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Miniaturization and module integration of an infrared spectrometer

OPTICAL ENGINEERING 2001年第10期40卷 2308-2314页

作者： Keränen, K Karioja, P Blomberg, M Tenhunen, J Rusanen, O Kopola, H VTT Elect & Infotech Oulu FIN-90570 Oulu Finland

When designing a miniaturized optoelectronic module, modeling of the system allows us to optimize structures, materials, and components to achieve optimal performance and cost effectiveness of the final product. We have used an approach in which an analytical model and simulation model support each other to speed up and enhance the system's development process. Our system integration approach includes analytical modeling and raytrace simulation modeling of the system, system realization, and system characterization. Our pilot miniaturized system is comprised of three silicon micromachined devices: an electrically modulated thermal infrared emitter, an electrically tunable Fabry-Perot interferometer (FPI), and a photodetector. The analytical modeling of the system was verified by optical raytracing simulation software. The simulation results were verified by experiments thus enhancing the development of the simulation model. (C) 2001 Society of Photo-Optical Instrumentation Engineers.

关键词： module integration miniaturization infrared-spectrometer modeling integrated optics

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module integration: A Methodology of Multiple Bearing Couplings

Module Integration: A Methodology of Multiple Bearing Coupli...

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The Sixth World Congress on Computational Mechanics in Conjunction with the Second Asian-Pacific Congress on Computational MechanicsⅠ

作者： Q. Jane Wang Chih Lin Department of Mechanical Engineering Northwestern University 2145 Sheridan Rd Evanston IL 60208 USA Baker Hughes Inc. Houston TX 77252 USA

Virtual tribology [1] emerges as a methodology for creating and analyzing elements and systems based on surface phenomena by means of integrating advanced model-based simulations with modern information technologies. Simulations based on physical models provide mechanical designers a powerful tool to improve existing designs and develop new products. It could potentially shorten the design cycle and cut significant development cost. The bearing system in a rock-drill bit, for example, involves multiple couplings, where both convex and concave coupling exist. It is extremely difficult to run individual bearing component tests and infer from them the interactive effects in the bearing system. In industry applications then it is usually resolved to full scale testing which is both time-consuming and *** concept of virtual tribology is materialized in the paper towards developing a methodology for the multiple coupling bearing design [2].

关键词： A Methodology of Multiple Bearing Couplings module integration

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Two-level Metallization and module integration of Point-contacted Solar Cells

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Energy Procedia 2014年 55卷 361-368页

作者： Henning Schulte-Huxel Udo Römer Susanne Blankemeyer Agnes Merkle Yevgeniya Larionova Verena Steckenreiter Robby Peibst Sarah Kajari-Schroeder Rolf Brendel Institute for Solar Energy Research Hamelin (ISFH) Am Ohrberg 1 D-31860 Emmerthal Germany Institut für Festkörperphysik Leibniz Universität Hannover Appelstraße 2 D-30167 Hannover Germany

We present a module integration process for back junction back contact (BJBC) solar cells featuring point contacts to the back surface field (BSF). We apply two metallization layers. A first metal layer of aluminum is deposited onto the rear side of the cell and carries the current extracted from the polarity with the larger surface area fraction, e.g. from the emitter. The second metallization layer is an Al layer on a transparent substrate that we laser-weld to the small and point-shaped regions of the other polarity, e.g. the BSF region. We use a polymer for insulation between the two metal layers. The Al layer on the substrate also serves for cell interconnection, i.e., it enables module integration. Such an interconnection structure halves the fill factor losses due to the metallization. First proof-of-principle modules show a shunt free interconnection, no laser-induced damage, and an energy conversion efficiency of up to 20.7%.

关键词： laser micro welding module integration cell interconnection Al metallization back junction back contact point contact solar cells

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Injection moulding integration of a red VCSEL illuminator module for a hologram reader sensor

Injection moulding integration of a red VCSEL illuminator mo...

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Conference on Optical Sensing Technology and Applications

作者： Keranen, Kimmo Saastamoinen, Toni Makinen, Jukka-Tapani Silvennoinen, Mikko Mustonen, Ilpo Vahimaa, Pasi Jaaskelainen, Timo Lehto, Ari Ojapalo, Anneli Schorpp, Marcus Hoskio, Pekka Karioja, Pentti VTT Kaitovayla 1 Oulu 90570 Finland

