissolve in the cleaning agents used for sterilization of medical devices. To address such issues we have employed an all-silicon based process technology for fabrication of sturdy and reliable devices with integrated poly-Silicon electrodes that tolerate most chemical environments. In this presentation we will report on the first results using such electrodes. A comparative study between identical poly-Si and Aluminium electrodes was made in order to investigate the usefulness of poly-Si electrodes. We will also demonstrate the nice possibility to use wall-documented methods for surface modifications using silane coupling chemistry. We believe this added benefit for the silicon based electrodes of easy surface modification processes, as compared with metal electrodes, to be extremely valuable for the development of accurate and tailored sensor structures for specific applications.

关键词： Microelectrodes

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CCD controller requirements for ground-based optical astronomy

CCD controller requirements for ground-based optical astrono...

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solid state sensor arrays and CCD Cameras

作者： Leach, Robert W. San Diego State Univ. San Diego CA USA

ISBN: (纸本)081942028X

Astronomical CCD controllers are being called upon to operate a wide variety of CCDs in a range of ground-based astronomical applications. These include operation of several CCDs in the same focal plane (mosaics), simultaneous readout from two or four corners of the same CCD (multiple readout), readout of only a small region or number of regions of a single CCD (sub-image or region of interest readout), continuous readout of devices for drift scan observations, differential imaging for low contrast polarimetric or spectroscopic observations and very fast readout of small devices for wavefront sensing in adaptive optics systems. These applications all require that the controller electronics not contribute significantly to the readout noise of the CCD, that the dynamic range of the CCD by fully sampled (except for wavefront sensors), that the CCD be read out as quickly as possible from one or more readout ports, and that considerably flexibility in readout modes (binning, skipping and signal sampling) and device format exist. A further requirement imposed by some institutions is that a single controller design be used for all their CCD instruments to minimize maintenance and development efforts. A controller design recently upgraded to meet these requirements is reviewed. It uses a sequencer built with a programmable DSP to provide user flexibility combined with fast 16-bit A/D converters on a programmable video processor chain to provide either fast or slow readouts.

关键词： Cameras

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Ultrafast correlation image sensor: concept, design, and applications

Ultrafast correlation image sensor: concept, design, and app...

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International Conference on solid state sensors and Actuators (TRANSDUCERS)

作者： S. Ando T. Nakamura T. Sakaguchi University of Tokyo Tokyo Japan University of Tokyo Japan Tokyo Daigaku Bunkyo-ku Tokyo JP

This paper proposes a new type of image sensor on which correlation detectors between incident lights and electronic signals are integrated as a 2-D array. This architecture is characterized by: 1) photodiodes for converting incident photons to currents (multiplicands), 2) one or a few external electric signals (multipliers) which are common to all pixels, 3) multipliers of the photo currents and the external signals, 4) capacitors for accumulating the products as the correlation results, and 5) CCD or MOS switching networks for scanning out the correlation results. Several design and applications of the sensor are demonstrated.

关键词： Image sensors Bandwidth Optical modulation Lighting sensor arrays Charge coupled devices MOS capacitors Spatial resolution Voltage Optical arrays

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Combining nanoimprint lithography with dynamic templating for the fabrication of dense, large-area nanoparticle arrays

Combining nanoimprint lithography with dynamic templating fo...

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作者： Golze, Spencer D. Temple University

学位级别：M.S.

