检索结果-内蒙古大学图书馆

Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration multichip module

引用

JOURNAL OF ELECTRONIC PACKAGING 2024年第4期146卷 041101-041101页

作者： Gharaibeh, Ahmad R. Soud, Qusai Manaserh, Yaman Tradat, Mohammad Sammakia, Bahgat Binghamton Univ SUNY ES2 Ctr Dept Mech Engn Binghamton NY 13902 USA

The variety of new electronic packaging technologies has grown signiicantly over the last 20 years as a result of market demands for higher device performance at lower costs and in less space. Those demands have pushed for heterogeneous packaging, where computer chips with different stack heights are closely packed, creating nonuniform heat flux and temperature and additional challenges for thermal management. Without implementing an appropriate thermal management strategy for heterogeneous packages, large temperature gradients can be observed within the package, which would increase the thermal stresses on the chip and raise reliability issues. To mimic this real-life scenario of such packaging, an experimental setup was designed and built. The design of the new experimental setup consists of four identical 1.2 cm x 1.2 cm ceramic heaters, each of which is connected to a separate power supply and can reach a heat flux of 140 W/cm2. Accordingly, this mock package is capable of delivering different power levels to mimic different multicore microprocessor conditions. To give the heater the ability to move precisely in the x- , y- , and z-directions, each heater is mounted to an XYZ linear stage. Deionized water (DI) was used as the working fluid, and a pin-in heat sink was used to run the initial steady-state tests on the experimental rig. The tests showed how different flow rates at a constant fluid temperature and input power affect the temperatures of the heaters and the thermohydraulic performance of the heat sink. In addition, a three-dimensional numerical model has been developed and validated with experimental data in terms of heat sink pressure drop and the temperatures of the heaters.

关键词： multichip module liquid cooling heat sink data centers heat transfer

来源：评论

学校读者我要写书评

暂无评论

Multiphysics Simulation and Measurement Correlation of a multichip module IC Package Current Sensor 33

Multiphysics Simulation and Measurement Correlation of a Mul...

引用

33rd Conference on Electrical Performance of Electronic Packaging and Systems

作者： Murugan, Rajen Chen, Jie Li, Guangxu Suzuki, Yutaka Ankamah-Kusi, Sylvester Texas Instruments Inc Dallas TX 75243 USA

ISBN: (纸本)9798350351248;9798350351231

As the semiconductor market shifts its focus to 3D integration, lowest cost, and high performance, the need for advanced analog packaging technologies becomes paramount. Integrating multichip and passives onto cost-effective package technologies create opportunities for highly competitive semiconductor products. However, this aggressive integration also leads to complex multiphysics and multiscale interactions, especially for small-form-factor modules. This work describes the multiphysics (electrical-thermal-mechanical) co-design modeling methodology that resulted in the industry's first highly accurate, voltage-output multichip module current-sense integrated circuit. The reliability of the multiphysics modeling methodology was confirmed by directly comparing it to measurements taken on a 36V, bi-directional, precision current sense amplifier with an integrated shunt resistor evaluation module (EVM). The study demonstrates a strong correlation (within +/- 0.3-2.5% difference) between simulation and laboratory measurements, underscoring the practical relevance and impact of our research.

关键词： Advanced packaging Current sensor multichip module Multiphysics modeling Correlation

来源：评论

学校读者我要写书评

暂无评论

A Process Design Method for multichip module using Model Based Definition 23

A Process Design Method for Multichip Module using Model Bas...

引用

23rd International Conference on Electronic Packaging Technology (ICEPT)

作者： Li, Yang Wu, Yilong Chen, Chunmei Zhang, Yanming Hou, Qifeng Zeng, Ce 29th Res Inst CETC Dept Microwave Integrat Ctr Chengdu Peoples R China

ISBN: (数字)9781665499057

ISBN: (纸本)9781665499057

Benefit from high performance, high integration density, high heat dissipation and relatively low cost, the application of MCM (multichip module) has spread from military, aerospace and mainframe computers to electronic system products such as automobiles, communications, industrial devices, instruments and medical equipment. However, unlike chip design or PCB design, there is no mature design method for MCM based on model. 2D drawing-based design software, such as AutoCAD, are still using for MCM design. Thus, the design file doesn't include sufficient manufacturing data for process design, such as manufacturability check and process flow design. In order to improve the actual efficiency and accuracy of the process design, a method based on model-based definition was approved. This method is applied in Allegro SiP Layout design platform and realized by secondary development using SKILL command language. Through this method, a 3D model of MCM, which contains geometric dimension, cross-section of substrate, bill of materials (BOM), die type, bond wire and other definitive manufacturing data, is designed. With this model, an assembly manufacturability check, which evaluates the manufacturability and producibility of design model, can be applied along with designing. Then, a process flow design scheme, which includes the allocation of BOM, is generated using this design model. According to the test results of process design of MCM, this method was benefit for reducing design error, reducing reliance on manual experience, improving the automation of process design, and resulted in faster feedback loops, better decisions, and faster-to-market products.

