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检索条件"主题词=Temperature Sensor Device Component"

共 301 条记录，以下是11-20 订阅

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RF and Battery Performance Study for WSN in Palm Oil Plantation Applications

RF and Battery Performance Study for WSN in Palm Oil Plantat...

引用

IEEE Conference on Wireless sensors (ICWiSe)

作者： Yusoff, Ismail Mat Harun, Ahmad Nizar Ramli, Siti Sarah MIMOS Minist Sci Technol & Innovat Prod & Syst Architecture Kuala Lumpur Malaysia

ISBN: (纸本)9781479955947

This paper presents the architecture of Wireless sensor Network (WSN) for Precision Agriculture application particularly on RF and battery performance of the mote. The WSN consists of energy-efficient and scalable communication protocols and low power hardware platforms. The architecture comprises of four main parts (a) the sensor tip, (b) the mote, (c) the router and (d) the gateway to address the needs of wireless sensor networks. The sensor node (mote and tip) powered by 2xAA-size batteries and can sleep at a very low current. This paper discussed on the RF performance by doing two type of test;transmit power and receiver sensitivity. A power management test was also carried out to identify maximum current during mote transmitting and minimum current during sleep mode. Details of the test and conclusion are described in this paper.

关键词： agriculture battery management systems energy conservation low-power electronics protocols telecommunication network routing vegetable oils wireless sensor networks RF performance WSN architecture battery performance energy-efficient communication protocols gateway low power hardware platforms mote transmitting palm oil plantation applications power management test precision agriculture application receiver sensitivity router scalable communication protocols sensor node sensor tip sleep mode wireless sensor network Batteries Logic gates Receivers Sensitivity temperature sensors Wireless sensor networks Wireless sensor networks sleeping mode receiver sensitivity Batteries Battery management systems doorways low-power electronics temperature sensor device component telecommunication network routing Logic gates WSN gene Receivers Energy conservation Vegetable Oils radiofrequency

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Mobile sensor Data Collector using Android Smartphone

Mobile Sensor Data Collector using Android Smartphone

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55th IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)

作者： Yi, Won-Jae Jia, Weidi Saniie, Jafar IIT Dept Elect & Comp Engn Chicago IL 60616 USA

ISBN: (纸本)9781467325271

In this paper, we present a system using an Android smartphone that collects, displays sensor data on the screen and streams to the central server simultaneously. Bluetooth and wireless Internet connections are used for data transmissions among the devices. Also, using Near Field Communication (NFC) technology, we have constructed a more efficient and convenient mechanism to achieve an automatic Bluetooth connection and application execution. This system is beneficial on body sensor networks (BSN) developed for medical healthcare applications. For demonstration purposes, an accelerometer, a temperature sensor and electrocardiography (ECG) signal data are used to perform the experiments. Raw sensor data are interpreted to either graphical or text notations to be presented on the smartphone and the central server. Furthermore, a Java-based central server application is used to demonstrate communication with the Android system for data storage and analysis.

关键词： sensor Data Smartphone Androids Methyltestosterone data transmission temperature sensor device component Data Storage Servers Bluetooth streams rivers

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sensors fault diagnosis for a BMS 13

Sensors fault diagnosis for a BMS

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13th European Control Conference (ECC)

作者： Lombardi, Warody Zarudniev, Mykhailo Lesecq, Suzanne Bacquet, Sylvain CEA LETI F-38054 Grenoble France

ISBN: (纸本)9783952426913

This paper deals with sensor fault diagnosis for a battery management system (BMS). The diagnosis procedure consists on the detection and isolation of sensor faults. A new battery pack design, composed by the cells and sensors, is introduced. Three sensors are considered: voltage, current and temperature. The algorithms are simple and efficient, even for multiple faults, so as to be low-cost from computation and power point of view. Examples are developed during the paper to show the effectiveness of the technique.

关键词： battery management systems fault diagnosis sensors BMS battery management system battery pack design cells current sensor faults sensors fault diagnosis temperature voltage Batteries Equations Mathematical model temperature measurement temperature sensors Voltage measurement Battery management systems sensors Fault diagnosis voltage measurement temperature sensor device component temperature measurement Batteries Mathematical Model VOLTAGE currents electric current Cells Power Points temperature

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Design of a 2.45GHz Wireless temperature sensor in 130nm CMOS Technology 12

Design of a 2.45GHz Wireless Temperature Sensor in 130nm CMO...

