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IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

作者： Yang, Alan S. Chen, Xu Schutt-Aine, Jose E. Cangellaris, Andreas C. Univ Illinois Dept Elect & Comp Engn Urbana IL 61801 USA

ISBN: (纸本)9781467364836

An adaptive wavelet stochastic collocation method for uncertainty quantification is applied to a resonant circuit with stochastic parameters. The outputs of many electrical systems vary rapidly with respect to internal random parameters, for example due to resonance conditions. Accurate and efficient characterization of output statistics is key in designing systems with irregularities, but poses a challenge for conventional sampling-based stochastic collocation methods. The adaptive method in this paper constructs a hierarchical sparse grid approximation using wavelet basis functions. Since wavelet expansion coefficients are rigorous error estimators, wavelet sparse grids can potentially meet error tolerances with optimal efficiency and outperform local polynomial and other adaptive finite-element methods. The advantages and efficiency of this method is explored in the context of the circuit problem presented.

关键词： Electromagnetics (EM) and EM Interference modeling simulation algorithms tools and flows

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A Fast method to predict the Voltage Droop for Fully Integrated Voltage Regulators in Microprocessors

A Fast method to predict the Voltage Droop for Fully Integra...

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IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

作者： Kumar, Amit Govindan, Srinivasan Venkataraman, Srikrishnan Intel Technol India Pvt Ltd Xeon Engn Grp Bangalore Karnataka India

ISBN: (纸本)9781665466134

Modern high performance server microprocessors processors have built-in Fully Integrated Voltage Regulators (FIVR) to generate the on-chip power domains. FIVR is designed using on-Die power MOSFETs, package inductors, on-Die capacitors, and feedback control circuits. High di/ dt events on the output of FIVR domains lead to large voltage droops which affect the circuit performance. This voltage droop needs to be modelled accurately and minimized in the design stage. Frequency domain-based analysis is typically followed in industry to optimize the design parameters such as the Gain margin, Phase margin, and the unity gain bandwidth of the feedback loop. However, it is difficult to predict the time-domain parameters such as the voltage droop and the peak time using the frequency domain methods. In this paper, a fast method is proposed to predict the voltage droop for FIVRs in time domain using analytical methods. The proposed method helps to easily do a sensitivity study of the different control variables on the voltage droop and reduces the time needed for optimal design.

关键词： Electronic packages and microsystems Electromagnetic (EM) and EM interference modeling simulation algorithms tools and flows Power integrity and power distribution networks

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A Classification Framework for Time Stamp Stochastic Assignment Problems 9th

A Classification Framework for Time Stamp Stochastic Assignm...

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9th International Conference on Operations Research and Enterprise Systems (ICORES)

作者： Kooiman, Kees Phillipson, Frank Sangers, Alex Erasmus Univ Rotterdam Netherlands Netherlands Org Appl Sci Res TNO The Hague Netherlands

ISBN: (纸本)9789897583964

In this paper Time-stamp Stochastic Assignment Problems are studied. These problems occur in places where an incoming request or task has to be connected to a resource immediately. A definition and framework for these problems is given, in which the different Time-stamp Stochastic Assignment Problems can be categorised. An explicit notation is introduced to distinguish the different categories. Several solution methods for Time-stamp Stochastic Assignment Problems are listed and their advantages and disadvantages are discussed.

关键词： Assignment Time-stamp Stochastic Assignment Problem Classification Framework simulation algorithms

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Method to Model Vccin Feedthrough Noise in Multi-Domain Fully Integrated Voltage Regulators 27

Method to Model Vccin Feedthrough Noise in Multi-Domain Full...

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27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS)

作者： Govindan, Srinivasan Bharath, Krishna Gope, Dipanjan Venkataraman, Srikrishnan Intel Technol India Pvt Ltd Scalable Performance CPU Dev Grp Bangalore Karnataka India Intel Corp Assembly Test & Technol Dev Chandler AZ 85226 USA Indian Inst Sci Dept Elect Commun Engn Bangalore Karnataka India

ISBN: (纸本)9781538651667

The on-chip power supply domains of high performance server microprocessors are generated using built-in switching voltage regulators (also know as Fully Integrated Voltage regulators-FIVRs). The advantages of integrated voltage generation are improved performance and reduced platform cost. However, the FIVRs share a common input power plane in the package and the coupling of noise between FIVRs is of significant concern. This noise is also known as the Vccin feedthrough noise. The modeling of the vccin feedthrough noise using circuit simulation tools such as SPICE is a laborious and time consuming task. This paper proposes a simple method to accurately predict the vccin feedthrough noise based on the state-space averaged small signal method. This method simplifies the modeling of vccin feedthrough noise and saves lot of time and effort.

关键词： Power integrity and power distribution networks Electromagnetic (EM) and EM interference modeling simulation algorithms tools flows Electronic packages and microsystems

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WECPAR: List Ranking Algorithm and Relative Computational Power 28

WECPAR: List Ranking Algorithm and Relative Computational Po...