关键词： Process design multichip module Model-based definition

来源：评论

学校读者我要写书评

暂无评论

Structural Testing of multichip module SoC Components 3rd

Structural Testing of Multichip Module SoC Components

引用

3rd International Conference on Microelectronics, Computing and Communication Systems (MCCS)

作者： Hosur, Amruta Shylashree, N. Rashtreeya Vidyalaya Coll Engn VLSI Design & Embedded Syst Bengaluru 560059 India Rashtreeya Vidyalaya Coll Engn Dept ECE Bengaluru 560059 India

ISBN: (纸本)9789811370915;9789811370908

In modern VLSI, the testing of manufactured VLSI chips is as important as the whole process of designing and manufacturing. The structural testing plays an important role as the functional testing. Structural testing, unlike functional testing, involves testing of all the physical connections, macros, other functional blocks in the SoC (System on chip). In the structural testing of SoC boundary Scan standards (IEEE 1149.1, IEEE 1687, and IEEE 1500) are used. The complete testing of SoC can be achieved by testing the individual components of the SoC. In case of multichip module SoC, the testing can be done at the complete SoC level as well as at the chip level. In this paper, the structural testing of one of the unique component of the SoC "Fuse Macro" is explained.

关键词： Structural testing multichip module Automatic test equipment (ATE)

来源：评论

学校读者我要写书评

暂无评论

Temperature Estimation of High Temperature Data Acquisition multichip module for Oil Field Apparatus 15

Temperature Estimation of High Temperature Data Acquisition ...

引用

15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

作者： Meng, Xianglong Wang, Guangwei Cao, Hui Gao, Shuang Cheng, Jingjng Huazhong Univ Sci & Technol Sch Automaton Wuhan 430074 Peoples R China China Oilfield Serv Ltd Well Tech R&D Inst Beijing 101149 Peoples R China Xian Microelect Technol Inst Xian 710075 Peoples R China

ISBN: (纸本)9781467381215

Deeper reservoirs are being explored in the search for sources of oil and gas, and this implies a need for oil field apparatus capable of measuring temperatures higher than 200 degrees C. However, very few integrated circuit (especially digital integrated circuit) products are available that can operate at high temperatures. multichip modules (MCMs) have been used at high temperatures in some studies, but the integrated circuits used in MCMs are not designed specifically to operate at these temperatures. It is therefore essential to develop MCMs for estimating high temperatures. Simulations of chips in a plastic package and an MCM were performed, and the results compared. A spreading thermal resistance model was used to assess the temperature distribution in the MCM, which was then tested at 200 degrees C to determine its performance at high temperatures. Good agreement was obtained between the calculated and experimental results, showing that the MCM could be used in oil fields at temperatures as high as 200 degrees C.

关键词： multichip module Oil Field Apparatus Thermal Simulation

来源：评论

学校读者我要写书评

暂无评论

Microwave multichip module Tridimensional Assembly Technology Based on LTCC 15

Microwave Multichip Module Tridimensional Assembly Technolog...

引用

15th International Conference on Electronic Packaging Technology (ICEPT)

作者： Zhang, T. Acad Space Elect Informat Technol Aerosp Elect Mfg Ctr Xian Peoples R China

ISBN: (纸本)9781479947072

With the evolution of microwave substrate, microwave mu/lie/zip modules are developing towards multilayer. Combined with S'MT, high-precision chip assembly, circuit connection, anti-influence partition soldering module integration technology and so on, those multilayer products constructed by utilizing LTCC technology are attractive candidates to satisfy the demand for telecomnutnication systems with miniaturized size, intergrated structure and light weight.

关键词： multichip module LTCC tridimensional assembly

来源：评论

学校读者我要写书评

暂无评论

Design, Analysis and Validation of MCP Package for GaAs Monolithic Microwave Integrated Circuits Packaging

引用

IETE JOURNAL OF RESEARCH 2023年第11期69卷 8293-8306页

作者： Gugulothu, Ravi Bhalke, Sangam Lalkishore, K. Dasari, Ramakrishna Gallium Arsenide Enabling Technol Ctr Dept ATQC Hyderabad India Osmania Univ Univ Coll Engn Autonomous Dept ECE Hyderabad India

This paper describes the design aspects of high reliable packages including package resonance, material selection, and feed-through design to match the die designer specifications. Design, simulation and thin film fabrication of 50 ohm microstrip line on a 10 mil Al2O3 substrate suitable for MMIC assembly are also presented. Al2O3 substrate is taken because of lower transitional losses at the seal ring of the package, lower leakage and best suitable for hermiticity. Strip line design, study and the input-output transitions between two ports is analysed and optimized. Evidence of package self resonating mode study carried out theoretically and similar is simulated by using CST microwave studio. Package physical model analysis is carried out on a metal-ceramic package (MCP) which is suitable for embedding an amplifier of 20 dB gain and low power in c-band, 35 dB gain and low noise figure in s-band and 28 dB typical gain in x-band. Packaging effects in each case is analysed and optimised to meet the design requirements. With systematic ideas, the complete package modelling, characterization and MMICs packaging are carried out as per the reliability standards for space application. This package is sealed using the hermetic sealing technique to assure no leakage when subjected to the environmental test conditions like operating temperature test, active burn-in test for 240 h and steady-state life test for 1000 h to check MMIC behaviour under overstress conditions. Packaged module RF performances are noted at pre-subjected and post-subjected temperature conditions. Drifts are calculated at both temperature stages.

