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检索条件"主题词=2D array"

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A Soft Lithography Route to Nanopatterned Photovoltaic devices

A Soft Lithography Route to Nanopatterned Photovoltaic Devic...

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Conference on Nanoscale Photonic and Cell Technologies for Photovoltaics

作者： Williams, Stuart S. Hampton, Meredith J. Gowrishankar, Vignesh ding, I-Kang Zhang, Lei Ko, doo-Hyun Templeton, Joseph L. deSimone, Joseph M. McGehee, Michael d. Samulski, Edward T. Univ N Carolina Dept Chem Chapel Hill NC 27599 USA Stanford Univ Dept Mat Sci & Engn Stanford CA 94305 USA North Carolina State Univ Dept Chem Engn Raleigh NC 27695 USA

ISBN: (纸本)9780819472670

We have fabricated bulk heterojunction photovoltaic (PV) cells using a perfluoropolyether (PFPE) elastomeric stamp to control the morphology of the donor-acceptor interface within devices. devices were fabricated using the Pattern Replication In Non-wetting Templates (PRINT) process to have nanoscale control over the bulk heterojunction device architecture. The low-surface energy, chemically resistant, variable modulus, fluoropolymer based molds used in PRINT provide a route to patterning, with nanometer resolution, general polymeric donor materials such as polythiophene and polyphenylenevinylene derivatives and 'hard' inorganic oxide structures typically used as acceptor materials in hybrid organic solar cells such as TiO2, ZnO, and CdSe. This "top-down" approach allows for patterning over large areas and for the functionalization of the donor/acceptor interface. Specifically, nanostructured anatase titania with post-like features ranging from 30-100 nm in diameter and 30-65 nm in height was fabricated to form the ordered bulk heterojunction of a titania-poly(3-hexylthiophene) (P3HT) PV-cell. Nanostructured devices showed a two-fold improvement in both short-circuit current (J(sc)) and power conversion efficiency (PCE) relative to reference bilayer cells. Additionally, we will discuss devices fabricated with other organic and inorganic materials in order to investigate the effect on cell performance of controlling the nanoscale architecture of the bulk heterojunction via patterning.

关键词： Soft Lithography Nanopatterns 2d array PRINT Perfluoropolyether Photovoltaics Titania Conjugated Polymer Polythiophene

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Phased subarrays for low cost C-Scan applications

Phased subarrays for low cost C-Scan applications

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IEEE International Ultrasonics Symposium

作者： Li, Y Blalock, TN Walker, WF Hossack, JA Univ Virginia Biomed Engn Dept Elect & Comp Engn Charlottesville VA 22903 USA

ISBN: (纸本)0780393821

The performance of subarray processing as a means of reducing overall beamforming computational load for a low cost C-Scan imaging device is analyzed. Unlike the case encountered in B-Mode imaging, the C-Scan format is characterized by a large channel count (4096 in this case) and very short data record lengths. Additionally, unlike the case in B-Mode, there is no essential need for realtime processing of 'streaming' received channel data. Thus, the C-Scan image format benefits greatly from a subarray processing approach in which partial sums are,reused' with modified differential delays to form multiple beamformed image pixels. For the design configuration considered here, a subarray aperture of 4x4 elements would be approximately optimal and yielded an approximately 12 - 15 fold reduction in overall beamforming computational load. The actual number of beamforming sums is also influenced by the selected pixel spacing and the range over which partially summed apertures can be steered.

关键词： beamforming ultrasound imaging 2d array phased subarray

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3d X-ray scan visualization and analysis system

3D X-ray scan visualization and analysis system

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International Conference on X-ray and Neutron Capillary Optics

作者： Markelov, AA Inst Roentgen Opt Moscow 123060 Russia

ISBN: (纸本)0819445320

While processing experimental data, it is important to have pictorial presentation of information. Currently, within the scope of the research programs carried out at the Institute for Roentgen Optics, several automated set-ups have been created and are now used to perform X-ray scanning experiments. At the development stage it became clear that presentation of experimental data in a pictorial and convenient to the researcher form, by means of 3d computer graphics algorithms, enables more precise evaluation of the results and, thus, correctly determination of the strategy for further research.

关键词： x-ray scanning visualization 2d array 3d array

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High-power high-efficiency 2d VCSEL arrays

High-power high-efficiency 2D VCSEL arrays

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Conference on Vertical-Cavity Surface-Emitting Lasers XII

作者： Seurin, Jean-Francois Ghosh, Chuni L. Khalfin, Viktor Miglo, Aleksandr Xu, Guoyang Wynn, James d. Pradhan, Prachi d'Asaro, L. Arthur Princeton Opt Mercerville NJ 08619 USA

ISBN: (纸本)9780819470836

We review recent results on high-power, high-efficiency two-dimensional vertical-cavity surface-emitting laser (VCSEL) arrays emitting around 980nm. Selectively oxidized, bottom-emitting single VCSEL emitters with 51% power conversion efficiency were developed as the basic building block of these arrays. More than 230W of continuous-wave (CW) power is demonstrated from a similar to 5mm x 5mm array chip. In quasi-CW mode, smaller array chips exhibit 100W output power, corresponding to more than 3.5kW/cm(2) of power density. High-brightness arrays have also been developed for pumping fiber lasers, delivering a fiber output power of 40W. We show that many of the advantages of low-power single VCSEL devices such as reliability, wavelength stability, low-divergence circular beam, and low-cost manufacturing are preserved for these high-power arrays. VCSELs thus offer an attractive alternative to the dominant edge-emitter technology for many applications requiring compact high-power laser sources.