ISBN: (纸本)9780819467133

A red VCSEL illuminator module demonstrator was manufactured by injection moulding integration. A red VCSEL chip was first attached to a simple FR4 substrate, which contains bonding pads and conducting wires for the VCSEL chip attachment and electrical driving. The substrate was then placed as an insert in an injection mould. The VCSEL chip shielding and optics formation was made in a one-step injection moulding process. The used optical thermoplastic in the processing was polycarbonate (PC). The pursued optical function of the single spherical surface attained in the moulding was to collimate the emitted red light lambda=664.5 nm) from the VCSEL chip. The main critical issue related to the manufacturing of the illuminator module in the injection moulding process was the durability of bonding wire contacts. A single 25 mu m diameter gold wire was used in wire bonding in order to create the upper contact to the chip. The lower contact was processed by attaching the chip to the substrate using conductive epoxy. A test series of 20 modules using FR4 substrate materials were produced. The number of fully operative modules was 12 resulting total module yield of 60%. The main reason for a non-operative module was loosening of the bonding wire during the injection moulding process. The bonding wire durability in the moulding process can be improved by using glob-top shielding of the VCSEL device before injection moulding and using a lower holding pressure in the injection moulding process. A diamond turned insert was used in the mould in order to create a high quality lens surface on the top of the VCSEL chip. The tower average length after one iteration round by mould modification was 8.676 mu m, so the measured value was on average 20 mu m larger than nominal value. The measured RMS roughness of the processed lens surface was 5... 7 nm and the radius -3.23... 3.83 mm. The radius of the lens and the length of the tower varied depending of the used process parameters. The

关键词： in-mould sealing red VCSEL chip module integration cost-effective product

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17.9% Metal-wrap-through mc-Si cells resulting in module efficiency of 17.0%

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PROGRESS IN PHOTOVOLTAICS 2012年第1期20卷 62-73页

作者： Lamers, M. W. P. E. Tjengdrawira, C. Koppes, M. Bennett, I. J. Bende, E. E. Visser, T. P. Kossen, E. Brockholz, B. Mewe, A. A. Romijn, I. G. Sauar, E. Carnel, L. Julsrud, S. Naas, T. de Jong, P. C. Weeber, A. W. ECN Solar Energy NL-1755 ZG Petten Netherlands REC Grp N-1302 Sandvika Norway REC Wafer N-3908 Porsgrunn Norway

We obtained 17.9% cell efficiency on thin and large mc-Si REC wafers using ECN's metal-wrap-through (MWT) concept. Optimization of several cell processing steps led to an increase of more than 2% absolute in cell efficiency. With these cells 36-cell modules were manufactured at 100% yield in our industry scale module pilot line. The highest module efficiency obtained (as independently confirmed by JRC-ESTI) was 17%. In this module the average cell efficiency was 17.8%;this shows a small difference between cell and module efficiency. Copyright (c) 2011 John Wiley & Sons, Ltd.

关键词： multi crystalline silicon metal-wrap-through module integration high-efficiency module high-efficiency cells world record

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Laser profilometer module based on a lowtemperature cofired ceramic substrate -: art. no. 093603

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OPTICAL ENGINEERING 2005年第9期44卷

作者： Heikkinen, V Heikkinen, M Keränen, K Mitikka, R Putila, VP Tukkiniemi, K VTT Elect FI-90570 Oulu Finland Polar Electro Oy FI-90440 Kempele Finland VTT Informat Technol FI-02044 Espoo Finland

We realized a laser profilometer module using low temperature cofired ceramics technology. The device consists of a vertical-cavity surface-emitting laser as the light source and a complementary metal oxide semiconductor image sensor as the detector. The laser transmitter produces a thin light stripe on the measurable object, and the receiver calculates the distance profile using triangulation. Because the design of optoelectronic modules, such as the laser profilometer, is usually carried out using specialized software, its electronic compatibility is very important. We developed a data transmission network using commercial optical, electrical, and mechanical design software, which enabled us to electronically transfer data between the designers. The module electronics were realized with multilayer ceramics technology that eases component assembly by providing precision alignment features in the substrate. The housing was manufactured from aluminum using electronic data transfer from the mechanical design software to the five-axis milling workstation. Target distance profiles were obtained from 100 points with an accuracy varying from 0.1 mm at a 5-cm distance to 2 cm at 1.5 m, The module has potential for distance measurement in portable devices where small size, light weight, and low power consumption are important. (c) 2005 Society of Photo-Optical Instrumentation Engineers,

关键词： CMOS image sensors distance measurement low-temperature cofired ceramics module integration optoelectronics profilometers triangulation sensors vertical-cavity surface-emitting lasers

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Digital twin simulation modeling process with system dynamics: An application to naval ship operation

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INTERNATIONAL JOURNAL OF ROBUST AND NONLINEAR CONTROL 2023年第16期33卷 10136-10150页

作者： Choi, Jinwoo Moon, Seongam Min, Soonhong Republ Korea Navy Def Management Nonsan South Korea Korea Natl Def Univ Def Management Nonsan South Korea Yonsei Univ Business Adm Seoul South Korea Republ Korea Navy Def Management Hwangsanbeol Ro 1098 Nonsan 33021 Chungcheongnam South Korea

Digital twin (DT) has been around for many years, but there is no widely accepted standardized tool or method. In this study, system dynamics was proposed as a tool that can be integrated into multi-scale, multi-physics, and multi-disciplinary, which are continuously becoming issues in the DT field. Various heterogeneous data from multiple protocols or platforms could be integrated into one model. Through the five-step model building process, it was possible to integrate the theories and various models studied in the past. In this study, the operation and maintenance system of ROK Naval ships is implemented as a proposed method. Various physics, scales, and disciplines such as failures of ships, maintenance ability of repair shops, and schedule pressure of mechanics were reflected. It was possible to observe non-intuitive correlations and potential problems caused by the latent effect of the high-fidelity DT model. The proposed method is also capable of updating through continuous data calibration or real-time interworking with external statistical analysis tools.

