To meet the real-time and accuracy of glue segmentation in compact camera module images, this paper proposes a real-time segmentation network model based on U-Net. To improve the inference speed of the model, the enco...
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To meet the real-time and accuracy of glue segmentation in compact camera module images, this paper proposes a real-time segmentation network model based on U-Net. To improve the inference speed of the model, the encoder of the network is redesigned into a three-level feature extraction structure, and the upsampling collocation of bilinear interpolation and sub-pixel convolution is used in the decoder. To enhance information fusion in the context of the network, the context guiding block is embedded in the feature extraction branch of the model. On this basis, improvements to convolutional block attention module and embedded in the jump connection to guide upsampling. The experimental results show that the inference speed of the segmentation network in this paper can reach 227.02 frames per second, which is better than real-time segmentation networks, such as ENet and CGNet. The segmentation accuracy of reinforced glue, dust-trapping glue, and escaped air hole glue is closer to high-precision segmentation networks, such as Deeplab V3+ and U-Net. The network model achieves 96.41% Intersection over Union on the segmentation of the reinforcing glue. Exploring the application of this paper's network to other objects with simple semantic information is an important direction for future research.
We introduce the design method of a hybrid lens composed a refractive lens and a diffractive optical element (DOE) considering the diffraction effect for a compact camera module. When imaging optical system is designe...
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We introduce the design method of a hybrid lens composed a refractive lens and a diffractive optical element (DOE) considering the diffraction effect for a compact camera module. When imaging optical system is designed using the DOE, diffraction efficiency of the DOE and stray light due to the unintended diffraction light should be considered. Therefore, to analyze the effect of diffraction efficiency of the DOE on image characteristics, we evaluate the performances of two designed compactcamera lenses, which have different construction wavelengths, using the modulation transfer function (MTF) considering diffraction efficiency. The stray light that is induced by the diffraction effect of the DOE is analyzed by calculating the focal position according to each diffraction order, and a method for the reduction of the stray light is proposed.
This paper presents the development of an automatic inspection system to check lens focus status and white balance level and to inspect defects including black and white defect, dim defect, color defect, and line defe...
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This paper presents the development of an automatic inspection system to check lens focus status and white balance level and to inspect defects including black and white defect, dim defect, color defect, and line defects in manufacturing process of compact camera module. To check the imaging status and inspect the defects of compact camera module, a unique image capturing system is developed to get image data from CMOS sensor at high speed. It has a complex programmable logic device, and the camera link and the frame grabber is used to transfer and store images to PC. Several kinds of unique image charts are designed to inspect the various types of defects in compact camera module, and they are implemented and displayed on the LCD monitor directly to reduce handling and exchanging time of inspection charts during test procedures. Various image processing algorithms are developed to analyze the captured image from each test chart and to find and verify the defects of cameramodules. The experimental results show that the proposed system is able to reliably inspect various types of defects with high precision and high speed in real manufacturing condition.
We proposed a modified testing equipment for adjusting the back focal length of compact camera module (CCM). The advantages of this modified testing equipment with conversion lens were testing space saving, small size...
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ISBN:
(纸本)9780819480828
We proposed a modified testing equipment for adjusting the back focal length of compact camera module (CCM). The advantages of this modified testing equipment with conversion lens were testing space saving, small size testing chart, high speed chart changing, and variable object distances. The testing chart displacement of 0.17 mm in the modified testing equipment can produce the equivalent testing chart displacement of 1000 mm in the conventional testing equipment. At the regular object distance of 2000 mm, both total track and testing chart size of the modified test equipment were 1.6% of that of the conventional testing equipment.
compact camera module(CCM) is widely used in PDA. Celluar phone and PC web camera. With the greatly increasing use for mobile applications. there has been a considerable demands for high speed production of CCM. The m...
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ISBN:
(纸本)0819455563
compact camera module(CCM) is widely used in PDA. Celluar phone and PC web camera. With the greatly increasing use for mobile applications. there has been a considerable demands for high speed production of CCM. The major burden of production of CCM is assembly of lens module onto CCD or CMOS packaged circuit board. After module is assembled. the CCM is inspected. In this paper, we developed the image capture board for CCM and the imaging processing algorithm to inspect the defects in captured image of assembled CCMO. The performances of the developed inspection system and its algorithm are tested on samples of 10000 CCMs. Experimental results reveal that the proposed system can focus the lens of CCM within 5s and we can recognize various types of defect of CCM modules with good accuracy and high speed.