The study of nanomaterials is a developing science with potentially large benefits in the development of catalysts, optical and chemical sensors, and solid state memory devices. As several of these devices require large arrays of nanoparticles, one of the greatest obstacles in material characterization and device development is the reliable manufacture of nanopatterns over a large surface area. In addition, various applications require different nanoparticle size and density. High density arrays with small nanoparticle sizes are difficult to achieve over a large surface area using current manufacturing processes. Herein, Nanoimprint Lithography (NIL) and Dynamic Templating are combined to create a new manufacturing process capable of developing high density arrays with small nanoparticle sizes. The NIL process involves the stamping of a polymer coated substrate by a silicon stamp with patterned nanofeatures. The stamp is then removed, leaving the pattern in the polymer, which is first etched and then coated with a thin layer of metal, filling the recessed regions of the pattern. The excess polymer is dissolved, leaving a pattern of nanoparticles on the substrate matching the pattern on the stamp. When Dynamic Templating is applied, a very thin layer of metal can be coated, which forms small nanoparticle sizes when dewetted. A custom NIL system has been developed to combine these two processes together, which has now proven to yield consistent large-area, dense arrays with a small nanoparticle size. An array spacing of 700 nm has been achieved, along with a nanoparticle size of 90 nm. arrays have been created in gold and palladium, where there is now the potential to combine them with other solution-based syntheses which should lead to complex nanoparticle geometries suitable for sensor applications.

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Active sensor system for automatic rendezvous and docking

Active sensor system for automatic rendezvous and docking

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Laser Radar Technology and applications II

作者： Howard, Richard T. Bryan, Thomas C. Book, Michael L. Jackson, John L. NASA Marshall Space Flight Cent. Huntsville AL USA

ISBN: (纸本)0819424803

NASA's Marshall Space Flight Center has developed an active sensor system, the ideo guidance sensor (VGS), to provide near-range relative position and attitude data. The VGS will be part of an automatic rendezvous and docking system. The VGS determines the relative positions and attitudes between the active sensor and the passive target. It works by using laser diodes to illuminate the retro-reflectors in the target, a solid-state camera to detect the return from the target retro-reflectors, and a frame grabber and digital signal processor to convert the video information into relative positions and attitudes. The current sensor design is the result of several years of development and testing, and it is being built to fly as an experiment payload on the space shuttle. The VGS system is designed to operate with the target completely visible within a relative azimuth of ± 10.5 degrees and a relative elevation of ± 8 degrees. The system will acquire and track and target within that field-of-view anywhere from 1.0 meters to 110 meters range at any relative roll angle and relative pitch and yaw attitudes of up to ± 10 degrees. The data is output from the sensor at 5 Hz, and the target and sensor software have been designed to permit two independent sensors to operate simultaneously for redundancy.

关键词： Optical sensors

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Quantum efficiency and dark current evaluation of a backside illuminated CMOS image sensor

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JAPANESE JOURNAL OF APPLIED PHYSICS 2015年第4期54卷 4DE09.1-4DE09.6页

作者： Vereecke, Bart Cavaco, Celso De Munck, Koen Haspeslagh, Luc Minoglou, Kyriaki Moore, George Sabuncuoglu, Deniz Tack, Klaas Wu, Bob Osman, Haris IMEC B-3001 Leuven Belgium Poongsan Corp CA Branch Sunnyvale CA 94085 USA

We report on the development and characterization of monolithic backside illuminated (BSI) imagers at imec. Different surface passivation, anti-reflective coatings (ARCs), and anneal conditions were implemented and their effect on dark current (DC) and quantum efficiency (QE) are analyzed. Two different single layer ARC materials were developed for visible light and near UV applications, respectively. QE above 75% over the entire visible spectrum range from 400 to 700nm is measured. In the spectral range from 260 to 400nm wavelength, QE values above 50% over the entire range are achieved. A new technique, high pressure hydrogen anneal at 20 atm, was applied on photodiodes and improvement in DC of 30% for the BSI imager with HfO2 as ARC as well as for the front side imager was observed. The entire BSI process was developed 200mm wafers and evaluated on test diode structures. The knowhow is then transferred to real imager sensors arrays. (C) 2015 The Japan Society of Applied Physics

关键词： imaging instrument COPPER ALLOY NO 260 annealed condition Visible Light CMOS image sensors spectral range direct current Surface passivation Photodiodes Quantum efficiency Dark current

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