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检索条件"主题词=Process parameters optimization"
85 条 记 录,以下是81-90 订阅
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A CAPP framework with optimized process parameters for rotational components
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INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH 2008年 第20期46卷 5561-5587页
作者: Sankar, R. Siva Asokan, P. Prabhaharan, G. Phani, A. V. Natl Inst Technol Dept Prod Engn Tiruchirappalli India
process planning, as a critical stage integrating the design and manufacturing phase in a manufacturing environment, has been automated to meet the needs for higher productivity and lower production cost. Being an inp... 详细信息
来源: 评论
optimization of process parameters and catalyst compositions in carbon dioxide oxidative coupling of methane over CaO-MnO/CeO2 catalyst using response surface methodology
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FUEL processING TECHNOLOGY 2006年 第5期87卷 449-459页
作者: Istadi Amin, NAS Univ Teknol Malaysia UTM Skudai Fac Chem & Nat Resources Engn CREG Johor Baharu 81310 Malaysia
The optimization of process parameters and catalyst compositions for the CO2 oxidative coupling of methane (CO2-OCM) reaction over CaO-MnO/CeO2 catalyst was developed using Response Surface Methodology (RSM). The rela... 详细信息
来源: 评论
Planar gas-assisted injection molding part's CAE simulation study
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Suxing Gongcheng Xuebao/Journal of Plasticity Engineering 2005年 第3期12卷 96-99页
作者: Mao, Hua-Jie Zhang, Bo Wang, Jian-Yang Hua, Lin Material Science and Engineering Institute Wuhan University of Technology Wuhan 430070 China
In this thesis, a series of typical planar gas-assisted injection molding parts are created. With the help of CAE software moldflow, the GAIM process of these parts are simulated and the analysis results are received.... 详细信息
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Study on plasma cleaning and strength of wire bonding
Study on plasma cleaning and strength of wire bonding
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International Conference on the Business of Electronic Product Reliability and Liability
作者: Guan, RF Wang, XF Zhu, FL Gan, ZY Liu, S Huang, DX Huazhong Univ Sci & Technol Inst Microsyst Huazhong Peoples R China
In IC and MEMS ( Micro Electric Mechanical Systems) packaging processing, success applications of plasma cleaning technology depends on cleaning process parameters such as pressure, RF power, cleaning time and cleanin... 详细信息
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New optimization strategy for Chemical Mechanical Polishing process
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JSME INTERNATIONAL JOURNAL SERIES C-MECHANICAL SYSTEMS MACHINE ELEMENTS AND MANUFACTURING 2001年 第2期44卷 534-543页
作者: Wang, GJ Chen, JL Hwang, JY Natl Chunghsing Univ Dept Mech Engn Taichung 402 Taiwan
In this study, a systematic approach to achieve a globally optimal Chemical Mechanical Polishing ( CMP) process is carried out. In this new approach, the orthogonal array technique adopted from the Taguchi method is u... 详细信息
来源: 评论