Most of previous blind parameter estimation methods of frequency hopping (FH) signals with a single channel do not adapt to overlapped signals, whereas the multi-channel-based ones are computationally much too expensi...
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Most of previous blind parameter estimation methods of frequency hopping (FH) signals with a single channel do not adapt to overlapped signals, whereas the multi-channel-based ones are computationally much too expensive. Moreover, all the single-and multiple-channel-based methods use batch processing techniques, and they are not able to give real-time estimates of the hopping frequencies. This study establishes a temporal autoregressive moving average (ARMA) model of the temporally overlapped FH signals, which is then used to detect the frequency hops once they happen, and track the hopping frequencies online. Numerical examples are carried out to demonstrate the effectiveness of the proposed method.
Oracle's scalable hybrid integration technology platform enables continuing improvements in performance and energy efficiency of photonic bridge chips by leveraging advanced CMOS technologies with maximum flexibil...
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ISBN:
(纸本)9781612844985
Oracle's scalable hybrid integration technology platform enables continuing improvements in performance and energy efficiency of photonic bridge chips by leveraging advanced CMOS technologies with maximum flexibility, which is critical for developing ultralow power high-performance photonic interconnects for future computing systems. Herein, we report on our second generation of photonic bridge chips comprising electronic drivers and receivers built in 40 nm bulk CMOS technology attached to nanophotonic devices, fabricated using SOI-photonic and 130 nm SOI-CMOS photonic technologies. Hybrid integration by flip-chip bonding is enabled by microsolder bump interconnects scaled down from our previous generation effort and fabricated on singulated dies by a novel batch processing technique based on component embedding. Generation-on-generation, the hybrid integrated Tx and Rx bridge chips achieved 2.3x and 1.7x improvement in energy efficiency, respectively, while operating at 2x the datarate (10 Gbps).
This paper investigates the effects of different densities and cellular morphologies on the shape memory effect (SME) of a porous shape memory polymer (SMP). The batch foaming processingtechnique was employed to obta...
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ISBN:
(纸本)9780819466464
This paper investigates the effects of different densities and cellular morphologies on the shape memory effect (SME) of a porous shape memory polymer (SMP). The batch foaming processingtechnique was employed to obtain the desired foamed cellular structures. A study was conducted where the variable of saturation pressure was varied in order to obtain a reduction in relative density while the variables of saturation time, foaming temperature and foaming time were kept constant. The advantage of foaming the SMP is to reduce the weight of the material while still retaining its mechanical and thermomechanical characteristics. One particular point of interest is to understand how a change in density affects the SME. It is also of importance to determine how the SME is influenced by different amounts of strain and by the cellular morphology of the SMP. The objective is to modify the SMP to have the greatest SME while maintaining weight savings. Focusing on the SME, the area of greatest significance is the time response of the SMP. This approach is vital as it dictates the possibility of using a SMP as an effective actuator.
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