From the stage of development marked by surface mount technology, micro assembly technology, three-dimensional assembly technology, and high density assembly technology, electrical interconnection technology for produ...
详细信息
From the stage of development marked by surface mount technology, micro assembly technology, three-dimensional assembly technology, and high density assembly technology, electrical interconnection technology for production of electronic products have gradually entered in a stage of new technology development marked by green assembly(pollution-free welding, etc.), photoelectric interconnection and structure-functioncomponents electrical interconnection technology, which is characterized by higher technology integrated degree, stronger electromechanical relationship, more difficulty interconnection technology and more direct effect on the performance and functionality of the electronic equipment system. This paper introduces the basic concept and development trend of structure-function components interconnection technology in electronic product.
暂无评论