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A review of passive thermal management of led module

Journal of Semiconductors 2011年第1期32卷 57-60页

作者：叶怀宇 Sau Koh Henk van Zeijl A.W.J.Gielen 张国旗 Delft Institute of Microsystems and Nanoelectronics(Dimes) Delft University of Technology Materials Innovation Institute(M2i) Mekelweg 22628 CDDelftNetherlands Netherlands Organization for Applied Scientific Research(TNO) De Rondom 1 5612 APEindhovenNetherlands

Recently, the high-brightness leds have begun to be designed for illumination application. The increased electrical currents used to drive leds lead to thermal issues. Thermal management for led module is a key design parameter as high operation temperature directly affects their maximum light output, quality, reliability and life time. In this review, only passive thermal solutions used on led module will be studied. Moreover, new thermal interface materials and passive thermal solutions applied on electronic equipments are discussed which have high potential to enhance the thermal performance of led module.

关键词： HB leds led module thermal management passive thermal solution thermal interface material

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Validation methodology to analyze the temperature-dependent heat path of a 4-chip led module using a finite volume simulation

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MICROELECTRONICS RELIABILITY 2017年 79卷 462-472页

作者： Mitterhuber, Lisa Defregger, Stefan Hammer, Rene Magnien, Julien Schrank, Franz Hoerth, Stefan Hutter, Matthias Kraker, Elke Mat Ctr Leoben Forsch GmbH Roseggerstr 12 A-8700 Leoben Austria Tridon Jennersdorf GmbH Technol Pk 10 A-8380 Jennersdorf Austria Hausermann GmbH Zitternberg 100 A-3571 Gars Am Kamp Austria Fraunhofer Inst Zuverlassigkeit & Mikrointegrat Gustav Meyer Allee 25 D-13355 Berlin Germany

Thermal management in the solid-state lighting sector has become a main issue, due to reliability and efficiency issues. Herein, thermal structure function analysis provides a powerful tool to understand the heat transfer inside operated light emitting diode (led) modules. In this paper a combined approach of simulation and experiment, as a heat path analysis of a led module based on four flip chip leds, is presented. A validated simulation was used to visualize on the one hand the heat path as isothermals and on the other hand to show an alternative approach of the electrical transient correction. In addition to that, the structure function analysis also included the consideration of influence parameters in terms of different operating conditions (e.g. heat sink temperature, heating current, the use of different thermal interface materials between the device and the heatsink). This was *** the statistical Design of Experiments (DOE) approach. The DOE dissected the effect of each input variation to different features of the structure functions. An experimental setup showed, that the temperature of the heat sink caused the dominating effect on the thermal properties of the device. Finally numerical simulation confirmed that these effects came from the temperature dependencies of the thermal conductivities. (C) 2017 Elsevier Ltd. All rights reserved.

关键词： Thermal investigation led module Simulation Temperature dependency Structure function Electrical transient correction

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Compact modeling of electrical led module for analysis of led driver system

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OPTIK 2018年 170卷 548-554页

作者： Qiu, Diancheng Liao, Mian Liao, Zhiling Chen, Zhaoling Zhang, Shanshan Jiangsu Univ Sch Elect & Informat Engn Zhenjiang Peoples R China Virginia Polytech Inst & State Univ Bradley Dept Elect & Comp Engn Blacksburg VA 24060 USA

A new nonlinear compact led model is presented in this paper. The model is useful in the design stage of led driver system. The parameter extraction procedure is presented step by step. Since the power of a single led unit is very low, manufacturers often arrange led units in the form of an array named led module. On the basis of theoretical I-V characteristic curve of the led module, the electrical performance of led module can be tested according to the rated parameters provided by its manufacturers. Five fitting methods are used to obtain the fitting curves. The sum of squares due to error (SSE) and the coefficient of determination (R-square) are compared to choose a better fitting curve. Six terms gaussian fitting method, which has optimal fitting performance among the five methods, is chosen to construct the nonlinear mathematical model of the led module, and then the simulation model is built with MATLAB/Simulink. A Boost converter simulation circuit adapts this model, and a 25 W dimming prototype is designed to verify the validity of the model. The simulation and test results show that the error of the model is small, and it meets the requirements of practical application.

