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Design and analysis of a scheme to mitigate condensation on an assembly used to cool a processor module

IBM JOURNAL OF RESEARCH AND DEVELOPMENT 2002年第6期46卷 753-761页

作者： Ellsworth, MJ Schmidt, RR Agonafer, D IBM Corp Server Grp Poughkeepsie NY 12601 USA Univ Texas Elect MEMS & Telecommun Syst Packaging Ctr Arlington TX 76019 USA

System performance of an IBM RS/6000(R) workstation was improved by cooling to sub-ambient temperatures the CMOS circuits of a single-chip module (SCM) mounted on a card. However, when refrigeration temperatures are sufficiently low, the temperature of all or a portion of the card on which the module is mounted can fall below the environmental dew point, resulting in unwanted condensation. Strategically placed heaters can maintain the temperature of the card surface above the dew point, but at the expense of increasing the total heat load the refrigeration unit must remove from the system. A 3D finite element analysis was used to investigate some of the key parameters that affect the thermal packaging design of a refrigeration-cooled low-temperature processor module with the objective of preventing condensation on exposed module card surfaces with minimal power input to the added heaters.

关键词： .cooling condensation low-temperature heaters refrigeration processor module dew point card surface total heat module card

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Tektronix :: 85Xx :: 8540 :: 070-3665-00 8500 Z80 Emulator processor Jul83

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2016年

Tektronix :: 85Xx :: 8540 :: 070-3665-00 8500 Z80 Emulator processor Jul83 by published by

关键词： control control probe emulation emulation mode emulator emulator processor installation jul83 microprocessor microprocessor board mobile microprocessor mode module oooo oooo probe processor processor module prototype prototype control rev aug strain relief tektronix

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Tektronix :: 85Xx :: 8540 :: 070-3671-00 8500 8048 Emulator processor Nov81

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2016年

Tektronix :: 85Xx :: 8540 :: 070-3671-00 8500 8048 Emulator processor Nov81 by published by

关键词： control control probe emulator emulator processor installation interface interface assembly microcomputer microcomputer development microlab nov81 oooo oooo oooo power supply probe probe interface processor processor installation processor module prototype prototype control tektronix

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Tektronix :: 85Xx :: 8540 :: 070-3771-00 68000 Emulator processor Inst Feb82

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2016年

Tektronix :: 85Xx :: 8540 :: 070-3771-00 68000 Emulator processor Inst Feb82 by published by

关键词： board cable termination control control probe emu emulator emulator processor feb82 installation installation service interface assembly jumpers microprocessor mobile microprocessor power supply probe processor processor module prototype prototype control supply board tektronix

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MOD - A LANGUAGE FOR DISTRIBUTED-PROGRAMMING

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IEEE TRANSACTIONS ON SOFTWARE ENGINEERING 1980年第6期6卷 563-571页

作者： COOK, RP Department of Computer Sciences University of Wisconsin

Distributed programming is characterized by high communications costs and the inability to use shared variables and procedures for interprocessor synchronization and communication. *MOD is a high-level language system which attempts to address these problems by creating an environment conducive to efficient and reliable network software construction. Several of the *MOD distributed programming constructs are discussed as well as an interprocessor communication methodology. Examples illustrating these concepts are drawn from the areas of network communication and distributed process synchronization.

关键词： Programming Languages Computer Networks Distributed Programming Modula processor module

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