This paper focuses on high speed electronic/electro-optic camera development by the Applied Physics Experiments and Imaging Measurements Group (P-15) of Los Alamos National Laboratory's Physics Division over the l...
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ISBN:
(纸本)0819415979
This paper focuses on high speed electronic/electro-optic camera development by the Applied Physics Experiments and Imaging Measurements Group (P-15) of Los Alamos National Laboratory's Physics Division over the last two decades. The evolution of TV and image intensifier sensors and fast readout fast shuttered cameras are discussed. Their use in nuclear, military, and medical imaging applications are presented. Several salient characteristics and anomalies associated with single-pulse and high repetition rate performance of the cameras/sensors are included from earlier studies to emphasize their effects on radiometric accuracy of electronic framing cameras. The Group's test and evaluation capabilities for characterization of imaging type electro-optic sensors and sensor components including Focal Plane arrays, gated Image Intensifiers, microchannel plates, and phosphors are discussed. Two new unique facilities, the High Speed solidstate Imager Test Station and the Electron Gun Vacuum Test Chamber are described. A summary of the Group's current and developmental camera designs and R&D initiatives are included.
A normal-incidence type-ii indirect AlAs/Al0.5GaD.5As quantum-well infrared photodetector grown on (110) GaAs by molecular-beam epitaxy for mid- and long-wavelength multispectrum detection has been developed. The norm...
A normal-incidence type-ii indirect AlAs/Al0.5GaD.5As quantum-well infrared photodetector grown on (110) GaAs by molecular-beam epitaxy for mid- and long-wavelength multispectrum detection has been developed. The normal-incident excitation of long-wavelength intersubband transition was achieved in the [110] X-band-confined AlAs quantum wells. Six absorption peaks including four from X-band to r-band intersubband resonant transitions were observed at wavelengths, lambda(p1 - 6) = 2.2, 2.7, 3.5, 4.8, 6.5, and 12.5 mum. The resonant transport from X band to GAMMA band gives rise to high photoconductive gain, which is highly desirable for focal plane arrays image sensorapplications.
The speed of evolution of thick-film technology as an advanced technique for solidstatesensors is illustrated. Recent innovations are mentioned with regard to modern techniques for the design, realization and test o...
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The speed of evolution of thick-film technology as an advanced technique for solidstatesensors is illustrated. Recent innovations are mentioned with regard to modern techniques for the design, realization and test of hybrid circuits for signal processing, use of new materials both for substrates and transducing elements, new concept designs and processing techniques. Current research activities and programmes, which promise new interesting materials for, and emerging applications of, thick-film sensors, are described. However, several problems remain unsolved;some topics which should improve our understanding and performance of thick-film sensors are mentioned.
The Coherent Launch Site Atmospheric Wind Sounder (CLAWS) is a test and demonstration program to investigate the feasibility of using a solid-state coherent lidar to obtain wind data from the surface to 20 km or more ...
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The development and implementation are described of the time of flight validation system, a system for the automated diagnosis of a large-scale nuclear physics detector. The diagnostic system is multi-leveled, combini...
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The development and implementation are described of the time of flight validation system, a system for the automated diagnosis of a large-scale nuclear physics detector. The diagnostic system is multi-leveled, combining a single monitoring level based on statistical methods with two model-based diagnostic levels, one operating on structural information and the other using both structural and behavioral models. The later diagnostic level uses a qualitative data model of the detector to provide evidence that is mapped on a continuous basis from observation values to belief in component failure hypotheses. The general architecture is scalable.< >
The MEIS ii airborne multispectral imager has been providing data to the remote sensing community since 1983. During that time, MEIS ii has provided data for more than 200 remote sensing missions. One of the first and...
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The MEIS ii airborne multispectral imager has been providing data to the remote sensing community since 1983. During that time, MEIS ii has provided data for more than 200 remote sensing missions. One of the first and most successful applications of MEIS imagery has been in forestry for inventory, juvenile stand assessment, and insect-damage detection and mapping. The addition to MEIS of a fore-aft stereo capability, coupled with the development of accurate techniques for the correction of geometric distortions in airborne imagery, has led to the possibility of producing high-resolution data bases for topographic maps by totally digital methods. The success of the research performed in forestry and mapping with MEIS ii data, combined with the advances of geographic information systems (GIS), has opened the way for the development of a new system which will include data acquisition and ground-processing components and which will provide truly operational capabilities. This report describes the sensor, MEIS FM, its conceptual design and functional specifications. MEIS FM will be a wide angle, high-resolution multi-spectral imager based on state-of-the-art linear arrays and custom-designed high-resolution optics. The design has been specifically tailored to the requirements of the mapping and forestry industries, with the emphasis on the cost effective production of the end-user products.
This paper discusses the successful demonstration of a first in thermal imaging with utilized an inexpensive midwavelength IR (MWIR) linear, focal plane assembly (FPA) comprising a long linear array of lead selenide (...
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ISBN:
(纸本)0819405973
This paper discusses the successful demonstration of a first in thermal imaging with utilized an inexpensive midwavelength IR (MWIR) linear, focal plane assembly (FPA) comprising a long linear array of lead selenide (PbSe) photoconductors interfaced to an on-focal-plane multiplexer (MUX). The design of this unique IR sensor consisted of a rugged dewar package in which was mounted a reliable, solidstate thermoelectric cooler (TEC) coupled with the proven technologies of both the PbSe fabrication process and the complementary metal-oxide- semiconductor (CMOS) multiplexers. This combination of components now provides the system designer with a readily available, cost-effective, second-generation PbSe focal plane assembly for scanning, thermal imaging applications that require high resolution and system performance of NEΔT capability of better than 0.2°C.
In order to support rigorous requirements for tracking, surveillance, and astronomical applications, SAIC pursues megapixel focal plane development programs which require high performance in areas such as quantum effi...
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ISBN:
(纸本)0819405469
In order to support rigorous requirements for tracking, surveillance, and astronomical applications, SAIC pursues megapixel focal plane development programs which require high performance in areas such as quantum efficiency, dynamic range, charge transfer efficiency, and total noise. To provide CCDs with these properties, special backside thinning, post-processing, anti- reflection coating, and high-speed readout capabilities have been developed in-house at SAIC. The authors discuss the thinning efforts to date on SAIC 1024 × 1024 arrays, including flattening mounts and anti-reflection coatings. Test and characterization results are presented for various chips which have been passivated using either flashgate or p+ substrate remnant. Finally, preliminary results in two related areas are discussed: initial thinning efforts on SAIC/LORAL 18 μm 2048 × 2048 CCDs, and electron imaging with thinned chips in a Digicon tube.
This paper describes the methodology, which is used in IMEC for the realization of very high resolution linear image sensors. The key elements in design and processing are the use of the DEPLI-sensor principle, a quad...
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The proceedings contain 24 papers. The topics discussed include: the solidstate image sensor's contribution to the development of silicon technology;CCD charge collection efficiency and the photon transfer techni...
The proceedings contain 24 papers. The topics discussed include: the solidstate image sensor's contribution to the development of silicon technology;CCD charge collection efficiency and the photon transfer technique;high density frame transfer image sensors with vertical anti-blooming;advances in CCD technology;digital charge coupled device (CCD) camera system architecture;backside charging of the CCD;large area CCD image sensors for scientific applications;enhancement of x-ray performance with new GEC charged coupled devices (CCD);simplified technique of hologram generation and transmission;and performance analysis of the photon-counting image acquisition system.
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