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Transient stability comparision of 3F and 6F systems for single & three pole switching

Transient stability comparision of 3F and 6F systems for sin...

引用

IEEE Region 10 International Conference TENCON

作者： K. Raghuram M. Padmalalitha S. Sreedhar O. Hemakesavulu Dept of EEE SR Engineering College Warangal India Dept of EEE Annamacharya Institute of Technology and Sciences Rajampet India Dept of EEE AITS Rajampet India

This paper mainly deals with the transient stability analysis of a 3Phi double circuit line in comparison with that of equivalent 6Phi transmission line. The method of conversion of 3Phi double circuit line into 6Phi line using 3Phi/6Phi transformers and the method of obtaining corresponding equivalent p.u. reactance values are explained. A computer program in MATLAB is developed using Gauss-seidelpsilas iterative method for power flow and Modified Eulerpsilas method for transient stability analysis. These methods are used to analyze the unsymmetrical faults viz. SLG fault with single pole and three pole switching. Swing curves for different clearing times are obtained and finally the critical clearing time, critical clearing angle and maximum permissible angular swing are found for different cases. From the results it is concluded that the 6Phi transmission line exhibits enhanced transient stability when compared with equivalent 3Phi double circuit line.

关键词： Power system transients Circuit stability Transient analysis Stability analysis Power transmission lines distributed parameter circuits Circuit faults Transformers MATLAB Gaussian processes

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RF/microwave device fabrication in silicon-on-glass technology

RF/microwave device fabrication in silicon-on-glass technolo...

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International Conference on Microelectronics, MIEL

作者： L.K. Nanver H. Schellevis T.L.M. Scholtes L. La Spina G. Lorito F. Sarubbi V. Gonda M. Popadic K. Buisman L.C.N. de Vreede C. Huang S. Milosavljevic E.J.G. Goudena Department of Microelectronics Faculty of EEMCS DIMES Delft University of Technnology Delft Netherlands

This paper reviews recent developments in circuit and device implementations based on back-wafer contacted silicon-on-glass (SOG) substrate-transfer technology (STT). This technology has been specifically developed for the enhancement of silicon RF and microwave device and circuit performance. While metal transmission lines can be placed on the low-loss glass substrate, the resistive and capacitive parasitics of the silicon devices can also be minimized by a direct contacting of the parts of the devices that are usually connected via the bulk Si. Focus is placed here on the device level aspects of the SOG process, in particular high-quality varactors for high-linearity adaptive circuits and complementary bipolar device integration are treated in relationship to new developments in back-wafer contacting and the integration of AlN heatspreaders.

关键词： Radio frequency Microwave devices Fabrication Microwave technology Electromagnetic heating Circuit optimization distributed parameter circuits Glass Silicon devices Varactors

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Frequency performance of plasmawave devices for THZ applications and the role of fringing effects

Frequency performance of plasmawave devices for THZ applicat...

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IEEE Convention of the Electrical and ELectronic Engineers in Israel

作者： Irina Khmyrova Takuya Nishimura Nobuhiro Magome Tetsuya Suemitsu Taiichi Otsuji Computational Nanoelectronics Laboratory University of Aizu Aizu-Wakamatsu Japan Research Institute of Electrical Communication University of Tohoku Sendai Japan

Paper is focused on the model in which reduction of resonant frequency of plasma oscillations in the HEMT channel experimentally observed is associated with the gate contact fringing effects. Sheet electron density distribution in the fringed ungated channel region and expression for the resonant plasma frequency are obtained. Cascaded transmission line equivalent circuit model accounting for both gated and fringed ungated channel regions has been developed and used for simulation of HEMT frequency performance with IsSpice software.

关键词： Plasma applications Plasma devices Plasma density Resonant frequency HEMTs Electrons Resonance Plasma simulation distributed parameter circuits Equivalent circuits

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Adequate choice of trial functions used in integral method for modeling asymmetric coupled mirostrip structures

Adequate choice of trial functions used in integral method f...

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Canadian Conference on Electrical and Computer Engineering (CCECE)

作者： A. Khodja R. Touhami M.C.E. Yagoub H. Baudrand Instrumentation Laboratory Faculty of Electronics and Informatics U.S.T.H.B University Algiers Algeria SITE University of Ottawa Ottawa ONT Canada ENSEEIHT Toulouse France

The purpose of this paper is the establishment of the adequate choice of trial functions used in the transverse resonance method for modeling asymmetric coupled microstrip structures for C- and pi-mode in full-wave domain. So, two kinds of the set of cosine trial functions are used (one takes into account the edge metallic effects and other does not take any) in order to study convergence behavior of dispersion parameters with respect to the required precision. The electromagnetism operator formalism is applied to efficiently study the dispersion effect of coupled microstrip structures. Comparisons with published data are presented in order to confirm the best choice of the set of trial functions used in this method.

关键词： Microstrip Coupling circuits Transmission line matrix methods Resonance Impedance distributed parameter circuits Dielectric substrates Metallization Dispersion Power transmission lines

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Measured impedance by distance relay for inter phase faults in presence of SSSC on a double circuit transmission line

Measured impedance by distance relay for inter phase faults ...

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IEEE Region 10 International Conference TENCON

作者： A. Kazemi S. Jamali H. Shateri Center of Excellence for Power Systems Automation and Operation Iran University of Science and Technology Tehran Iran

This paper studies the effects of static synchronous series compensator (SSSC), one of the series connected flexible alternating current transmission system (FACTS) devices, on the measured impedance at the relaying point for faults on a double circuit transmission line in the case of the inter phase, phase to phase and three phase, faults. The measured impedance at the relaying point is affected by several factors, including the line pre-fault loading, structural conditions, and specially the fault resistance. In the presence of SSSC, in addition to its structural and controlling parameters, its installation point affects the measured impedance at the relaying point. The variation of the measured impedance for different SSSC installation points and controlling parameters would also be investigated.