关键词： Modeling led module Nonlinear Mathematical model Simulation model

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Si-based packaging platform for led module using electroplating method

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ELECTRONICS LETTERS 2010年第17期46卷 1220-U78页

作者： Wang, C. Lee, W. S. Zhang, F. Kim, N. Y. Kwangwoon Univ RFIC Ctr Seoul 139701 South Korea Nano ENS Co Ltd Dept R&D Suwon 443766 Gyeonggi Do South Korea

A method for fabricating a Si-based packaging platform with a reflector and electrode-guided interconnections is proposed for the packaging component of a high-power light-emitting diode (led) module. The reflector is fabricated by Ni/Au/Ag-electroplating which is patterned by SU-8 2075 and 4620 negative photo-resistors and the electrical interconnections are formed by Cu/Au-electroplating in the same body. The heat generated by the led chip is dissipated directly to the Si body through the large metal-plated platform. This method is suitable for high-efficiency and low-cost led packaging.

关键词： led module electrical interconnections electrode-guided interconnections electronics packaging electroplating electroplating method elemental semiconductors high-power light-emitting diode module light emitting diodes negative photoresistors packaging platform photoresistors reflector semiconductor device metallisation silicon

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Analysis of Thermal Resistance Characteristics of Power led module

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IEEE TRANSACTIONS ON ELECTRON DEVICES 2014年第1期61卷 105-109页

作者： Wang, Chien-Ping Kang, Shung-Wen Lin, Kuan-Min Chen, Tzung-Te Fu, Han-Kuei Chou, Pei-Ting Ind Technol Res Inst Elect & Optoelect Res Labs Hsinchu 31040 Taiwan Tamkang Univ Mech & Electro Mech Dept Taipei 25137 Taiwan

Multichip led arrays are widely used for lighting to provide high luminance. Luminous efficacy, lifetime, and color temperature are highly dependent on the temperature at p-n junction. This paper investigated the effects of distance, number of chips, and driving current on the thermal resistance of led module. Thermal resistance dramatically increased as the distance between led chips decreased due to significant thermal spreading impedance for heat dissipation from junction to ambient. The parallel-resistance formula substantially underestimated the junction temperature of the led modules due to significant thermal crowding effect. Thermal boundary can also rise junction temperature as the distance to the board edge decreased in both the two-chip and four-chip modules. Infrared results showed that chip temperatures were highly consistent with thermal resistance measurements under different driving currents.

关键词： Junction temperature led module thermal resistance

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Thermal resistance analysis of high power led module under power cycling test 15

Thermal resistance analysis of high power LED module under p...

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15th International Conference on Electronic Packaging Technology (ICEPT)

作者： Huang, Hao Cai, Miao Tian, Kunmiao Chen, Yunchao Jia, Hongliang Yang, Daoguo Guilin Univ Elect Technol Sch Mech & Elect Engn Guilin Peoples R China

ISBN: (纸本)9781479947072

High junction temperature is always a big concern for the led products since it is generally associated with the product's reliability. Therefore, the way to maintain an adequate cooling capacity is extremely important for led module. It is no doubt that thermal resistance is one of critical indicators restricting the heat dissipation. In this work, one led module with ceramic carrier is submitted to power cycling test, and T3ster transient thermal analysis tester is employed to measure the electrical and thermal properties of led module. During the power cycling testing, the temperature and thermal resistance are monitored, with a goal to analyze the thermal resistance rise at different layer inside led module. The result indicates the total thermal resistance of the led module climbs dramatically after power cycling test, in which the increased thermal resistance of the solder joint layer shows a crucial contribution obviously. Based on the experimental investigation, the increased thermal resistance of the solder joint is key reason that leads to the increasing junction temperature of led package. It's concluded the solder joint layer should be regarded as a key role on reducing the total thermal resistance of led module. The material and structure of solder joint layer should be designated based on the thermal resistance performance during the long time operating in order to enhance the reliability of led module.

关键词： led module thermal resistance solder joint power cycling test

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Study on the Thermal-Humidity Reliability of High Power led module

Study on the Thermal-Humidity Reliability of High Power LED ...

