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检索条件"主题词=direct acceleration input method"
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On the JEDEC Board Level Drop Test Simulation of Array of BGA Packages  39
On the JEDEC Board Level Drop Test Simulation of Array of BG...
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IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)
作者: Ma, Yiyi Luan, Jing-En STMicroelectronics Back End Mfg & Technol 629 Lorong 4-6 Toa Payoh Singapore 319521 Singapore
Drop test durability has been a major concern for devices widely used in mobile applications. JEDEC standard is introduced to characterize IC package drop performance such that a consumer product manufacturer could ha... 详细信息
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