A three-phase charge-coupled device (CCD) technology with three levels of polysilicon and trichloroethylene (TCE) oxide-silicon nitride gate, having a good processing yield and taking full advantage of the self-aligni...
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A three-phase charge-coupled device (CCD) technology with three levels of polysilicon and trichloroethylene (TCE) oxide-silicon nitride gate, having a good processing yield and taking full advantage of the self-aligning property of silicon gate transistors, is presented. The use of a TCE gate oxide results in a storage time between 3-4 min, measured on the CCD itself. The presence of the silicon nitride requires a suitable combination of low- and high-temperature anneals in order to decrease the density of fast surface states. A reliability problem observed at high clock voltages is attributed to trapping of injected hot carriers in the gate insulator.
Heretofore, the schemes for fabricating a complementary transistor structure in a monolithic functional block entailed either some additional, difficult-to-control processing steps or a sacrifice in isolation of the c...
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Heretofore, the schemes for fabricating a complementary transistor structure in a monolithic functional block entailed either some additional, difficult-to-control processing steps or a sacrifice in isolation of the collector regions of one type of transistor. This paper describes an isolated p-n-p transistor structure fabricated by the same technique used for the conventional all n-p-n transistor functional block without any additional processing steps. The basic p-n-p transistor has a lateral structure. During the p-type base diffusion of the n-p-n transistor, two concentric p-type regions at close distance are selectively diffused into an isolated n- type region such as that used for the collector of an n-p-n transistor. The center p-type diffused region forms the emitter and the outer ring forms the collector. The n-type spacing between these two regions serves as the base. The current gain of this transistor is not high, typically around unity. However, by amplifying the collector current of the p-n-p transistor with an n-p-n transistor, the composite transistor acts like a high gain p-n-p transistor and the composite current gain can be made comparable to that of the n-p-n transistor in the same functional block. The lateral complementary transistor has been used extensively and successfully for the fabrication of linear functional blocks such as those used in the Advanced Minuteman Program.
The spin-orbit excited (2) Pi(3/2) manifold of (BAr)-B-11(X (2) Pi) was observed in a free jet supersonic expansion by laser fluorescence excitation in the B (2) Sigma(+)-X (2) Pi (7, 0) band. In previous work we obse...
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The spin-orbit excited (2) Pi(3/2) manifold of (BAr)-B-11(X (2) Pi) was observed in a free jet supersonic expansion by laser fluorescence excitation in the B (2) Sigma(+)-X (2) Pi (7, 0) band. In previous work we observed transitions from the lower (2) Pi(1/2) manifold. The spin-orbit constant A was determined to equal 10.88 +/- 0.08(1 sigma) cm(-1), close to a simple estimate, 2/3 Delta E=10.17 cm(-1), where Delta E is the boron 2p P-2(3/2)-P-2(1/2) spin-orbit splitting. The near equality of experimental and theoretical values of A suggests that the boron 2p orbital is not strongly affected by the weak, nonbonding B-Ar interaction.
Necessary and sufficient conditions are derived for "( A, B )- invariance," called here controlled invariance, for nonlinear systems \dot{x} = f(x, u) . The obtained results generalize and elucidate already ...
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Necessary and sufficient conditions are derived for "( A, B )- invariance," called here controlled invariance, for nonlinear systems \dot{x} = f(x, u) . The obtained results generalize and elucidate already known results about systems \dot{x} = A(x) - \sum \min{i=1}\max{m} =u_{i}B_{i}(x) . A new and direct differential geometric interpretation of the concept of controlled invariance and the derived conditions is given.
The calculation method is especially suited for diffused resistors in integration processes and metal-film resistors in thin-film processes which can be adjusted by laser trimming. The method is based on a special app...
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The calculation method is especially suited for diffused resistors in integration processes and metal-film resistors in thin-film processes which can be adjusted by laser trimming. The method is based on a special application of Green's boundary formula. By modeling the resistor in a special way, the potential problem is reduced to a single-boundary problem. As a consequence, the calculation time and the necessary computer memory are reduced while the accuracy reduction remains small in practical cases. Therefore, the calculation can be carried out on a small computer, making interactive computer design of laser-trimmable resistors on IC layouts more feasible and less expensive. The computing time typically amounts to a few seconds. The method is illustrated by practical examples.
We consider a coupled van der Pol equation system. Our coupled system consists of two van der Pol equations that are connected with each other by linear terms. We assume that two distinctive solutions (out-of-phase an...
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We consider a coupled van der Pol equation system. Our coupled system consists of two van der Pol equations that are connected with each other by linear terms. We assume that two distinctive solutions (out-of-phase and in-phase solutions) exist in the dynamical system of coupled equations and give answers to some problems.
Differential expression analysis of RNA sequencing (RNA-seq) data typically relies on reconstructing transcripts or counting reads that overlap known gene structures. We previously introduced an intermediate statistic...
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Differential expression analysis of RNA sequencing (RNA-seq) data typically relies on reconstructing transcripts or counting reads that overlap known gene structures. We previously introduced an intermediate statistical approach called differentially expressed region (DER) finder that seeks to identify contiguous regions of the genome showing differential expression signal at single base resolution without relying on existing annotation or potentially inaccurate transcript assembly. We present the derfinder software that improves our annotation-agnostic approach to RNA-seq analysis by: (i) implementing a computationally efficient bump-hunting approach to identify DERs that permits genome-scale analyses in a large number of samples, (ii) introducing a flexible statistical modeling framework, including multi-group and timecourse analyses and (iii) introducing a new set of data visualizations for expressed region analysis. We apply this approach to public RNA-seq data from the Genotype-Tissue Expression (GTEx) project and BrainSpan project to show that derfinder permits the analysis of hundreds of samples at base resolution in R, identifies expression outside of known gene boundaries and can be used to visualize expressed regions at base-resolution. In simulations, our base resolution approaches enable discovery in the presence of incomplete annotation and is nearly as powerful as feature-level methods when the annotation is complete. derfinder analysis using expressed region-level and single base-level approaches provides a compromise between full transcript reconstruction and feature-level analysis.
The sidewalls of trenches on 100-mm wafers were doped by implantation with an implanter whose beam scan is accurately parallel over the whole wafer surface. The doping was characterized with a staining technique and t...
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The sidewalls of trenches on 100-mm wafers were doped by implantation with an implanter whose beam scan is accurately parallel over the whole wafer surface. The doping was characterized with a staining technique and transmission electron microscopy. All the trenches exhibited symmetrical doping, with the main differences between trenches from the center and edge of a wafer being due to nonuniformity of the trench etching rather than the implant step. Although the measurements were made on 100-mm wafers, symmetrical doping should be achievable for all trenches on wafers up to 200 nm in diameter.< >
Distribution planners are facing a new reality: the vast majority of new generation currently being connected to the grid is through the distribution system. This ?edge? of the grid, where utilities have the least amo...
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Distribution planners are facing a new reality: the vast majority of new generation currently being connected to the grid is through the distribution system. This ?edge? of the grid, where utilities have the least amount of visibility and controllability, is also where most of the change is occurring. The result is a new set of challenges associated with further integrating these ever increasing levels of distributed energy resources (DERs). To meet these challenges, an integrated approach for planning is needed.
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