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28th IEEE International Parallel & Distributed Processing Symposium Workshops (IPDPSW)

作者： El-Boghdadi, Hatem M. Cairo Univ Fac Engn Dept Comp Engn Giza Egypt

ISBN: (纸本)9781479941162

Reconfigurable models were shown to be very powerful in solving many problems faster than non reconfigurable models. WECPAR W(M,N,k) is an M x N reconfigurable model that has point-to-point reconfigurable interconnection with k wires between neighboring processors. This paper studies several aspects of WECPAR. We first solve the list ranking problem on WECPAR. Some of the results obtained show that ranking one element in a list of N elements can be solved on W(N,N,N) WECPAR in O(1) time. Also, on W(N,N,k), ranking a list L(N) of N elements can be done in O((log N)( inverted right perpendicular log(k) (+1) N inverted left perpendicular )) time. To transfer a large body of algorithms to work on WECPAR and to assess its relative computational power, several simulations algorithms are introduced between WECPAR and well-known models such as PRAM and RMBM. simulations algorithms show that a PRIORITY CRCW PRAM of N processors and S shared memory locations can be simulated by an W(S, N, k) WECPAR in O( inverted right perpendicular log(k) (+1) N inverted left perpendicular + inverted right perpendicular log S-k (+1) inverted left perpendicular ) time. Also, we show that a PRIORITY CRCW Basic-RMBM(P, B), of P processors and B buses can be simulated by an W(B, P+ B, k) WECPAR in O( inverted right perpendicular log(k) (+1) (P + B) inverted left perpendicular ) time. This has the effect of migrating a large number of algorithms to work directly on WECPAR with the simulation overhead.

关键词： parallel algorithms simulation algorithms list ranking

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Plane-Pair PEEC Models for PDN Using Sub-meshing 23

Plane-Pair PEEC Models for PDN Using Sub-meshing

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23rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems

作者： Wei, Leihao Shringarpure, Ketan Ruehli, Albert Wheeler, Edward Drewniak, James Rose Hulman Inst Technol Terre Haute IN 47803 USA Missouri Univ Sci & Technol Rolla MO USA

In this paper, we present an improved plane-pair model for power distribution system modeling using the partial element equivalent circuit approach. The modified nodal analysis with a sub-meshing strategy leads to an ... 详细信息

ISBN: (纸本)9781479936434

关键词： power distribution networks power integrity analysis simulation algorithms

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Foundations and Applications of Entanglement Renormalization

Foundations and Applications of Entanglement Renormalization

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作者： Glen Evenbly University of Queensland

学位级别：博士

Understanding the collective behavior of a quantum many-body system, a system composed of a large number of interacting microscopic degrees of freedom, is a key aspect in many areas of contemporary physics. However, as a direct consequence of the difficultly of the so-called many-body problem, many exotic quantum phenomena involving extended systems, such as high temperature superconductivity, remain not well understood on a theoretical level. Entanglement renormalization is a recently proposed numerical method for the simulation of many-body systems which draws together ideas from the renormalization group and from the field of quantum information. By taking due care of the quantum entanglement of a system, entanglement renormalization has the potential to go beyond the limitations of previous numerical methods and to provide new insight to quantum collective phenomena. This thesis comprises a significant portion of the research development of ER following its initial proposal. This includes exploratory studies with ER in simple systems of free particles, the development of the optimisation algorithms associated to ER, and the early applications of ER in the study of quantum critical phenomena and frustrated spin systems.

关键词： Entanglement renormalization quantum many-body systems simulation algorithms tensor networks quantum entanglement quantum information

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Data Transfer, Processing and Path Planning for AGVS in Flexible Manufacturing Environment

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IFAC Proceedings Volumes 1992年第28期25卷 225-228页

作者： Z. Katz G. Bright Department of Mechanical Engineering University of Natal Durban South Africa

The paper presents some details on the mechanical design of the AGV, its guidance and drive systems and the interact10n between its subsystems. Specific problems related to data transfer and data processing for ongoing communication within the AGV and within the operating environment, are described. Concepts of path planning are highlighted and potential optimal path selection incorporating collision avoidance within task requirements is discussed. algorithms for specific path selection within a flexible manufacturing environment are incorporated and the logical approach used is explained.

关键词： Automated guided vehicle infrared communication flexible manufacturing simulation algorithms data transmission

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simulation of sample paths for Gauss-Markov processes in the presence of a reflecting boundary

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COGENT MATHEMATICS 2017年 4卷

作者： Buonocore, Aniello Nobile, Amelia G. Pirozzi, Enrica Univ Naples Federico II Dipartimento Matemat & Applicaz I-80126 Naples Italy Univ Salerno Dipartimento Informat Via Giovanni Paolo 2132 I-84084 Fisciano SA Italy

algorithms for the simulation of sample paths of Gauss-Markov processes, restricted from below by particular time-dependent reflecting boundaries, are proposed. These algorithms are used to build the histograms of first passage time density through specified boundaries and for the estimation of related moments. Particular attention is dedicated to restricted Wiener and Ornstein-Uhlenbeck processes due to their central role in the class of Gauss-Markov processes.

关键词： restricted Wiener and Ornstein-Uhlenbeck processes simulation algorithms first passage time densities

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Method to Model Vccin Feedthrough Noise in Multi-Domain Fully Integrated Voltage Regulators

Method to Model Vccin Feedthrough Noise in Multi-Domain Full...

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IEEE Conference on Electrical Performance of Electronic Packaging and Systems

作者： Srinivasan Govindan Krishna Bharath Dipanjan Gope Srikrishnan Venkataraman Department of Electrical Communication Engineering Indian Institute of Science Bangalore India Assembly Test and Technology Development Intel Corporation Chandler Arizona Scalable Performance CPU Development Group Intel Technology India Pvt. Ltd Bangalore India

关键词： Power integrity and power distribution networks Electromagnetic (EM) and EM interference modeling simulation algorithms Tools Flows Electronic packages and microsystems

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