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A low noise readout detector circuit for nanoampere sensor applications

IEEE JOURNAL OF solid-state CIRCUITS 1997年第3期32卷 337-348页

作者： Thelen, DC Chu, DD SANDIA NATL LABS ALBUQUERQUENM 87185

A readout detector IC has been developed which is capable of detecting nanoampere photo-current signals of interest in a high (microampere) background illumination or de noise level (SNR = 80 dB), The readout detector sensor IC processes transient signals of interest from a separate photo-diode pixel array chip, Low noise signal conditioning, filtering, and signal thresholding implement smart sensor detection of only ''active pixels.'' This detector circuit can also be used to perform signal conditioning for other sensor applications that require detection of very small signals in a high background noise environment.

关键词： detectors image sensors integrated circuit noise intelligent sensors photodiodes switched-capacitor circuits

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A log-polar image sensor fabricated in a standard 1.2-mu m ASIC CMOS process

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IEEE JOURNAL OF solid-state CIRCUITS 1997年第8期32卷 1274-1277页

作者： Wodnicki, R Roberts, GW Levine, MD MCGILL UNIV DEPT ELECT ENGNMONTREALPQ H3A 2A7CANADA

A CMOS log-polar or foveated image sensor for use in mobile robotic and machine vision applications has been designed, fabricated, and tested. The sensor benefits from a high degree of integration, minimal power consumption, and ease of manufacture due to the use of a standard 1.2-mu m ASIC CMOS process. The sensor if composed of two distinct CMOS images arrays which together solve the problem of obtaining good image resolution over a wide field of view. High resolution sensing is accomplished with a 40 x 40 array of individual pixels each measuring 9.6 mu m on a side. A wide field of view is provided by an array of 64 x 16 pixels arranged on a log-polar grid. The maximum measured dynamic range for the fabricated log-polar array is 46 dB, while the lowest observed fixed-pattern noise is 0.5% of saturation. Combined power consumption of both arrays is under 2 mW when operating from a single 5-V supply at a frame rat of 30 frames/s.

关键词： biological system modeling image sensor mixed analog-digital integrated circuits

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CMOS active pixel sensor star tracker with regional electronic shutter

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IEEE JOURNAL OF solid-state CIRCUITS 1997年第2期32卷 285-288页

作者： YadidPecht, O Pain, B Staller, C Clark, C Fossum, E Jet Propulsion Laboratory California Institute of Technology

A 64 x 64 element CMOS active pixel sensor (APS) for star tracker applications is reported. The chip features an innovative regional electronic shutter through the use of an individual pixel reset architecture, Using the regional electronic shutter, each star in the field of view can have its own integration period, This way, simultaneous capture of bright stars with dim stars is accommodated, enabling a large increase in tracker capability. The chip achieves 80 dB dynamic range, 50 e-rms read noise, low dark current, and excellent electronic shutter linearity.

关键词： active pixel sensors dynamic range electronic shutter image sensors photodiode arrays

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The first study of a flat vacuum image sensor with a field-emitter array

The first study of a flat vacuum image sensor with a field-e...

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Conference on solid state sensor arrays - development and applications

作者： Yamagishi, T Nanba, M Okazaki, S Tanioka, K Sato, F Egami, N NHK Science and Technical Research Laboratories 1-10-11 Kinuta Setagaya-ku Tokyo Japan

ISBN: (纸本)0819424307

To develop a high-definition image sensor having ultra-high sensitivity far superior to CCDs, A new compact image sensor consisting of a matrix field emitter array (FEA) and a high-gain avalanche rushing amorphous photoconductor (HARP) target is studied. Most research on devices with FEAs has so far focused on flat displays and high-frequency devices. Although the concept of a flat image sensor with FEAs has been proposed before, image sensors with FEAs have yet to be fabricated. In this paper, the fundamental driving characteristics of a new flat image sensor comprised of an X-Y matrix FEA set face to face with a HARP target have been investigated in a vacuum chamber for the first time. Experiments confirmed that the device successfully picks up images. High-sensitivity is achieved with the HARP target, and the temporal fluctuation and spatial variation of the emission currents obtained from the FEA have almost no effect on the signal output currents. Furthermore, the resolution characteristics are affected by the mesh voltage and by divergence of the emission from the field emitter (FE) tips.