关键词： semiconductor lasers vertical-cavity surface-emitting lasers (VCSELs) high efficiency high-power 2d array pumping solid-state laser brightness reliability

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High-power vertical-cavity surface-emitting arrays

High-power vertical-cavity surface-emitting arrays

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Conference on High-Power diode Laser Technology and Applications VI

作者： Seurin, Jean-Francois Ghosh, Chuni L. Khalfin, Viktor Miglo, Aleksandr Xu, Guoyang Wynn, James d. Pradhan, Prachi d'Asaro, L. Arthur Princeton Optron Mercerville NJ 08619 USA

ISBN: (纸本)9780819470515

We present record output power levels (a few hundred Watts) in continuous-wave (CW) and quasi-CW (QCW) from 2d vertical-cavity surface-emitting laser (VCSEL) arrays, corresponding to power densities exceeding 1kW/cm(2) in CW and 2 3.5kW/cm(2) in QCW. These VCSEL arrays emit around 975nm with narrow spectral width (< 1nm) and excellent wavelength stability (< 0.07nm/K). Peak power conversion efficiency of properly designed arrays exceeds 50%. Additional features of these arrays include en-fission in a circular, low-diverging beam, and reliable high-temperature operation. These arrays can also be operated reliably in short pulses (< 200nsec) at many times their roll-over CW current, making them useful for high-energy applications. VCSEL arrays with 2.2kW peak output power operating under 100nsec pulse-width have been demonstrated.

关键词： semiconductor lasers vertical-cavity surface-emitting lasers (VCSELs) high efficiency high-power 2d array pumping solid-state laser brightness reliability high-energy

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Multipurpose high performance 160x120 uncooled IRFPA

Multipurpose high performance 160x120 uncooled IRFPA

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Conference on Infrared Technology and Applications XXX

作者： Tissot, JL Crastes, A Trouilleau, C Fieque, B Tinnes, S ULIS F-38113 Veurey Voroize France

ISBN: (纸本)0819453293

Uncooled infrared focal plane arrays are being developed for a wide range of thermal imaging applications. developments are focused on the improvement of their sensitivity, enabling the possibility of reducing the pixel pitch in order to decrease the total system (size and weight) by using smaller optics. The amorphous silicon technology is the latest one developed by CEA / LETI and transferred to ULIS to manufacture uncooled infrared 2d arrays. We developed for this device a low cost package based on existing technologies. This device is well adapted to multipurpose high volume applications where spatial resolution (in term of pixel number) is less important than device costs.

关键词： uncooled IRFPA 2d array microbolometer amorphous silicon vacuum package

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Optimization of free-moving elements in 2d ultrasound sparse arrays

Optimization of free-moving elements in 2D ultrasound sparse...

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IEEE International Ultrasonics Symposium (IUS)

作者： diarra, Bakary Robini, Marc Roux, Emmanuel Liebgott, Herve Cachard, Christian Roux, Emmanuel Tortoli, Piero Univ Lyon CREATIS Villeurbanne France CNRS UMR 5220 Villeurbanne France INSERM U1044 Villeurbanne France Univ Lyon 1 F-69622 Villeurbanne France INSA Lyon Villeurbanne France Univ Florence Dept Informat Engn Florence Italy

ISBN: (纸本)9781479970490

the non-grid sparse array technique is a promising approach to overcome the connection difficulties of 2d matrix arrays and to partially compensate the energy loss linked to the element number reduction. Being independent from the spatial sampling conditions, this method leads to a significant improvement of the beam pattern when combined to the simulated annealing algorithm. However, in the previous version of this method [1], the position of the elements cannot be changed during the optimization. In order to add a further degree of freedom and thus to improve the optimization performance, we propose a new strategy in which both element position and apodization can be modified. This new approach improves the sensitivity thanks to a better distribution of the elements on the array footprint.

关键词： 2d array non-grid sparse array 3d ultrasound imaging simulated annealing

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A 32x32 Integrated CMUT array for Volumetric Ultrasound Imaging

A 32x32 Integrated CMUT Array for Volumetric Ultrasound Imag...

