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Real-time segmentation network for compact camera module assembly adhesives based on improved U-Net

JOURNAL OF REAL-TIME IMAGE PROCESSING 2023年第3期20卷 1-13页

作者： Li, Dongjie Deng, Haipeng Li, Changfeng Chen, Hui Harbin Univ Sci & Technol Key Lab Complex Intelligent Syst & Integrat Harbin 150080 Peoples R China Harbin Univ Sci & Technol Key Lab Adv Mfg & Intelligent Technol Minist Educ Harbin 150080 Peoples R China Changzhou Mingseal Robot Technol Co Ltd Changzhou 213164 Peoples R China

To meet the real-time and accuracy of glue segmentation in compact camera module images, this paper proposes a real-time segmentation network model based on U-Net. To improve the inference speed of the model, the encoder of the network is redesigned into a three-level feature extraction structure, and the upsampling collocation of bilinear interpolation and sub-pixel convolution is used in the decoder. To enhance information fusion in the context of the network, the context guiding block is embedded in the feature extraction branch of the model. On this basis, improvements to convolutional block attention module and embedded in the jump connection to guide upsampling. The experimental results show that the inference speed of the segmentation network in this paper can reach 227.02 frames per second, which is better than real-time segmentation networks, such as ENet and CGNet. The segmentation accuracy of reinforced glue, dust-trapping glue, and escaped air hole glue is closer to high-precision segmentation networks, such as Deeplab V3+ and U-Net. The network model achieves 96.41% Intersection over Union on the segmentation of the reinforcing glue. Exploring the application of this paper's network to other objects with simple semantic information is an important direction for future research.

关键词： Real-time segmentation U-Net compact camera module Attention

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Design of Hybrid Lens for compact camera module Considering Diffraction Effect

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JAPANESE JOURNAL OF APPLIED PHYSICS 2008年第8期47卷 6678-6682页

作者： Choi, Hyun Yoon, Yong-Joong Kim, Byunwook Lee, Sang-Hyuck Kim, Wan-Chin Park, No-Cheol Park, Young-Pil Kang, Shinill Yonsei Univ Dept Mech Engn Seoul 120749 South Korea Yonsei Univ Ctr Informat Storage Device Seoul 120749 South Korea

We introduce the design method of a hybrid lens composed a refractive lens and a diffractive optical element (DOE) considering the diffraction effect for a compact camera module. When imaging optical system is designed using the DOE, diffraction efficiency of the DOE and stray light due to the unintended diffraction light should be considered. Therefore, to analyze the effect of diffraction efficiency of the DOE on image characteristics, we evaluate the performances of two designed compact camera lenses, which have different construction wavelengths, using the modulation transfer function (MTF) considering diffraction efficiency. The stray light that is induced by the diffraction effect of the DOE is analyzed by calculating the focal position according to each diffraction order, and a method for the reduction of the stray light is proposed.

关键词： compact camera module hybrid lens diffractive optical element diffraction efficiency modulation transfer function

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An automatic optical inspection system for inspection of CMOS compact camera module assembly

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INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING 2009年第5期10卷 67-72页

作者： Ko, Kuk Won Kim, Dong Han Kim, Min Young Kim, Jong Hyeong Sunmoon Univ Dept Informat & Commun Engn Asan 336708 Cheonan South Korea Kyung Hee Univ Sch Elect Engn Yongin 446701 South Korea Kyungpook Natl Univ Sch Elect Engn & Comp Sci Taegu 702701 South Korea Seoul Natl Univ Technol Sch Mech Design & Automat Engn Seoul 139743 South Korea

This paper presents the development of an automatic inspection system to check lens focus status and white balance level and to inspect defects including black and white defect, dim defect, color defect, and line defects in manufacturing process of compact camera module. To check the imaging status and inspect the defects of compact camera module, a unique image capturing system is developed to get image data from CMOS sensor at high speed. It has a complex programmable logic device, and the camera link and the frame grabber is used to transfer and store images to PC. Several kinds of unique image charts are designed to inspect the various types of defects in compact camera module, and they are implemented and displayed on the LCD monitor directly to reduce handling and exchanging time of inspection charts during test procedures. Various image processing algorithms are developed to analyze the captured image from each test chart and to find and verify the defects of camera modules. The experimental results show that the proposed system is able to reliably inspect various types of defects with high precision and high speed in real manufacturing condition.