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12th IEEE International New Circuits and Systems Conference (IEEE NEWCAS)

作者： Khorramnejadi, M. Nejdel, A. Liliebladh, M. Sjoland, H. Lund Univ Dept Elect & Informat Technol S-22100 Lund Sweden

ISBN: (纸本)9781479948857

This paper presents a wireless temperature sensor implemented in a 130nm CMOS process. A sensor measures the temperature and presents it as a voltage signal that is mapped to a PWM signal. The PWM signal switches a VCO on and off, generating an OOK modulated RF transmission. The circuit is supplied by 1.2V and has a temperature range of 0 similar to 100 degrees Celsius. The sensor sensitivity is measured as 1.8mV/degrees Celsius. The total power consumption of the chip is 7.75mW and the RF output power is measured as 0dBm. The VCO frequency is 2.5 GHz, with 350MHz (14%) tuning range.

关键词： Pulse width modulation Radio frequency temperature measurement temperature sensors Voltage-controlled oscillators Wireless communication Wireless sensor networks temperature sensor device component Voltage controlled oscillators Pulse width modulation radiofrequency CARRIER SYSTEM temperature measurement Wireless sensor networks CMOS technology pulse width modulation signals Output power RF transmission Power consumption

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Study of a High-Resolution and Low-Power CMOS temperature sensor

Study of a High-Resolution and Low-Power CMOS Temperature Se...

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10th IEEE International New Circuits and Systems Conference (NEWCAS)

作者： Hacine, Souha Mailly, Frederick Latorre, Laurent Nouet, Pascal Univ Montpellier 2 CNRS LIRMM Microelect Dept F-34095 Montpellier 5 France

ISBN: (纸本)9781467308595

This paper introduces a low-power integrated temperature sensor based on the temperature coefficient of resistive materials and an original improvement of the traditional Wheatstone bridge called "Active Bridge". The primary purpose of the Active Bridge is to bias an amplifier using the same current as for the sensing resistors to reduce the global power consumption. Open-loop behavior of the sensing cell is first described and modeled. A specific closed-loop architecture based on a current feedback is also studied both analytically and experimentally, as a possible application of the basic cell.

关键词： temperature sensor device component current feedback temperature factor LOW POWER High definition Amplifiers Power consumption Complementary Metal Oxide Semiconductor Bridge (game) Wheatstone bridges BRIDGES bridges

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Thermosonic Platinum Wire Bonding on Platinum 37

Thermosonic Platinum Wire Bonding on Platinum

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37th International Spring Seminar on Electronics Technology (ISSE) - Advances in Electronic System Integration

作者： Schulz, Katharina Ernst, Daniel Menzel, Siegfried Gemming, Thomas Eckert, Juergen Wolter, Klaus-Juergen Tech Univ Dresden IAVT D-01062 Dresden Germany IFW Dresden Dresden Germany

ISBN: (纸本)9781479944552

The ever-growing need for reliable sensors and microsystems that can withstand strong temperature changes as well as impacts presents new challenges for the packaging industry. Research in this field thus focuses equally on the development of high temperature stable material systems and customized packaging technologies. Wire bonding is one of the preferred techniques, but high hardness of refractory materials negatively affects the plastic deformation process, which is the main condition for achieving sufficient adhesion between the layer and wire. In the present work, the thermosonic bonding (TS bonding) is examined and customized with a platinum wire (25 mu m diameter) on platinum-coated silicon substrates (Pt thickness 300 nm). With the help of design of experiments (DoE) and the subsequent analysis of variance, suitable bonding settings have been evaluated. The outcome of the analysis of variance indicates that the platinum wire bonding is possible even at room temperature, however, the basic underlying quality criteria is not satisfied in this work. It is found that the TS bonding at a bonding temperature of 200 degrees C is suitable for achieving an electrical contact to a thin platinum film.

关键词： Adhesives Bonding forces Platinum temperature sensors Voltage control Wires platinum ELECTRIC WIRE temperature sensor device component Voltage regulation adhesives Rope Analysis of Variance wire bonding Bonding forces Fabricability

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A Novel Voltage Reference With An Improved Folded Cascode Current Mirror OpAmp Dedicated for Energy Harvesting Application

A Novel Voltage Reference With An Improved Folded Cascode Cu...

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International SoC Design Conference (ISOCC)

作者： Li, Xin Kok, Chiang Liang Wu, Chun Dong Sick, Liter Zhu, Di Xiao, Zhe Kai Lim, Wei Meng Goh, Wang Ling Nanyang Technol Univ VIRTUS IC Design Ctr Excellence Sch Elect & Elect Engn 50 Nanyang Ave Singapore 639798 Singapore

ISBN: (纸本)9781479911424

In this paper, a CMOS ultra-low voltage reference circuit with ultra-low power consumption of 220nW is proposed. The circuit, simulated in 65nm standard CMOS process technology, operates with a supply voltage of 1V. It is based on sub-threshold MOSFETs using the technique of compensating a PTAT-based variable with the gate source voltage of a subthreshold MOSFET. The novelty of circuit is the use of an improved folded cascode current mirror op-amp operating directly from a 1V power supply. The resulting voltage is equal to the extrapolated threshold voltage of a MOSFET at absolute zero temperature, which was about 435mV for the MOSFETs used. The proposed circuit achieves an average temperature coefficient of 30ppm/degrees C, 12ppm/V in line regulation for a supply voltage range of 0.6-1.2V, and a power supply rejection ratio (PSRR) of - 38dB at 100Hz. The overall power consumption is only 220nW.

