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检索条件"主题词=Near Sensor Processing"
4 条 记 录,以下是1-10 订阅
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ReFrAEN: a Reconfigurable Vibration Analysis Framework for Constrained sensor Nodes  17
ReFrAEN: a Reconfigurable Vibration Analysis Framework for C...
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17th Annual IEEE International Conference on Distributed Computing in sensor Systems (IEEE DCOSS)
作者: Thangarajan, Ashok Samraj Yang, Fan Joosen, Wouter Michiels, Sam Hughes, Danny Katholieke Univ Leuven Imec DistriNet Leuven Belgium
Vibration monitoring uses data gathered from accelerometers to study kinetic phenomena in applications such as: structural health monitoring and predictive maintenance. The Internet of Things (IoT) has the potential t... 详细信息
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GAP-8: A RISC-V SoC for AI at the Edge of the IoT  29
GAP-8: A RISC-V SoC for AI at the Edge of the IoT
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29th Annual IEEE International Conference on Application-Specific Systems, Architectures and Processors (ASAP)
作者: Flamand, Eric Rossi, Davide Conti, Francesco Loi, Igor Pullini, Antonio Rotenberg, Florent benini, Luca GreenWaves Technol Villard Bonnot France Univ Bologna DEI Bologna Italy Swiss Fed Inst Technol Integrated Syst Lab Zurich Switzerland
Current ultra-low power smart sensing edge devices, operating for years on small batteries, are limited to low-bandwidth sensors, such as temperature or pressure. Enabling the next generation of edge devices to proces... 详细信息
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An interoperable tool-chain for energy monitoring applications  111
An interoperable tool-chain for energy monitoring applicatio...
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111th AEIT International Annual Conference (AEIT)
作者: Brunelli, Davide Cinotti, Tullio Salmon Woehrl, Hugo Aguzzi, Cristiano Montori, Federico Benini, Luca Univ Trento DII Trento Italy Univ Bologna Bologna Italy Swiss Fed Inst Technol Integrated Syst Lab Zurich Switzerland
Non-Intrusive Load Monitoring (NILM) is the disaggregation of the power consumption of individual appliances from agglomerated measurements taken from a single point of measure. The paper proposes a NILM methodology b... 详细信息
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Sub-mW multi-Gbps chip-to-chip communication Links for Ultra-Low Power IoT end-nodes
Sub-mW multi-Gbps chip-to-chip communication Links for Ultra...
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IEEE International Symposium on Circuits and Systems (ISCAS)
作者: Dazzi, Martino Palestri, Pierpaolo Rossi, Davide Bandiziol, Andrea Loi, Igor Bellasi, David Benini, Luca Univ Bologna DEI Bologna Italy Univ Udine DPIA Udine Italy ETH Integrated Syst Lab Zurich Switzerland
We report on the design of the physical layer of a high-speed serial interface for chip-to-chip communication, targeting low cost and ultra-low power (mW) IoT end-nodes. Two differential lanes (one pair per direction)... 详细信息
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