Graphics Processing Units (GPUs) are powerful computing devices that with the advent of CUDA/OpenCL are becomming useful for general purpose computations. Obsidian is an embedded domain specific language that generate...
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This book constitutes the thoroughly refereed post-workshop proceedings of the 8th International workshop on declarative Agent Languages and Technologies, DALT 2010, held in Toronto, Canada, on May 10, 2010, as a sate...
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ISBN:
(数字)9783642207150
ISBN:
(纸本)9783642207143
This book constitutes the thoroughly refereed post-workshop proceedings of the 8th International workshop on declarative Agent Languages and Technologies, DALT 2010, held in Toronto, Canada, on May 10, 2010, as a satellite workshop of the 9th International Joint Conference on Autonomous Agents and Multiagent Systems, AAMAS 2010.
The 7 revised full papers presented together with 4 invited lectures were carefully selected during two rounds of reviewing and improvement from 24 initial submissions. DALT aims to make formal methods and declarative technologies and approaches available to and understood by a broader segment of the multi-agent research community; the papers are organized in topical sections on BDI rational agents, communication, coordination and negotiation, as well as social aspects and control systems.
This paper investigates session programming and typing of benchmark examples to compare productivity, safety and performance with other communications programming languages. Parallel algorithms are used to examine the...
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Termination analysis has received considerable attention, traditionally in the context of declarativeprogramming and, recently, also for imperative and Object Oriented (OO) languages. In fact, there exist termination...
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Technological aspects of the 3D integration of a multilayer combined mixed-signal and digital sensor-processor array chip is described. The 3D integration raises the question of signal routing, power distribution, and...
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Technological aspects of the 3D integration of a multilayer combined mixed-signal and digital sensor-processor array chip is described. The 3D integration raises the question of signal routing, power distribution, and heat dissipation, which aspects are considered systematically in the digital processor array layer as part of the multi layer structure. We have developed a linear programming based evaluation system to identify the proper architecture and its parameters.
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