Embodiments disclosed herein include a.modula. microwa.e source a.ra.. In a. embodiment, a.housing a.sembly for the source a.ra. comprises a.first conductive la.er, wherein the first conductive la.er comprises a.first...
标准号:
TW202147922(A)
Embodiments disclosed herein include a.modula. microwa.e source a.ra.. In a. embodiment, a.housing a.sembly for the source a.ra. comprises a.first conductive la.er, wherein the first conductive la.er comprises a.first coefficient of therma. expa.sion (CTE), a.d a.second conductive la.er over the first conductive la.er, wherein the second conductive la.er comprises a.second CTE tha. is different tha. the first CTE. In a. embodiment, the housing a.sembly further comprises a.plura.ity of openings through the housing a.sembly, where ea.h opening pa.ses through the first conductive la.er a.d the second conductive la.er.
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