The rapid pace of device scaling in recent years has outrun the ability of today's generation of semiconductor manufacturing equipment control systems to keep up. New device architectures and the materials and pro...
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ISBN:
(纸本)9781538637487
The rapid pace of device scaling in recent years has outrun the ability of today's generation of semiconductor manufacturing equipment control systems to keep up. New device architectures and the materials and processes used to realize them create sources of variability that require better techniques for real-time sensing, filtering, detection, and response. This is not simply a question of faster data collection of the existing equipment variables. In many cases, the data needed to accurately determine the real-time process conditions are not even available in the equipment, so the traditional time-based techniques and endpoint detection methods for controlling recipe execution are not sufficient. rather, these advancedprocesses are effectively "flying blind." GLOBALFOUNDRIES, a long-time leader in equipment automation and processcontrol, has addressed these issues by integrating specialty sensors into the broader control environment, effectively closing this gap through a variety of advanced sensorization initiatives that supplement the capabilities of the equipment as delivered by the OEMs. The broad expectations regarding the capabilities of manufacturing equipment and the embedded control systems have recently been described in [1]. Specific examples of advanced sensorization use cases and a standards-based implementation approach have been described in [2]. Now that the measurement gaps for a number of key processes have thus been closed (see Tables 1 and 2), new application opportunities exist for leveraging this enhanced visibility into equipment and process behavior. In particular, the ability to achieve "first-time-right response" to a wide variety of process conditions is now a practical reality. This paper highlights a number of these applications possibilities enabled by "unambiguous signals" on the equipment, and touches on the integration solution used to present these signals seamlessly to the application environment.
With overlay requirements getting more and more critical, a lot of work has been done in the industry to improve the overlay correction capability by using high order process corrections, corrections per exposure and ...
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ISBN:
(纸本)9781538676011
With overlay requirements getting more and more critical, a lot of work has been done in the industry to improve the overlay correction capability by using high order process corrections, corrections per exposure and heating control (lens and reticle). Another part of the overlay budget is linked to our ability to control and stabilize it through time as well as being reactive to changes via the advancedprocesscontrol system of the fab (apc)\n[1]\n. This paper describes the steps taken from an individual feedback loops configuration (one technology, one or several similar layers) to large perimeter overlay run- to-run for a high-mix 300mm semiconductor logic fab\n[2]\n. First, a multivariate apc system is defined with all the specificities needed to enable a large perimeter configuration. Then, technology/layer grouping is explained as well as filters and limits settings to start the new feedback loops simulation. The simulation phase or \"learning mode\" allows to have an overview on the expected gains: enhanced reactivity to parameters drift and easier maintenance by engineers in charge of following overlay run-to-run, which indirectly leads to better overall apc performance. After overlay large perimeter activation, the alert number drastically decreases, risk of measurement sampling is minimized in the fab and a similar approach is started on energy large perimeter (CD: Critical Dimensions).
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