关键词： digital twin module integration naval ship system potential problem system dynamics

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Analysis of Thermal Processes Driving Laser Welding of Aluminum Deposited on Glass Substrates for module Interconnection of Silicon Solar Cells

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IEEE JOURNAL OF PHOTOVOLTAICS 2015年第6期5卷 1606-1612页

作者： Schulte-Huxel, Henning Kajari-Schroeder, Sarah Brendel, Rolf Inst Solar Energy Res Hamelin D-31860 Emmerthal Germany Leibniz Univ Hannover Inst Solid State Phys Dept Solar Energy D-30167 Hannover Germany

Laser welding of thin Al layers offers a silver-free and highly flexible option for the interconnection of Al-metallized solar cells. Welding requires the melting of the Al layers in order to form a reliable electrical and mechanical contact. Here, we investigate the process driving the melt front of the aluminum, which is attached to a transparent substrate, toward the interface between the two Al layers. In experiments, we observe two different mechanisms depending on the thickness of the irradiated layer. In the case of Al layers thinner than 5 mu m, a melt-through of the Al-layer is observed, whereas for thicker layers, thermal expansion causes a breakage of the surface and ejection of molten Al, which enables the contact formation. Using simulations that are based on the finite-element method, we instigate both mechanisms. The simulation results match the experimental observations within the measurement uncertainty. In case of thin layers, the simulation shows that the process is limited by thermal diffusion. For thicker Al layers, the onset of melting on the irradiated side initiates the breakage of the surface and the ejection of the aluminum.

关键词： Al metallization cell interconnection finite-element method (FEM) simulations laser processing module integration

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Screen-Printed Metallization Concepts for Large-Area Back-Contact Back-Junction Silicon Solar Cells

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IEEE JOURNAL OF PHOTOVOLTAICS 2016年第1期6卷 374-383页

作者： Hendrichs, Max Padilla, Milan Walter, Johann Clement, Florian Rech, Bernd Fraunhofer Inst Solar Energy Syst D-79110 Freiburg Germany Helmholtz Zentrum Berlin D-14109 Berlin Germany SolarCity Corp Fremont CA 94538 USA Helmholtz Ctr Berlin Mat & Energy D-12489 Berlin Germany

In this study, we investigate three screen-printed metallization concepts for back-contact back-junction silicon solar cells with an edge length of 156 mm: 1) a busbar-less concept with periodically interrupted contact fingers for wire-based interconnection;2) a single-layer concept with printed busbars and periodically interrupted contact fingers;and 3) a multilayer concept consisting of continuous contact fingers, an insulation layer, and busbar metallization. A comprehensive simulation study is presented for all investigated metallization concepts, yielding their respective performance lossmechanisms. The multilayer approach is found to provide superior conversion efficiencies., compared with the single-layer approach. For the wire-based concept, we show that contact finger interruptions up to a width of 1 mm have no significant negative impact on cell performance (Delta eta < 0.1%(abs)). Furthermore, peel force measurements on test structures between soldered cell interconnectors and screen-printed metallization are discussed for the multilayer and the wire-based concept. Successful proof of principles with peel forces exceeding 1 N/mm are demonstrated for both investigated metallization concepts.

关键词： Back-contact interdigitated back contact (IBC) metallization module integration numerical simulation silicon devices

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Product platform configuration decision in NPD with uncertain demands and module options

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INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH 2023年第19期61卷 6336-6355页

作者： Wang, Ting Wang, Jian Jin, Guixiang Matsukawa, Hiroaki Keio Univ Dept Ind & Syst Engn Tokyo Japan Shanghai Univ Dept Management Sci & Engn Shanghai Peoples R China Seikei Univ Dept Syst Design Tokyo Japan

Platform-based product development is a cost-efficient approach to satisfy wide range of customer preferences. One important problem is the product platform configuration, in which two types of platform configuration are widely used, either module selection or module integration. The platform configuration based on module selection provides a broader solution space of platform selection, while module integration facilitates product platform commonality to gain economic benefits. Up to date, most research focused on the platform configuration based on module selection with a given module set. In this paper, we propose a new model to determine the optimal platform configuration for an external product family, considering both module selection and integration. The demand for the external product family is uncertain and assumed to follow normal distribution. A hybrid methodology combining simulated annealing and variable neighbourhood search is proposed. A numerical examination is carried out for the purpose of evaluation. The results show that the proposed model can provide a practically good solution. Main contributions of this research are two folds, one is the balance point between module selection and module integration in the platform configuration and the other is that we take into account the operation cost of module acquisition to the platform configuration problem.

关键词： Product platform configuration module selection module integration platform commonality supply chain cost

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