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检索条件"主题词=graph bi-partitioning algorithm"
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TSV Placement and Core Mapping for 3D Mesh Based Network-on-Chip Design Using Extended Kernighan-Lin partitioning
TSV Placement and Core Mapping for 3D Mesh Based Network-on-...
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IEEE-Computer-Society Annual Symposium on VLSI (ISVLSI)
作者: Manna, Kanchan Teja, Vadapalli Shanmukha Sri Chattopadhyay, Santanu Sengupta, Indranil Indian Inst Technol Sch Informat Technol Kharagpur 721302 W Bengal India Indian Inst Technol Dept Elect & Elect Commun Engn Kharagpur 721302 W Bengal India Indian Inst Technol Dept Comp Sci Kharagpur 721302 W Bengal India
Three-dimensional (3D) Network-on-Chip (NoC) based designs can utilize communication in vertical dimension to reduce distance between cores. Vertical connections are best implemented using Through-Silicon-Via (TSV). H... 详细信息
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