关键词： field emitter array FEA image sensor HARP target field emitter image sensor FEIS cold cathode vacuum micro-electronics

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Fabrication of oxygen electrode arrays and their incorporation into sensors for measuring biochemical oxygen demand

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ANALYTICA CHIMICA ACTA 1997年第1-2期357卷 41-49页

作者： Yang, Z Sasaki, S Karube, I Suzuki, H Univ Tokyo Adv Sci & Technol Res Ctr Meguro Ku Tokyo 153 Japan Univ Tsukuba Inst Mat Sci Tsukuba Ibaraki 305 Japan

Miniature Clark-type oxygen electrode arrays were fabricated using thin film technology. Each oxygen electrode comprised a silver cathode and a Ag/AgCl anode. The use of a dry electrolyte containing polyvinylpyrrolidone (PVP) permitted the use of solid state fabrication processes. The electrolyte was left dry until it was used, when the water essential for oxygen reduction was introduced through a gas-permeable membrane and absorbed by the PVP. The miniature oxygen electrode arrays showed good characteristics for monitoring dissolved oxygen concentrations and could be mass produced with assured quality, The yeast Trichosporon cutaneum was immobilized onto the cathode of an oxygen electrode using a photo-crosslinkable resin and the response of the sensor was the difference between the output of a yeast-immobilized electrode and that of a bare oxygen electrode. Measurements using the dual-type sensor for biochemical oxygen demand (BOD) were markedly simplified as air-saturated samples were not required, so air pumps and stirrers can be omitted from the sensing system. The BOD sensor was used for the analysis of real samples and the results agreed well with those determined using the conventional 5-day BOD determination method. This is a significant step toward the development of a portable BOD measuring system incorporating disposable electrodes and containing no mechanical parts. (C) 1997 Elsevier Science B.V.

关键词： oxygen electrode arrays sensors biochemical oxygen demand

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Tip integration on arrays of silicon micro cantilevers with self exciting piezoelectric sensor for parallel atomic force microscopy applications

Tip integration on arrays of silicon micro cantilevers with ...

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1997 International Conference on solid-state sensors and Actuators

作者： Indermuhle, PF Schurmann, G Racine, GA deRooij, NF Univ of Neuchatel Neuchatel Switzerland

ISBN: (纸本)0780338294

Self sharpening tips have been integrated on arrays of cantilevers provided with self exciting piezoelectric sensors (ZnO) by using monocrystalline silicon micromachining. Atomic force microscopy (AFM) images of grids with periods of 0.25 mu m, 1 mu m and 5 mu m and with height differences of 100 nm, 15 nm and 180 nm respectively have been achieved with single cantilevers.

关键词： atomic force microscopy (AFM) piezoelectric sensors piezoelectric actuators

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A digital high-resolution, high-performance CCD camera with 2048 * 2048 pixels for dynamic applications

A digital high-resolution, high-performance CCD camera with ...

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Conference on solid state sensor arrays - development and applications

作者： Reiter, H Bruijns, AJC Jung, N Morgenstern, A Spekowius, G Philips Research Laboratories Aachen Germany Philips Medical Systems Best Netherlands

ISBN: (纸本)0819424307

A modular;multi-channel digital camera system has been designed. It provides a platform for the investigation of high-speed, high-resolution CCD sensors that are suited for dynamic medical X-ray imaging. The system supports frame rates from 30 frames per second (fps) for images with 1024*1024 pixels and 6-8 fps for images with 2048*2048 pixels. The complete system comprises camera head and correction circuits and yields a consecutive output stream of data. The camera electronics permits the testing of sensors with up to four parallel readout channels. It offers a variable bandwidth of up to 25 MHz per channel (total 100 MSamples/s) with a digitization resolution of 12 bits. The modularity and programmability (for example, of pulse pattern or clock frequency) allow the adaptation of the camera system to a wide range of interesting applications. The camera electronics consists of a majority of sensor independent and a relatively small section of sensor dependent components. A detailed description of the camera, methods for performance analysis, measurement results, images, and a noise analysis are presented and discussed. As an example, linearity, MTF and noise of the camera system equipped with the FTF2020, a 2k*2k CCD sensor from Philips Professional Imaging (PPI) have been measured. The noise contains fixed pattern and random components. The developed camera architecture is capable of fulfilling the high requirements of dynamic, high-resolution medical imaging.