关键词： compact camera module Complementary Metal Oxide Semiconductor Automatic Inspection Image Processing Algorithm Defect Lens Focus

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The First Order Optics of Novel Testing Equipment for compact camera module

The First Order Optics of Novel Testing Equipment for Compac...

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Conference on International Optical Design

作者： Pan, Jui-Wen Natl Chiao Tung Univ Inst Photon Syst Tainan 71150 Taiwan

ISBN: (纸本)9780819480828

We proposed a modified testing equipment for adjusting the back focal length of compact camera module (CCM). The advantages of this modified testing equipment with conversion lens were testing space saving, small size testing chart, high speed chart changing, and variable object distances. The testing chart displacement of 0.17 mm in the modified testing equipment can produce the equivalent testing chart displacement of 1000 mm in the conventional testing equipment. At the regular object distance of 2000 mm, both total track and testing chart size of the modified test equipment were 1.6% of that of the conventional testing equipment.

关键词： compact camera module magnification reduction ratio CMOS sensor

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Development of automatic inspection of defect of compact camera module

Development of automatic inspection of defect of compact cam...

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Conference on Machine Vision and Its Optomechatronic Applications

作者： Ko, KW Lee, YJ Choi, BW Koh, KC Kim, JH Sunmoon Univ Dept Control & Measurement Eng Chunganm South Korea

ISBN: (纸本)0819455563

compact camera module(CCM) is widely used in PDA. Celluar phone and PC web camera. With the greatly increasing use for mobile applications. there has been a considerable demands for high speed production of CCM. The major burden of production of CCM is assembly of lens module onto CCD or CMOS packaged circuit board. After module is assembled. the CCM is inspected. In this paper, we developed the image capture board for CCM and the imaging processing algorithm to inspect the defects in captured image of assembled CCMO. The performances of the developed inspection system and its algorithm are tested on samples of 10000 CCMs. Experimental results reveal that the proposed system can focus the lens of CCM within 5s and we can recognize various types of defect of CCM modules with good accuracy and high speed.

关键词： compact camera module defect detection

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Optical inspection algorithm for dust defect of compact camera module 8

Optical inspection algorithm for dust defect of compact came...

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Conference on Optical Modeling and Performance Predictions VIII

作者： Wu, Yi-Ju Chen, Li-Yin Lu, Mei-Ju Natl Sun Yat Sen Univ Dept Photon 70 Lienhai Rd Kaohsiung 80424 Taiwan Adv Semicond Engn Grp Kaohsiung Taiwan

ISBN: (数字)9781510602984

ISBN: (纸本)9781510602977;9781510602984

Dust is one of the most critical issues in assembly of compact camera module(CCM) for mobile phones. Defect due to dust entry or dust deposit severely degrades image quality. There have been lots of literatures about the compensating of dust defect on images by image processing, but the discussion about where the dust locates is still deficient. Dust may sneak in the CCM in any step of packaging process, so the analysis of the dust location may be useful for improving of the production line. This work develops an optical inspection algorithm to detect the location of dust inside CCM based on imaging optics. A planar light source with uniformly emission is designed as the capture target. A series of defocused images are then taken and analyzed. According to the dependence of the image defect on the capture distance, the location of the dust can be well defined. This inspection algorithm provides an easy and efficient way to help manufacturers improve their packaging process.

关键词： compact camera module CCM dust defect

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A 216 x 216 Global-Shutter CMOS Image Sensor With Embedded Analog Memory and Automatic Exposure Control for Under-Display Optical Fingerprint Sensing Applications

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IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS 2023年第3期70卷 1189-1201页

作者： Yin, Ping-Hung Lu, Chih-Wen Wang, Jia-Shyang Chien, Yuan-Chang Chou, Cheng-Te Su, Guo-Dung John Chen, Poki Natl Tsing Hua Univ Dept Engn & Syst Sci Hsinchu 30013 Taiwan Natl Yang Ming Chiao Tung Univ Inst Photon Syst Tainan 71150 Taiwan Tyrafos Technol Co Ltd Hsinchu 30072 Taiwan Natl Taiwan Univ Grad Inst Photon & Optoelect GIPO Taipei 10617 Taiwan Natl Taiwan Univ Sci & Technol Dept Elect & Comp Engn Taipei 10607 Taiwan

