咨询与建议

限定检索结果

文献类型

  • 2,192 篇 会议
  • 426 篇 期刊文献

馆藏范围

  • 2,618 篇 电子文献
  • 0 种 纸本馆藏

日期分布

学科分类号

  • 829 篇 工学
    • 491 篇 计算机科学与技术...
    • 468 篇 电气工程
    • 305 篇 软件工程
    • 151 篇 电子科学与技术(可...
    • 77 篇 信息与通信工程
    • 47 篇 控制科学与工程
    • 28 篇 机械工程
    • 28 篇 仪器科学与技术
    • 16 篇 核科学与技术
    • 12 篇 材料科学与工程(可...
    • 5 篇 动力工程及工程热...
    • 5 篇 网络空间安全
    • 4 篇 光学工程
    • 4 篇 建筑学
    • 4 篇 航空宇航科学与技...
    • 3 篇 生物医学工程(可授...
  • 74 篇 理学
    • 43 篇 数学
    • 14 篇 物理学
    • 13 篇 系统科学
    • 3 篇 科学技术史(分学科...
    • 2 篇 化学
    • 2 篇 生物学
    • 2 篇 统计学(可授理学、...
  • 32 篇 管理学
    • 29 篇 管理科学与工程(可...
    • 10 篇 工商管理
  • 5 篇 经济学
    • 5 篇 应用经济学
  • 5 篇 教育学
    • 5 篇 教育学
  • 4 篇 医学
    • 4 篇 临床医学
  • 3 篇 法学
    • 2 篇 法学
  • 3 篇 文学
    • 3 篇 新闻传播学
  • 1 篇 军事学

主题

  • 2,618 篇 reduced instruct...
  • 630 篇 hardware
  • 625 篇 computer archite...
  • 509 篇 microprocessors
  • 424 篇 registers
  • 362 篇 clocks
  • 251 篇 costs
  • 251 篇 pipelines
  • 225 篇 decoding
  • 222 篇 application soft...
  • 199 篇 computer aided i...
  • 198 篇 delay
  • 164 篇 digital signal p...
  • 157 篇 field programmab...
  • 146 篇 parallel process...
  • 146 篇 random access me...
  • 141 篇 cmos technology
  • 138 篇 process design
  • 138 篇 energy consumpti...
  • 136 篇 very large scale...

机构

  • 15 篇 ibm thomas j. wa...
  • 13 篇 department of co...
  • 10 篇 central research...
  • 10 篇 motorola inc. au...
  • 9 篇 ieee spectrum ny
  • 8 篇 digital equipmen...
  • 7 篇 hewlett packard ...
  • 7 篇 department of el...
  • 6 篇 motorola inc.
  • 6 篇 sun microsystems...
  • 6 篇 center for integ...
  • 6 篇 university of ca...
  • 6 篇 toshiba corporat...
  • 6 篇 imec leuven
  • 6 篇 institute of dig...
  • 6 篇 system lsi labor...
  • 6 篇 school of electr...
  • 5 篇 hewlett packard ...
  • 5 篇 intel corporatio...
  • 5 篇 school of electr...

作者

  • 22 篇 jari nurmi
  • 19 篇 hoi-jun yoo
  • 14 篇 p. pirsch
  • 13 篇 fabio garzia
  • 10 篇 t. shimizu
  • 10 篇 t. yoshida
  • 10 篇 liang-gee chen
  • 10 篇 i. kuroda
  • 8 篇 tapani ahonen
  • 8 篇 roberto airoldi
  • 7 篇 waqar hussain
  • 7 篇 k. suzuki
  • 7 篇 hyejung kim
  • 7 篇 j. nurmi
  • 7 篇 m. berekovic
  • 7 篇 l. carro
  • 6 篇 nurmi jari
  • 6 篇 h. nakamura
  • 6 篇 t. sato
  • 6 篇 m. takahashi