关键词： Impedance measurement Transmission line measurements Phase measurement Protective relaying Circuit faults distributed parameter circuits Relays Electrical resistance measurement Flexible AC transmission systems Current measurement

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Comprehensive analysis of Linear Wire Antennas with Maxwellian circuits

Comprehensive analysis of Linear Wire Antennas with Maxwelli...

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China-Japan Joint Microwave Conference

作者： Mingliang Wu Wenhui Shen Guohua Zhao K. K. Mei Department of Communication & Information Engineering Shanghai University Shanghai China

ISBN: (纸本)9781424438211

Maxwellian circuits (MC) has been proposed for several years. It's an important theory that completes the traditional transmission line equation (TLE) and provides a new method to analyze electromagnetic field. This paper will do a comprehensive analysis about the application of MC in linear wire antennas. It compares the currents, radiation patterns, input impedances and gains solved by MC and method of moments (MoM) respectively. The results of two methods agree with each other well. It shows that the analysis is true.

关键词： Wire Integral equations Maxwell equations Boundary conditions Transmission line theory distributed parameter circuits Antenna radiation patterns Impedance Virtual manufacturing Information analysis

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Miniaturization Techniques of Substrate Integrated Waveguide circuits

Miniaturization Techniques of Substrate Integrated Waveguide...

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IEEE MTT-S International Microwave Workshop Series (IMWS)

作者： Yan Ding Ke Wu Poly-GRAMES Research Center Department of Electrical Engineering Ecole Polytechnique (University of Montreal) Centre for Radiofrequency Electronics Research (CREER) of Quebec Montreal QUE Canada

Substrate integrated waveguide (SIW) has become popular and it has widely been used in microwave and millimeter wave circuit and system designs. Compared to other planar transmission lines, the geometrical dimension, in particular, the width of an SIW is much larger, which depends on the operating frequency and substrate material. Therefore, an effective SIW miniaturization is required for developing a high-density integration in circuit design. In this paper, three miniaturization techniques of SIW circuits are discussed in order to achieve a high compression ratio. A group of SIW transmission lines based on these miniaturization techniques are analyzed and their propagation constants and quality factors are extracted for comparison.

关键词： Substrates Planar transmission lines Radio frequency Millimeter wave communication Microwave theory and techniques Millimeter wave technology Millimeter wave radar distributed parameter circuits Q factor Rectangular waveguides

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A delay model for interconnect trees based on ABCD matrix

A delay model for interconnect trees based on ABCD matrix

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Asia and South Pacific Design Automation Conference

作者： Guofei Zhou Li Su Depeng Jin Lieguang Zeng Department of Electronic Engineering Tsinghua University Beijing China

ISBN: (纸本)9781424419210;1424419212

The accuracy of interconnect delay estimations can be improved by the method presented in this paper, in which the first two moments are obtained with ABCD matrix and a stable model to incorporate effects of transport delay into the delay estimate is developed. Simulation results show that the method share the same accuracy with traditional methods when rise time delay is much longer than transport delay and more accurate when the two are of the same order.

关键词： Integrated circuit interconnections Delay effects Delay estimation Transmission line matrix methods RLC circuits Transfer functions Inductance Frequency estimation distributed parameter circuits Admittance

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Unequal Wilkinson power dividers with in-/reverse-phase using lumped-element circuits

Unequal Wilkinson power dividers with in-/reverse-phase usin...

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Asia-Pacific Conference on Microwave

作者： Hiroyuki Mizuno Tadashi Kawai Isao Ohta Graduate School of Engineering University of Hyogo Japan

In this paper, we propose in/reverse-phase Wilkinson power dividers with unequal power-split ratio using lumped-element circuits. Although unequal Wilkinson power dividers using the defected ground structure (DGS) have been reported, impedance mismatch between DGS lines and conventional microstrip lines, and radiation may become problems. The proposed divider consists of parallel pi /T-networks and LC-ladder circuits. The designed reversed- phase divider with a power-split ratio of 4 has a practical property of a relative bandwidth of about 14 %. The validity of this design procedure is also shown by EM-simulations and experiments.

关键词： Power dividers Impedance Transformers Microwave circuits Microstrip Bandwidth Equations Scattering parameters Power transmission lines distributed parameter circuits

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Lumped-Element Loaded EBG Structure with an Enhanced Bandgap and Homogeneity

Lumped-Element Loaded EBG Structure with an Enhanced Bandgap...

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International Workshop on Antenna Technology: Small Antennas and Novel Metamaterials, iWAT

作者： Takashi Yanagi Takeshi Oshima Hideyuki Oh-hashi Yoshihiko Konishi Satoshi Murakami Kenji Itoh Atsushi Sanada Mitsubishi Electric Corporation Limited Kamakura Kanagawa Japan Graduate School of Science and Engineering Yamaguchi University Ube Yamaguchi Japan

In this paper, a wideband EBG structure with an enhanced bandgap and homogeneity by loading lumped-elements is presented. Lumped-element capacitors are loaded between the adjacent patch conductors, and also lumped-element inductors are loaded in series with vertical vias in the proposed EBG, leading to a drastic reduction of the unit cell size, and consequently, an enhanced homogeneity. In addition, it relaxes a limitation of the frequency versus physical dimensions. A systematic design procedure for broadband EBG structures is provided based on the equivalent circuit model of 2-D CRLH transmission line. In Addition, the validity of the design is confirmed experimentally.

关键词： Periodic structures Metamaterials Photonic band gap Wideband Capacitors Conductors Inductors Frequency Equivalent circuits distributed parameter circuits

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