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4th International Conference on Digital Manufacturing and Automation (ICDMA)

作者： Pan, Kailin Huang, Jing Guo, Yu Chen, Renzhang Guilin Univ Elect Technol Sch Mech & Elect Engn Guilin 541004 Peoples R China

ISBN: (纸本)9780769550169

led lighting becomes the forth generation green lighting. However, in terms of led development and large-scale application, the reliability of led has become one of the technical bottlenecks. This paper carried out the research on the thermal-humidity reliability of high power led module by the means of experiment and simulation, which mainly aims at the reliability problems existed in high power led products. Thermal-humidity experiments which takes high power led module with 10W as the experimental sample and simulation analysis based on FEM (Finite Element Method) software ANSYS are carried out. The results show that, high temperature is the main factor which affects the thermal-humidity reliability of high power led module.

关键词： thermal-humidity reliability led module thermal-humidity simulation

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Numerical Analysis on Temperature Field in a led module

Numerical Analysis on Temperature Field in a LED Module

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Advanced Polymer Processing International Forum

作者： Du, Dongxing Li, Yingge Luo, Xiaobing Qingdao Univ Sci & Technol Coll Electromech Engn Qingdao 266061 Peoples R China Qingdao Univ Sci & Technol Coll Automat & Elect Engn Qingdao 266042 Peoples R China Huazhong Univ Sci & Technol Sch Energy & Power Engn Wuhan 430074 Peoples R China

ISBN: (纸本)9783037850299

The working temperature has great effect on the reliability of led modules. In this paper, numerical analysis is carried out on predicting the temperature field in a led module based on simplified two-dimensional model. It is found that the highest temperature manifests in the led chip and more than 99% of the heat generated by the led chip are transferred out through the copper heat sink. Parametric study shows significant temperature increment from 327K to 384K in the led lighting chip by decreasing 10 times of the thermal conductivity values of conductive layer from 24.5W/(m.K) to 2.45W/(m.K). It is concluded that the key factor in heat transfer process inside the led module is the thermal resistance of the thermal conductive layer lying between led chip and copper heat sink.

关键词： led module temperature distribution numerical analysis

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Research on Automation of Production Line for Standard Lamp led module

Research on Automation of Production Line for Standard Lamp ...

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作者： Ye Shenghao Miao Rui Chen Yu School of Mechanical Engineering Shanghai Jiao Tong University

led module is the luminous part of lighting fittings. There are many kinds of lighting fittings. According to different places where used, it is divided into roadway lighting fittings, landscape lighting fittings, commercial lighting fittings, and the others. The design of standardized led modules is a consensus in the industry to improve production efficiency and reduce production costs. The problems that result in are how to improve the production efficiency of standard lamp led modules, improve production quality, reduce production costs and reduce production waste. This paper draws a certain conclusion by studying the automatic production line of standard lamp led modules and optimizing the original manual production line. It provides research foundation for the optimization of production lines in the industry.

关键词： led module automatic production line production efficiency

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Thermal resistance analysis of high power led module under power cycling test

Thermal resistance analysis of high power LED module under p...

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The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

作者： Hao Huang Miao Cai Kunmiao Tian Yunchao Chen Hongliang Jia Daoguo Yang School of Mechanical and Electrical Engineering Guilin University of Electronic Technology Guilin China

High junction temperature is always a big concern for the led products since it is generally associated with the product's ***,the way to maintain an adequate cooling capacity is extremely important for led *** is no doubt that thermal resistance is one of critical indicators restricting the heat *** this work,one led module with ceramic carrier is submitted to power cycling test,and T3ster transient thermal analysis tester is employed to measure the electrical and thermal properties of led *** the power cycling testing,the temperature and thermal resistance are monitored,with a goal to analyze the thermal resistance rise at different layer inside led *** result indicates the total thermal resistance of the led module climbs dramatically after power cycling test,in which the increased thermal resistance of the solder joint layer shows a crucial contribution *** on the experimental investigation,the increased thermal resistance of the solder joint is key reason that leads to the increasing junction temperature of led ***'s concluded the solder joint layer should be regarded as a key role on reducing the total thermal resistance of led *** material and structure of solder joint layer should be designated based on the thermal resistance performance during the long time operating in order to enhance the reliability of led module.

关键词： led module thermal resistance solder joint power cycling test

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