关键词： Ceramics GaAs Gain block Low noise amplifier MMIC multichip module Packaging System in package System on chip

来源：评论

学校读者我要写书评

暂无评论

In-Place Evaluation of Powering and Signaling Within Fan-Out Multiple IC Chip Packaging

引用

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 2022年第7期12卷 1140-1149页

作者： Sonoda, Hiroki Kasai, Ryo Tanaka, Daisuke Murakami, Yoshihide Mihara, Kyoshi Araga, Yuuki Watanabe, Naoya Shimamoto, Haruo Kikuchi, Katsuya Miki, Takuji Nagata, Makoto Kobe Univ Grad Sch Sci Technol & Innovat Kobe Hyogo 6578501 Japan Murata Mfg Co Ltd Kyoto 6178555 Japan AIST Tsukuba Headquarters Natl Inst Adv Ind Sci & Technol AIST Tsukuba Ibaraki 3058560 Japan

This article confirms the advantage of fan-out (FO) packaging in the electrical performance of power delivery among integrated circuit (IC) chips with the best use of land side capacitors (LSCs). On-chip in-place waveform measurements quantitatively evaluate the integrity of powering and signaling within FO wafer level packaging (FOWLP) multiple chip module (MCM) demonstrators, where a pair of IC chips are assembled with LSCs with different sizes and structures. The IC chip incorporates an array of 12 digital cores and on-chip waveform monitor (OCM) circuits. Each digital core consists of a low-voltage differential signaling (LVDS) transceiver channel that is backed by a static random access memory (SRAM)-based built-in self test (BIST) module and supplied by an on-chip voltage regulator module (VRM). The LSCs are placed on the bottom side of an FO interposer and inserted between the output of VRM and the ground plane almost ideally with the shortest length of physical traces. A Si membrane capacitor of 10 nF sustains the lowest power line impedance over the frequency range of 2.0 GHz more constantly than a multilayer ceramic counterpart, and attenuates the high-order harmonic frequency components to the clocking frequency at 750 MHz. The leverage of LSCs in powering also improves signaling and helps achieve the wider eye openings in LVDS channels. The implications are elaborated for the capacitor selections with respect to the physical types of capacitors, the size of capacitances, and the level of shares in power delivery among digital cores, all toward the higher level of integrity in powering and signaling in FOWLP MCMs.

关键词： Capacitors Integrated circuits Integrated circuit modeling Packaging Built-in self-test Random access memory System-on-chip Fan-out (FO) packaging low-voltage differential signaling (LVDS) multichip module on chip monitoring power delivery network (PDN) power integrity power noise signal integrity Si capacitor (SiCap)

来源：评论

学校读者我要写书评

暂无评论

Microwave multichip module Tridimensional Assembly Technology Based on LTCC

Microwave Multichip Module Tridimensional Assembly Technolog...

引用

The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

作者： T.Zhang Aerospace Electronics Manufacturing Center Academy of Space Electronic Information Technology Xi'an China

ISBN: (纸本)9781479947065

With the evolution of microwave substrate,microwave multichip modules are developing towards *** with SMT,high-precision chip assembly,circuit connection,anti-influence partition soldering,module integration technology and so on,those multilayer products constructed by utilizing LTCC technology are attractive candidates to satisfy the demand for telecommunication systems with miniaturized size,intergrated structure and light weight.

关键词： multichip module LTCC tridimensional assembly

来源：评论

学校读者我要写书评

暂无评论

Mathematics of Gas Ingress of Hermetic Packages

引用

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 2020年第12期10卷 1973-1978页

作者： Fang, Lu Menk, Lyle Alexander Sandia Natl Labs Adv Packaging & Integrat Dept POB 5800 Albuquerque NM 87185 USA

We have derived a gas ingress and egress equation from the first principles of ideal gases. This work is intended to benefit the hermetic microelectronics packaging community, but it may be applied to other fields that require a deep understanding of gas ingress and egress dynamics. The equation outlined herein encompasses package material properties, package characteristics, hermetic testing conditions, and service conditions. It serves as a practical utility for calculating package pressure changes due to gas ingress and egress and, therefore, a power tool for component and system service life predictions.

关键词： Packaging Reliability Microelectronics Helium Fluid flow Semiconductor devices Gas egress gas ingress hermetic leak multichip module packages reliability

来源：评论

学校读者我要写书评

暂无评论

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案：

请选择收藏分类：

通借通还

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：