咨询与建议

限定检索结果

文献类型

  • 2 篇 期刊文献
  • 2 篇 会议

馆藏范围

  • 4 篇 电子文献
  • 0 种 纸本馆藏

日期分布

学科分类号

  • 3 篇 工学
    • 1 篇 电气工程
    • 1 篇 电子科学与技术(可...
    • 1 篇 生物工程
  • 2 篇 理学
    • 1 篇 物理学
    • 1 篇 生物学
  • 1 篇 医学

主题

  • 4 篇 package module
  • 1 篇 folded shape
  • 1 篇 electronics pack...
  • 1 篇 factory environm...
  • 1 篇 adaptive module
  • 1 篇 application prog...
  • 1 篇 thermal cycling
  • 1 篇 dispersion relat...
  • 1 篇 propagating
  • 1 篇 axial magnetic f...
  • 1 篇 radial
  • 1 篇 fatigue life
  • 1 篇 large diameter
  • 1 篇 inflation pressu...
  • 1 篇 wave characteris...
  • 1 篇 flexible packagi...
  • 1 篇 active device
  • 1 篇 matthews correla...
  • 1 篇 manufacturing co...
  • 1 篇 pcb warpage

机构

  • 1 篇 interdisciplinar...
  • 1 篇 institute of mic...
  • 1 篇 univ illinois ct...
  • 1 篇 xidian univ sch ...
  • 1 篇 inst syst biol s...
  • 1 篇 univ washington ...
  • 1 篇 huawei technolog...
  • 1 篇 univ illinois de...
  • 1 篇 univ illinois de...

作者

  • 1 篇 lixi wan
  • 1 篇 guan rongcheng
  • 1 篇 price nathan d.
  • 1 篇 xueping guo
  • 1 篇 jason chan
  • 1 篇 eddy james a.
  • 1 篇 kawai y
  • 1 篇 di zhang
  • 1 篇 zhao laiqiang
  • 1 篇 tianmin du
  • 1 篇 xia zhang
  • 1 篇 ko younhee
  • 1 篇 liqiang cao
  • 1 篇 takechi s
  • 1 篇 magis andrew t.
  • 1 篇 funk cory c.
  • 1 篇 anmou liao
  • 1 篇 kaneda n
  • 1 篇 yanchun zheng
  • 1 篇 tian wenchao

语言

  • 3 篇 英文
  • 1 篇 其他
检索条件"主题词=Package Module"
4 条 记 录,以下是1-10 订阅
The development of a folded 3D flexible package module based on flexible substrate
The development of a folded 3D flexible package module based...
收藏 引用
Electronic System-Integration Technology Conference
作者: Xia Zhang Jason Chan Xueping Guo Yuan Lu Yanchun Zheng Di Zhang Anmou Liao Tianmin Du Liqiang Cao Lixi Wan Institute of Microelectronics of Chinese Academy of Sciences Huawei Technologies US R&D Centre
Increasingly aggressive requirements of active devices have challenged the physical limits of conventional packaging technologies. Bandwidth-intensive consumer and enterprise applications have precipitated an insatiab... 详细信息
来源: 评论
AUREA: an open-source software system for accurate and user-friendly identification of relative expression molecular signatures
收藏 引用
BMC BIOINFORMATICS 2013年 第1期14卷 1-7页
作者: Earls, John C. Eddy, James A. Funk, Cory C. Ko, Younhee Magis, Andrew T. Price, Nathan D. Inst Syst Biol Seattle WA 98109 USA Univ Washington Dept Comp Sci & Engn Seattle WA 98195 USA Univ Illinois Dept Bioengn Urbana IL 61801 USA Univ Illinois Ctr Biophys & Computat Biol Urbana IL 61801 USA Univ Illinois Dept Comp Sci Urbana IL 61801 USA
Background: Public databases such as the NCBI Gene Expression Omnibus contain extensive and exponentially increasing amounts of high-throughput data that can be applied to molecular phenotype characterization. Collect... 详细信息
来源: 评论
Helicon m=0 mode characteristics in large-diameter plasma produced by a planar spiral antenna
收藏 引用
PLASMA PHYSICS AND CONTROLLED FUSION 1997年 第9期39卷 1479-1486页
作者: Shinohara, S Takechi, S Kaneda, N Kawai, Y Interdisciplinary Graduate School of Engineering Sciences Kyushu University Kasuga Fukuoka 816 Japan
Excited wave characteristics in a large-diameter plasma produced by a planar spiral antenna are investigated. Radial and axial profiles of the excited magnetic fields, a dispersion relation and observing regions of th... 详细信息
来源: 评论
Analysis of Complex Packaging Model Based on BGA
Analysis of Complex Packaging Model Based on BGA
收藏 引用
14th International Conference on Electronic Packaging Technology (ICEPT)
作者: Tian Wenchao Guan Rongcheng Zhao Laiqiang Xidian Univ Sch Electromech Engn Xian 710071 Peoples R China
Ball grid array (BGA) has the characters of excellent heat dissipation and high mechanical strength to satisfy with the need of high density packaging of electro produces. However BGA faces some problems of complex vi... 详细信息
来源: 评论