检索结果-内蒙古大学图书馆

Empirical expressions for characteristic impedance of modified microstrip-like interconnections

AEU-INTERNATIONAL JOURNAL OF ELECTRONICS AND COMMUNICATIONS 2010年第7期64卷 682-684页

作者： Sharma, Rohit Chakravarty, T. Bhattacharyya, A. B. Jaypee Univ Informat Technol Waknaghat 173215 Solan India Tata Consultancy Serv Embedded Syst Innovat Lab Bangalore 560067 Karnataka India Jaypee Inst Informat Technol Univ Noida 201307 India

In this work, we investigate modified microstrip structures - a microstrip line with an aperture in the ground plane below the line and a microstrip line guarded by adjacent ground tracks. Closed-form expressions are presented for the characteristic impedance of these microstrip-like interconnects. The formulae given have been designed for use in PCB, MCM and MIC CAD programs. The predicted results are compared with FDTD simulations and measured data that show excellent accuracy. (C) 2009 Elsevier GmbH. All rights reserved.

关键词： Microstrip lines Finite-difference time-domain Printed circuits multichip module Characteristic impedance

来源：评论

学校读者我要写书评

暂无评论

A Light Weight 8-Element Broadband Phased Array Receiver on Liquid Crystal Polymer

A Light Weight 8-Element Broadband Phased Array Receiver on ...

引用

IEEE MTT-S International Microwave Symposium Digest

作者： Chieh, Jia-Chi Samuel Pham, Anh-Vu Dalrymple, Thomas W. Kuhl, David G. Garber, Brian B. Aihara, Kunia Univ Calif Davis Dept Elect & Comp Engn Davis CA 95616 USA AF Res Lab Dayton OH USA

ISBN: (纸本)9781424460571

In this paper we present a light weight broadband phased array hybrid receiver module on a multi-layer Liquid Crystal Polymer (LCP) substrate. The phased array module has 8 channels and is designed to operate in the Ka-band, from 32-37 GHz. A broadband linear tapered slot antenna array with a corporate power combiner, chip-on-board MMICs, and all control chips necessary for beam steering are all integrated on a multi-layered near-hermetic LCP substrate. The phased array antenna has a measured bandwidth of 5 GHz with +/- 30 degrees beam steering capability from boresight, and shows less than 6.75 degrees of beam squint across the full bandwidth of operation. The total size of the array is 100 mm x 100 mm with a board thickness of only 16 mils and weighs only 12.3 grams.

关键词： Phased array radar multichip module beam forming MIMO systems smart antennas

来源：评论

学校读者我要写书评

暂无评论

Thermal analysis for indirect liquid cooled multichip module using computational fluid dynamic simulation and response surface methodology

引用

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 2006年第1期29卷 39-46页

作者： Cheng, YJ Xu, GW Zhu, DP Zhu, WJ Luo, L Chinese Acad Sci Shanghai Inst Microsyst & Informat Technol Shanghai 200050 Peoples R China Jiangnan Inst Comp Technol Jiangsu 214000 Peoples R China

This paper demonstrates the application of computational fluid dynamic (CFD) simulation and response surface methodology (RSM) in analyzing the thermal performance of a high input/outputs, seven chips, indirect liquid cooled multichip module which will be applied in a kind of supercomputer. A series of similar experiments and corresponding CFD simulations are conducted firstly to evaluate the validity of CFD simulation method and determine the interfacial thermal resistance of thermal grease iteratively, and then a three-dimensional CFD model is established to investigate the heat transfer and fluid flow of the multichip module. Based on the CFD model, the individual effects of factors such as thermal conductivity of the thermal interface material and thermal grease, thickness of the chips, space between chips, solder bump patterns, solder ball patterns, flow velocity and liquid inlet temperature on the thermal performance of the module are studied with one-factor-at-a-time experimentation, and after that, four significant factors are selected to establish a response surface model of the maximum temperature of the module with central composite design based RSM and analysis of variance.

关键词： computational fluid dynamic (CFD) indirect liquid cooling multichip module response surface methodology (RSM)

来源：评论

学校读者我要写书评

暂无评论

MCM Interconnect Test Project using Ant Colony Algorithm with Crossover Operator

MCM Interconnect Test Project using Ant Colony Algorithm wit...

引用

2010 International Conference on Intelligent Computing and Integrated Systems

作者： Lei Chen College of Computer & Control Guilin University of Electronic Technology Guilin,Guangxi,P.R.China 541004

A novel multi-chip module(MCM) interconnect test generation project using ant colony algorithm(ACA) with crossover operator is presented in this *** combing the characteristics of MCM interconnect test generation,the pheromone updating rule and state transition rule of ACA is *** using crossover operator in this project,ordinary ACA's defects of slow convergence speed,easy to get stagnate, and low ability of full search can be *** international standard MCM benchmark circuit provided by the MCNC group was used to validate the approach. Simulation results,which compare to the results of standard ACA,genetic algorithm(GA) and other deterministic interconnecting algorithms,show that the proposed project can achieve high fault coverage,compact test set and short CPU time.

关键词： ant colony algorithm crossover operator multichip module interconnect test

来源：评论

学校读者我要写书评

暂无评论

Development of a broadband Wilkinson Power Combiner on Liquid Crystal Polymer

Development of a broadband Wilkinson Power Combiner on Liqui...

引用

Asia Pacific Microwave Conference 2009

作者： Chieh, Jia-Chi Samuel Pham, Anh-Vu Univ Calif Davis Dept Elect & Comp Engn Davis CA 95616 USA

ISBN: (纸本)9781424428014

We present the development of a broadband multisection Wilkinson power combiner on Liquid Crystal Polymer (LCP) with integrated thin film resistors. The designed frequency of operation is from 2-18 GHz. The measured VSWR is better than 1.6:1, the measured excess insertion loss is less than 1.1dB, and 11dB of isolation is measured across the full band. This work presents the highest performance Wilkinson combiner with the widest bandwidth ratio of 9:1 reported in literature.

