Increasingly aggressive requirements of active devices have challenged the physical limits of conventional packaging technologies. Bandwidth-intensive consumer and enterprise applications have precipitated an insatiab...
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ISBN:
(纸本)9781467346450
Increasingly aggressive requirements of active devices have challenged the physical limits of conventional packaging technologies. Bandwidth-intensive consumer and enterprise applications have precipitated an insatiable demand for ever-increasing density, functionality, and portability requirements of active devices. Such aggressive requirements, which have challenged the viability of conventional packaging technologies, have prompted researchers and engineers to contemplate suitable alternatives to placate such escalating demands. An innovative solution that is stimulating increasing interest is 3D flexible substrate packaging technology in part because of its high degree of scalability in a compact form-factor. However, this particular packaging topology has yet to mature into a mainstream solution in the industrial environment due to its prohibitive implementation costs. This paper proposes a practical, streamlined methodology of designing, fabricating and testing folded 3D flexible package modules that address both manufacturing costs and time-to-market sensitivities. Detailed in this paper is a pedagogical example of the proposed methodology that depicts the design optimization, fabrication, and characterization of daisy-chained chips incorporated into a 3D flexible package topology on flexible substrates. Electrical and pertinent reliability test results demonstrate the viability of the proposed methodology for folded 3D flexible package technology.
Background: Public databases such as the NCBI Gene Expression Omnibus contain extensive and exponentially increasing amounts of high-throughput data that can be applied to molecular phenotype characterization. Collect...
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Background: Public databases such as the NCBI Gene Expression Omnibus contain extensive and exponentially increasing amounts of high-throughput data that can be applied to molecular phenotype characterization. Collectively, these data can be analyzed for such purposes as disease diagnosis or phenotype classification. One family of algorithms that has proven useful for disease classification is based on relative expression analysis and includes the Top-Scoring Pair (TSP), k-Top-Scoring Pairs (k-TSP), Top-Scoring Triplet (TST) and Differential Rank Conservation (DIRAC) algorithms. These relative expression analysis algorithms hold significant advantages for identifying interpretable molecular signatures for disease classification, and have been implemented previously on a variety of computational platforms with varying degrees of usability. To increase the user-base and maximize the utility of these methods, we developed the program AUREA (Adaptive Unified Relative Expression Analyzer)-a cross-platform tool that has a consistent application programming interface (API), an easy-to-use graphical user interface (GUI), fast running times and automated parameter discovery. Results: Herein, we describe AUREA, an efficient, cohesive, and user-friendly open-source software system that comprises a suite of methods for relative expression analysis. AUREA incorporates existing methods, while extending their capabilities and bringing uniformity to their interfaces. We demonstrate that combining these algorithms and adaptively tuning parameters on the training sets makes these algorithms more consistent in their performance and demonstrate the effectiveness of our adaptive parameter tuner by comparing accuracy across diverse datasets. Conclusions: We have integrated several relative expression analysis algorithms and provided a unified interface for their implementation while making data acquisition, parameter fixing, data merging, and results analysis 'point- and -click' simple.
Ball grid array (BGA) has the characters of excellent heat dissipation and high mechanical strength to satisfy with the need of high density packaging of electro produces. However BGA faces some problems of complex vi...
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ISBN:
(纸本)9781479904983
Ball grid array (BGA) has the characters of excellent heat dissipation and high mechanical strength to satisfy with the need of high density packaging of electro produces. However BGA faces some problems of complex viscoplastic deformation, difficult failure test and high repair cost. This paper establishes a complex multichip packaging module with lead-free solder ball SAC305 BGA solder ball based on nonlinear Anand viscoplasticity principle. The simulation results are obtained based on the IPC9701 standard thermal cycling condition. The PCB (printed circle board) warpage law and the positions of the dangerous chip and dangerous solder ball are found. The stain-stress change rule and hysteresis curve are also obtained. The lifetime of complex packaging model is analyzed based on Coffin-Manson equation. Result shows that model reliable working time is 399 hours during the IPC9701 standard thermal cycling environment.
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