关键词： MOSFET Mirrors Power supplies temperature measurement temperature sensors Threshold voltage Voltage control metal-oxide-semiconductor field effect transistors Electric Power Source threshold voltage temperature sensor device component Voltage regulation temperature measurement Mirrors voltage reference supply voltage Power Supply Rejection Ratio current mirrors Power consumption cascode absolute zero line regulation

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Resistive silicon microstructure for embedding in aluminium during casting

Resistive silicon microstructure for embedding in aluminium ...

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IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM)

作者： Dumstorff, G. Lang, W. Univ Bremen Inst Microsensors Actuators & Syst IMSAS D-28359 Bremen Germany

ISBN: (纸本)9781479957361

A resistive silicon microstructure embedded in aluminium is presented. For the resistive structure a boron-doped poly-silicon on a silicon substrate has been used. The passivation of the structure was done by thick film processing. Half of the sensor was integrated in aluminium in a casting process. Due to the thick film passivation the sensor could successfully be integrated in aluminium. sensors had been characterized by measuring the temperature dependent resistance of the microstructure. Beside embedding the sensor can also be used for other harsh environments.

关键词： Aluminum Casting Resistance Silicon temperature measurement temperature sensors aluminium Casting temperature sensor device component temperature measurement Silicon embedding Harsh environments Passivation sensors Microstructure

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Adaptive Mitigation of Parameter Variations 23

Adaptive Mitigation of Parameter Variations

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23rd IEEE Asian Test Symposium (ATS)

作者： Firouzi, Farshad Ye, Fangming Kiamehr, Saman Chakrabarty, Krishnendu Tahoori, Mehdi B. Karlsruhe Inst Technol Karlsruhe Germany Duke Univ Dept Elect & Comp Engn Durham NC USA

ISBN: (纸本)9781479960309

In the deep nanoscale regime, process and runtime variations have emerged as the major sources of uncertainty and unpredictability in circuit operation. Static mitigation approaches do not consider the dependence of variations on workload and chip usage, while adaptive techniques do not incorporate detailed circuit-level information. We propose a fine-grained adaptive technique in which machine learning is exploited to perform circuit clustering and obtain a representative for each cluster. By monitoring the representative in each cluster at runtime, performance variations in the entire cluster can be tracked such that appropriate fine- grained adaptation can be applied to each cluster. Experimental results for ISCAS'89, IWLS'05, and ITC'99 benchmarks as well as the LEON processor show that the proposed approach introduces negligible overhead significantly extends circuit lifetime, facilitates higher operating frequencies, and reduces the leakage power.

关键词： Benchmark testing Delays Monitoring Runtime Table lookup temperature sensors Vectors Table lookup Benchmark testing Runtime temperature sensor device component leakage power parameter variation delay Self tuning

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From Modeling to Fabrication of Double Side Microstructured Silicon Windows for Infrared Gas Sensing in Harsh Environments 8

From Modeling to Fabrication of Double Side Microstructured ...

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8th International Congress on Advanced Electromagnetic Materials in Microwaves and Optics (Metamaterials)

作者： Bergmann, R. Ivinskaya, A. Kafka, J. Okkels, F. Jakobsen, M. H. Tech Univ Denmark Dept Micro & Nanotechnol DK-2800 Lyngby Denmark

ISBN: (纸本)9781479934522

Commercial infrared windows used for gas sensing in the mid-IR range usually possess an anti-reflective coating. Those coatings can normally not withstand harsh environments, particularly not high temperatures. With a simple "3-step" fabrication process, high temperature resistant silicon windows (phi 1 '') were manufactured. The windows show high temperature resistant sub-wavelength anti-reflective surface microstructures on both side faces. Thus, a peak transmittance of 100% for a defined main wavelength (5 mu m) and more than 90 % average transmittance for the wavelength range of 5-7 mu m was achieved. The modeling of the anti-reflective microstructures, their fabrication process and final transmittance analysis of the windows is discussed.

关键词： Coatings Fabrication Resistance Silicon temperature measurement temperature sensors Harsh environments temperature sensor device component temperature measurement Silicon Coatings fabrication FENSTER windows windows Fabrication process infrared windows Coating Modeling transmittance

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