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IEEE International Ultrasonics Symposium (IUS)

作者： Bhuyan, Anshuman Chang, Chienliu Choe, Jung Woo Lee, Byung Chul Nikoozadeh, Amin Oralkan, Oemer Khuri-Yakub, Butrus T. Stanford Univ Stanford CA 94305 USA North Carlonia State Univ Raleigh NC USA

ISBN: (纸本)9781467356862

Real-time 3d volumetric ultrasound imaging systems require transmit and receive circuitry to generate the ultrasound beam and process the received echo signals. Since a 2d array is required for 3d imaging, the complexity of building such a system is significantly higher, e. g., front-end electronics need to be interfaced to the transducer, a large number of elements need to be interfaced to the backend system and a large dataset needs to be processed. In this work, we present a 3d imaging system using capacitive micromachined ultrasonic transducer (CMUT) technology that addresses many of the challenges in building such a system. The transducer is a 5-MHz CMUT array with an 8 mm x 8 mm aperture size. The aperture consists of 1024 elements (32x32) with an element pitch of 250 m. An integrated circuit (IC) is integrated very close to the CMUT array. It consists of a transmit beamformer and receive circuitry to improve the noise performance of the overall system. Simultaneous multi-beam transmit is also incorporated in the IC to improve the imaging frame rate. The CMUT is flip-chip bonded to the IC and the final assembly measured 9.2 mm x 9.2 mm. The assembly was then interfaced with an FPGA and a backend system (comprising of a data acquisition system and PC). The FPGA provided the digital I/O signals for the IC and the backend system was used to process the received RF echo data (from the IC) and reconstruct the volume image using a phased array imaging approach. Imaging experiments were performed using wire phantoms. Real-time volumetric images were captured at 5 volumes per second and are presented in this paper.

关键词： 3d volumetric imaging capacitive micromachined ultrasonic transducer (CMUT) 2d array phased array imaging ultrasound real-time flip-chip bonding integrated circuits

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Robust Outlier detection in High-density Surface Electromyographic Signals

Robust Outlier Detection in High-Density Surface Electromyog...

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32nd Annual International Conference of the IEEE Engineering-in-Medicine-and-Biology-Society (EMBC 10)

作者： Marateb, H. R. Rojas-Martinez, M. Mananas Villanueva, M. A. Merletti, R. Politencn Torino LISiN Dipartimento Elettron Turin Italy Tech Univ Catalonia CREB & Dept ESAII Biomed Res CtrBiomed Res Networking Ctr Bioengn CIBER BBNBiomat & Nanomed Barcelona Spain

ISBN: (纸本)9781424441242

High density surface Electromyography (HdsEMG) has been applied in both research and clinical applications for non-invasive neuromuscular assessment in several different fields using 2-d array. Proper interpretation of HdsEMG signals requires identifying "good" channels (where there is no short-circuit or bad-contact or major power line interference problem). Recording with many channels usually implies bad-contacts (that introduces large power line interference) and short-circuits (when using gels). In addition to online monitoring the electrode-contact quality, it is necessary to identify "bad" channels, or outliers, prior to the analysis of HdsEMG signal. In this paper we introduce a robust method to identify outliers in a set of monopolar HdsEMG signals recorded from Biceps and Triceps Brachii, Anconeus, Brachioradialis and Pronator Teres. The sensitivity and precision of this method show that this approach is promising.

关键词： 2d array Anconeus Brachioradialis Pronator Teres Triceps Brachii biceps data analysis electrode-contact quality electromyography high density surface electromyographic signals medical signal processing monopolar HdsEMG signals noninvasive neuromuscular assessment online monitoring pattern recognition pattern recognition power line interference problem robust outlier detection short-circuits

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Progress on vertical-cavity surface-emitting laser arrays for infrared illumination applications

Progress on vertical-cavity surface-emitting laser arrays fo...

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Conference on Vertical-Cavity Surface-Emitting Lasers XVIII

作者： Zhou, delai Seurin, Jean-Francois Xu, Guoyang Miglo, Alexander Li, daizong Wang, Qing Sundaresh, Mukta Wilton, Sam Matheussen, Joe Ghosh, Chuni Princeton Optron Mercerville NJ 08619 USA

ISBN: (纸本)9780819499141

For infrared illumination with wavelength range of 808nm-1064nm, vertical-cavity surface-emitting lasers (VCSELs) offer many advantageous properties including superior beam quality (such as low divergence, circular shape beam and speckle-free image), increased eye safety, high reliability and low manufacturing cost. We report our progress on high-power high-efficiency VCSELs and two dimensional (2d) VCSEL arrays for such illumination applications. GaAs-based VCSEL wafers are grown by MOCVd and processed into either top-emitting or bottom-emitting devices depending on the emission wavelength and applications. Results from both single devices and arrays are presented. In particular, record-high power conversion efficiency (PCE) of 63.4% with 300mW output was achieved from VCSELs at 1064nm. Such VCSELs also operate with >55% PCE at 50C. For a 2mm by 10mm array, 56.4% PCE with 150W output was demonstrated. Using those VCSELs and arrays as building blocks, various high power illuminators ranging from a few Watts to over 100 kiloWatts have been fabricated.

关键词： VCSEL semiconductor laser illuminator high power high efficiency 2d array speckle-free 808nm 976nm 1064nm

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