216 x 216 under-display optical fingerprint CMOS image sensor (CIS) is proposed and was prototyped using 0.11-mu m CIS technology. Two analog storage nodes that act as a ping-pong buffer are embedded in each pixel of the global-shutter CIS, rendering a digital buffer unnecessary and increasing the operating frame rate. A processor with automatic exposure (AE) and black-level correction is embedded in the CIS to shorten the data transmission time. The AE and dynamic range enhancement functions are initiated to increase the success rate of fingerprint recognition. The full well capacity and sensitivity of the global-shutter CIS are 9 ke- and 21 V/(lux middot s), respectively. A prototype of the fingerprint sensor consumed only 26 mW with a 3.3-V supply voltage. An imaging lens and the CIS were combined to form the prototype of a compact camera module (CCM). Each pixel size is 6.8 x 6.8 mu m(2), equivalent to a panel resolution of 747 dots per inch with an optical ratio of 5. The sensor chip size is 2.23 x 2.39 mm(2), and the sensing area is 1.469 x 1.469 mm(2), occupying 40.5% of the chip. The prototype CCM was successfully embedded in a mobile phone, and the performance of the CIS was validated in the temperature range of -20 degrees C to 50 degrees C. Even when the interrupt interval for the serial peripheral interface communication was 300 ms, the CIS as a slave device could capture the fingerprint images clearly.

关键词： CMOS image sensor fingerprint CMOS image sensor global-shutter compact camera module

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Defocused Optical System for Analyzing Dust Defects in Imaging Capturing module 10

Defocused Optical System for Analyzing Dust Defects in Imagi...

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Conference on Optical Modeling and Performance Predictions X

作者： Wu, Yi-Ju Chen, Li-Yin Natl Sun Yat Sen Univ Dept Photon 70 Lienhai Rd Kaohsiung 80424 Taiwan

ISBN: (数字)9781510620582

ISBN: (纸本)9781510620582

Dust defect is always a critical issue to degrade image qualities in kinds of imaging capturing modules, such as compact camera modules (CCMs) and digital single lens cameras (DSLRs). Dust particle may be deposited on the surface of lens or sensor in the step of assembly and even in the step of changing lens module by users. There have been lots of studies about image defects produced by dust particles on the surface of lens or sensor and the image compensation for dust defect on images, but the studies about the direct analysis of dust defects are still deficient. In this study, geometrical optics was used to analyze the image defects due to dust in the imaging capturing module. A defocused optical system with a planar light source with Lambertian emission was developed to analyze dust defect with image process and the concept of just noticeable difference (JND) of human vision. The proposed defocused optical system provides a way to help manufacturers to improve their production line efficiently.

关键词： compact camera module CCM Digital single-lens reflex camera DSLR dust defect image process

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Advanced Nanocomposite Lens Materials for Wafer-Level Optics

Advanced Nanocomposite Lens Materials for Wafer-Level Optics

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Conference on Optoelectronic Devices and Integration III

作者： Gan, Haiyong Natl Inst Metrol Beijing 100013 Peoples R China

ISBN: (纸本)9780819483775

Solvent-free, photo-curable, transparent, colorless and haze-free liquid optical polymer materials are primary choices for lenses in wafer level optics. Advanced lens materials are being explored for quality optical, thermal and mechanical properties. Such materials are desired to pass thermal reliability tests, survive stack-reflow processes, have low coefficient of thermal expansion, have high refractive index and extreme dispersion, possess low stress and shrinkage and etc. Novel nanocomposite materials based on 1) finely constructed core-shell nanoparticles with photopolymerizable surfactant crosslink function groups and 2) compatible polymer matrices are promising candidates for imaging and sensing systems with breakthrough performance.

关键词： nanocomposite lens material high refractive index extreme dispersion core-shell nanoparticle optical polymer compact camera module wafer level optics chip scale packaging

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