Dust is one of the most critical issues in assembly of compact camera module(CCM) for mobile phones. Defect due to dust entry or dust deposit severely degrades image quality. There have been lots of literatures about ...
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ISBN:
(数字)9781510602984
ISBN:
(纸本)9781510602977;9781510602984
Dust is one of the most critical issues in assembly of compact camera module(CCM) for mobile phones. Defect due to dust entry or dust deposit severely degrades image quality. There have been lots of literatures about the compensating of dust defect on images by image processing, but the discussion about where the dust locates is still deficient. Dust may sneak in the CCM in any step of packaging process, so the analysis of the dust location may be useful for improving of the production line. This work develops an optical inspection algorithm to detect the location of dust inside CCM based on imaging optics. A planar light source with uniformly emission is designed as the capture target. A series of defocused images are then taken and analyzed. According to the dependence of the image defect on the capture distance, the location of the dust can be well defined. This inspection algorithm provides an easy and efficient way to help manufacturers improve their packaging process.
216 x 216 under-display optical fingerprint CMOS image sensor (CIS) is proposed and was prototyped using 0.11-mu m CIS technology. Two analog storage nodes that act as a ping-pong buffer are embedded in each pixel of ...
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216 x 216 under-display optical fingerprint CMOS image sensor (CIS) is proposed and was prototyped using 0.11-mu m CIS technology. Two analog storage nodes that act as a ping-pong buffer are embedded in each pixel of the global-shutter CIS, rendering a digital buffer unnecessary and increasing the operating frame rate. A processor with automatic exposure (AE) and black-level correction is embedded in the CIS to shorten the data transmission time. The AE and dynamic range enhancement functions are initiated to increase the success rate of fingerprint recognition. The full well capacity and sensitivity of the global-shutter CIS are 9 ke- and 21 V/(lux middot s), respectively. A prototype of the fingerprint sensor consumed only 26 mW with a 3.3-V supply voltage. An imaging lens and the CIS were combined to form the prototype of a compact camera module (CCM). Each pixel size is 6.8 x 6.8 mu m(2), equivalent to a panel resolution of 747 dots per inch with an optical ratio of 5. The sensor chip size is 2.23 x 2.39 mm(2), and the sensing area is 1.469 x 1.469 mm(2), occupying 40.5% of the chip. The prototype CCM was successfully embedded in a mobile phone, and the performance of the CIS was validated in the temperature range of -20 degrees C to 50 degrees C. Even when the interrupt interval for the serial peripheral interface communication was 300 ms, the CIS as a slave device could capture the fingerprint images clearly.
Dust defect is always a critical issue to degrade image qualities in kinds of imaging capturing modules, such as compact camera modules (CCMs) and digital single lens cameras (DSLRs). Dust particle may be deposited on...
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ISBN:
(数字)9781510620582
ISBN:
(纸本)9781510620582
Dust defect is always a critical issue to degrade image qualities in kinds of imaging capturing modules, such as compact camera modules (CCMs) and digital single lens cameras (DSLRs). Dust particle may be deposited on the surface of lens or sensor in the step of assembly and even in the step of changing lens module by users. There have been lots of studies about image defects produced by dust particles on the surface of lens or sensor and the image compensation for dust defect on images, but the studies about the direct analysis of dust defects are still deficient. In this study, geometrical optics was used to analyze the image defects due to dust in the imaging capturing module. A defocused optical system with a planar light source with Lambertian emission was developed to analyze dust defect with image process and the concept of just noticeable difference (JND) of human vision. The proposed defocused optical system provides a way to help manufacturers to improve their production line efficiently.
Solvent-free, photo-curable, transparent, colorless and haze-free liquid optical polymer materials are primary choices for lenses in wafer level optics. Advanced lens materials are being explored for quality optical, ...
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ISBN:
(纸本)9780819483775
Solvent-free, photo-curable, transparent, colorless and haze-free liquid optical polymer materials are primary choices for lenses in wafer level optics. Advanced lens materials are being explored for quality optical, thermal and mechanical properties. Such materials are desired to pass thermal reliability tests, survive stack-reflow processes, have low coefficient of thermal expansion, have high refractive index and extreme dispersion, possess low stress and shrinkage and etc. Novel nanocomposite materials based on 1) finely constructed core-shell nanoparticles with photopolymerizable surfactant crosslink function groups and 2) compatible polymer matrices are promising candidates for imaging and sensing systems with breakthrough performance.
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