语言

  • 2,571 篇 英文
  • 38 篇 其他
  • 7 篇 中文
  • 1 篇 朝鲜文
  • 1 篇 俄文
检索条件"主题词=Reduced Instruction Set Computing"
2618 条 记 录,以下是81-90 订阅
排序:
20-Bit RISC and DSP System Design in an FPGA
收藏 引用
computing IN SCIENCE & ENGINEERING 2014年 第2期16卷 16-20页
作者: Tomar, Amit Kumar Singh Jain, Rita Lakshmi Narain College of Technology India Lakshmi Narain College of Technology India
Today, most microprocessor and microcontroller designs are based on a reduced instruction set Computer core with several operations performed by a digital signal processor system. Here, the design of a RISC and DSP sy... 详细信息
来源: 评论
Microprocessor at 50: A Time to Celebrate and Energize for the Future INTRODUCTION
收藏 引用
IEEE MICRO 2021年 第6期41卷 10-12页
作者: John, Lizy Kurian Narayanan, Vijaykrishnan Univ Texas Austin Elect & Comp Engn Dept Austin TX 78712 USA Penn State Univ Comp Sci & Engn & Elect Engn State Coll PA 16802 USA
The articles in this special section focus on the history and future technological development of microprocessors. Microprocessors have become more pervasive than any other landmark invention of the entire human civil... 详细信息
来源: 评论
EMULATING A COMPLEX instruction set COMPUTER WITH A reduced instruction set COMPUTER
收藏 引用
IEEE MICRO 1987年 第1期7卷 60-72页
作者: MCNELEY, KJ MILUTINOVIC, VM PURDUE UNIV SCH ELECT ENGNW LAFAYETTEIN 47907
GaAs now allows up to 30K transistors per chip. With such a limitation, can you build a 32-bit CISC on a single GaAs chip? Yes, if you build a reduced instruction set computer and emulate the 32-bit CISC on it.
来源: 评论
2001 NEEDS FOR MULTILEVEL INTERCONNECT TECHNOLOGY
收藏 引用
IEEE CIRCUITS AND DEVICES MAGAZINE 1995年 第1期11卷 16-20页
作者: OH, SY CHANG, KJ Hewlett Packard Palo Alto CA Hewlett-Packard Co. Palo Alto CA USA
Looks at the materials and thermal alternatives for scaled, next-century VLSI/ULSI interconnects. It is shown that ad hoc executions of programs to calculate interconnect parameters for VLSI/ULSI design and analysis a... 详细信息
来源: 评论
THERMAL MODELING AND EXPERIMENTAL CHARACTERIZATION OF THE C4 SURFACE-MOUNT-ARRAY INTERCONNECT TECHNOLOGIES
收藏 引用
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A 1995年 第1期18卷 87-93页
作者: KROMANN, GB MOTOROLA INC MICROPROCESSOR MEMORY & TECHNOL GRPADV PACKAGING TECHNOLAUSTINTX 78735
This paper presents various thermal management options available for controlled collapse chip connection (C4) die attached to a ceramic surface mount array (SMA) substrate, as they apply to low end/midrange computer p... 详细信息
来源: 评论
A 120-MHZ BICMOS SUPERSCALAR RISC PROCESSOR
收藏 引用
IEEE JOURNAL OF SOLID-STATE CIRCUITS 1994年 第4期29卷 389-396页
作者: TANAKA, S HOTTA, T MURABAYASHI, F YAMADA, H YOSHIDA, S SHIMAMURA, K KATSURA, K BANDOH, T IKEDA, K MATSUBARA, K SAITOU, K NAKANO, T SHIMIZU, T SATOMURA, R HITACHI LTD DIV GEN PURPOSE COMPHITACHIIBARAKI 31912JAPAN HITACHI LTD CTR DEVICE DEVHITACHIIBARAKI 31912JAPAN
A superscalar RISC processor contains 2.8 million transistors in a die size of 16.2 mm x 16.5 mm, and utilizes 3.3 V/0.5 pm BiCMOS technology. In order to take advantage of superscalar performance without incurring pe... 详细信息
来源: 评论
Exact and approximate algorithms for the extension of embedded processor instruction sets
收藏 引用
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS 2006年 第7期25卷 1209-1229页
作者: Pozzi, Laura Atasu, Kubilay Ienne, Paolo Ecole Polytech Fed Lausanne Sch Comp & Commun Sci CH-1015 Lausanne Switzerland
In embedded computing, cost, power, and performance constraints call for the design of specialized processors, rather than for the use of the existing off-the-shelf solutions. While the design of these application-spe... 详细信息
来源: 评论
WAFER SCALE INTERCONNECTIONS FOR GAAS PACKAGING - APPLICATIONS TO RISC ARCHITECTURE
收藏 引用
COMPUTER 1987年 第4期20卷 21-35页
作者: MCDONALD, JF GREUB, HJ STEINVORTH, RH DONLAN, BJ BERGENDAHL, AS Rensselaer Polytechnic Institute
A high-speed, high-density, wafer-scale packaging technology for the implementation of GaAs systems is described. The particular requirements of wafer-scale integrated (WSI) packaging and the difficulties involved are... 详细信息
来源: 评论
OPERATION OF COMMERCIAL R3000 PROCESSORS IN THE LOW EARTH ORBIT (LEO) SPACE ENVIRONMENT
收藏 引用
IEEE TRANSACTIONS ON NUCLEAR SCIENCE 1991年 第6期38卷 1415-1420页
作者: KASCHMITTER, JL SHAEFFER, DL COLELLA, NJ MCKNETT, CL COAKLEY, PG JAYCOR INC SANTA MONICACA
Spacecraft processors must operate with minimal degradation of performance in the Low Earth Orbit (LEO) radiation environment, which includes the effects of total accumulated ionizing dose and Single Event Phenomena (... 详细信息
来源: 评论
An interconnect architecture for networking systems on chips
收藏 引用
IEEE MICRO 2002年 第5期22卷 36-45页
作者: Karim, F Nguyen, A Dey, S STMicroelect Adv Syst Technol Adv Comp Lab San Diego CA 92121 USA Univ Calif San Diego Dept Elect & Comp Engn San Diego CA 92103 USA
Network processor systems on chips meet the speed and flexibility requirements of next-generation Internet routers. the octagon on-chip communication architecture, with its cost, performance, and scalability advantage... 详细信息
来源: 评论