关键词： 2048*2048 pixel CCD dynamic imaging multi-channel readout digital camera architecture

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Large area, edge buttable CCDs for mosaic focal plane applications

Large area, edge buttable CCDs for mosaic focal plane applic...

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Conference on solid state sensor arrays - development and applications

作者： Woody, T Blouke, MM Reinheimer, A Dosluoglu, T Burmester, W Wooten, R Frank, P Freymiller, E Seawalt, D Clampin, M Reed, R Wolfe, T Stover, R Wei, M Scientific Imaging Technologies Inc. (United States) Ball Aerospace Systems Group (United States) Space Telescope Science Institute (United States) National Optical Astronomical Observatories (United States) Univ of California Lick Observatory (United States)

ISBN: (纸本)0819424307

This paper will describe in some detail two new large area CCD image sensors designed specifically to be used either as a single imager or assembled in mosaics of CCDs. The devices have 2048x4096, 15 mu m pixels;the difference being the orientation of the serial register. Performance data are presented on both front- and back-illuminated parts. In addition, a new production camera test system will also be described which is being used to screen test the Advanced Camera CCDs for the Wide Field and High Resolution Channels.

关键词： Charge-coupled devices Back illuminated sensors Semiconducting wafers Connectors Amplifiers Cameras Digital signal processing Imaging systems Quantum efficiency Astronomy

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Greater than 90% QE in visible spectrum perceptible from UV to near IR Hamamatsu thinned back illuminated CCD's

Greater than 90% QE in visible spectrum perceptible from UV ...

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Conference on solid state sensor arrays - development and applications

作者： Muramatsu, M Akahori, H Shibayama, K Nakamura, S Yamamoto, K Hamamatsu Photonics KK (Japan)

ISBN: (纸本)0819424307

CCD's feature low amplifier noise, high sensitivity and wide dynamic range. Therefore, CCD's have been used in such diverse applications as general purpose imaging, industrial inspection, medical diagnostics and astrophysics [1][2]. For each application, a suitable image area, optical characteristics, electrical characteristics and even appropriate package must be required[3]. Among these, back illuminated CCD's have enhanced sensitivity for UV light, soft X-rays and electrons. Hamamatsu Photonics K.K. has developed FFT, MPP mode back illuminated CCD's optimized for spectroscopy. For spectroscopic applications, CCD's should have responsivity from the UV to near-iii as well as having low dark current and wide dynamic range in the binning mode. Stability of the spectral response curve is also important to achieve high precision measurements.

关键词： spectroscopic applications signal-to-noise ratio full-well capacity spectral range quantum efficiency backside thinning rim support grown oxide high temperature annealing flip-chip bonding

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Chapter 5 Monolithic Pyroelectric Bolometer arrays

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Semiconductors and Semimetals 1997年第C期47卷 175-201页

作者： Polla, Dennis L. Choi, Jun R. Microtechnology Laboratory University of Minnesota Minneapolis MN United States

This chapter presents a monolithic approach to uncooled pyroelectric arrays that combines micromachining with thin-film deposition of a pyroelectric material. Pyroelectric thin-film capacitors have been monolithically integrated with on-chip signal processing electronics for uncooled IR detection applications. This has been demonstrated for both Silicon (Si) and Gallium Arsenide (GaAs) technologies for several pyroelectric thin-film materials. solid-state micromachining techniques have been applied to form low thermal conduction microbridges elevated approximately 1.0 pm above the semiconductor substrate. The ability to apply surface-micromachining methods allows for individual reticulation of a heat-sensitive pixel element, thereby significantly reducing element-to-element thermal cross talk in IR detector array applications. The most advanced concept presented in this work successfully integrates the following technologies: (1) MOS signal processing electronics, (2) Si,N, surface-micromachined thermal isolation bridges, and (3) PbTiO, pyroelectric thin films. The resulting normalized broadband blackbody detectivity D* at room temperature and 30-Hz mechanical chopping frequency is 2 x 10 8 cmHz 1/2 /W showing feasibility for both single-element and imaging array applications.

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