关键词： multichip module Wilkinson power divider power combiners power dividers

来源：评论

学校读者我要写书评

暂无评论

A thermal model for a multichip device with changing cooling conditions

A thermal model for a multichip device with changing cooling...

引用

2008 4th IET Conference on Power Electronics, Machines and Drives

作者： G.C. James V. Pickert M. Cade Newcastle University Newcastle upon Tyne Tyne and Wear GB Power Electronics Drives and Machines Group School of Electical Electronic and Computer Engineering University of Newcastle Newcastle-upon-Tyne UK Control Techniques The Gro Newtown Powys SY 16 3BE UK

ISBN: (纸本)9780863419003

This paper describes the development of a thermal model for a multichip device cooled by a force cooled heatsink employing fan speed control. The model can be used to estimate the temperature of a device in a system where the thermal coupling between devices is significant and the characteristics of the heatsink are altered by the fan speed. The model is developed for a simplified experimental test configuration and is verified against practical results.

关键词： Thermal Model Inverter Thermal Impedance Matrix multichip module Compact Model

来源：评论

学校读者我要写书评

暂无评论

Optimization of the multichip module performance modeling using neural networks

引用

ANNALS OF TELECOMMUNICATIONS 2004年第9-10期59卷 1092-1117页

作者： Yagoub, MCE Univ Ottawa Ecole Ingn & Technol Informat Ottawa ON K1N 6N5 Canada

Widely used in microwave multichip module design, passive device models are subject to intensive researches. This paper introduces the concept of automate generation of neural models for passives and interconnects. Accurate and fast, these models efficiently integrate electromagnetic effects present at microwave frequencies. By optimizing the circuit performance, the proposed approach can automatically predict not only the final geometrical structure of the different passive components and their respective interconnects but also, for the fist time, their optimum location in the circuit. Applications using passive models implemented in circuit simulators are presented.

关键词： microwave integrated circuit hybrid integrated circuit passive component interconnection neural network optimization automation simulator multichip module

来源：评论

学校读者我要写书评

暂无评论

multichip optical transmitter module for chip-to-chip interconnection on optical PCBs

引用

ELECTRONICS LETTERS 2006年第14期42卷 805-806页

作者： Kang, S. -K. Lee, T. -W Hwang, S. H. Cho, M. H. Park, H. -H. Informat & Commun Univ Opt Interconnect & Switching Lab Taejon 305732 South Korea

A multichip module of an optical transmitter, which consists of flip-chip bonded 1 x 4 VCSELs on a CMOS driver array IC, is fabricated and demonstrated. The -3 dB bandwidth and adjacent crosstalk of the hybrid integration multichip module are about 4.5 GHz and less than -30 dB, respectively. The whole integrated multichip volume is 1.1 x 1.2 x 0.52 mm(3) for four channels.

关键词： CMOS integrated circuits driver circuits flip-chip devices multichipmodules optical interconnections optical transmitters printed circuits surface emitting lasers CMOS driver array integrated circuit chip-to-chip interconnection multichip module multich

来源：评论

学校读者我要写书评

暂无评论

Capacitive inter-chip data and power transfer for 3-D VLSI

引用

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS 2006年第12期53卷 1348-1352页

作者： Culurciello, Eugenio Andreou, Andreas G. Yale Univ Dept Elect Engn New Haven CT 06520 USA Johns Hopkins Univ Dept Elect & Comp Engn Baltimore MD 21218 USA

We report on inter-chip bidirectional communication and power transfer between two stacked chips. The experimental prototype system components were fabricated in a 0.5-mu m silicon-on-sapphire CMOS technology. Bi-directional communication between the two chips is experimentally measured at 1 Hz - 15 MHz. The circuits on the floating top chip are powered with capacitively coupled energy using a charge pump. This is the first demonstration of simultaneous nongalvanic power and data transfer between chips in a stack. The potential use in 3-D VLSI is aimed at reducing costs and complexity that are associated with galvanic inter-chip vias in 3-D integration.

关键词： AC coupling capacitive coupling chip-to-chip communication multichip module proximity communication silicon-on-insulator (SOI) silicon-on-sapphire (SOS) threedimensional (3-D) integration

来源：评论

学校读者我要写书评

暂无评论

Assembly of MCM thermal solution utilizing individual heat spreaders

Assembly of MCM thermal solution utilizing individual heat s...

引用

22nd Annual IEEE Semiconductor Thermal Measurement and Management Symposium

作者： Edwards, David L. Hering, Ronald L. Long, David C. Singh, Surinder IBM Server & Technol Grp 2070 Route 52 Hopewell Jct NY 12533 USA IBM Server & Technol Grp Poughkeepsie NY 12533 USA

ISBN: (纸本)1424401534

Some recent IBM UNIX Servers use Multi-Chip modules (MCMs) with multi-core processor chips with very high power densities, requiring aggressive thermal solutions. The thermal solution includes flip chips with individually attached heat spreaders. Because of the difficulty of reworking the thermal solution, and the high value of the module at the time the cooling solution is assembled, very high assembly yields were required. This drove new technologies, and new processes to enable assembly of highly efficient cooling structures with very high yields. This paper addresses the challenges of assembling the heat spreader cooling solution, and describes how these challenges were overcome..

关键词： multichip module cooling assembly measurement flipchip devices

来源：评论

学校读者我要写书评

暂无评论

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案：

请选择收藏分类：

通借通还

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：