We identify the nonlinear normal modes spawning from the stable equilibrium of a double pendulum under gravity, and we establish their connection to homoclinic orbits through the unstable upright position as energy in...
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ISBN:
(纸本)9798331540920;9783907144107
We identify the nonlinear normal modes spawning from the stable equilibrium of a double pendulum under gravity, and we establish their connection to homoclinic orbits through the unstable upright position as energy increases. This result is exploited to devise an efficient swing-up strategy for a double pendulum with weak, saturating actuators. Our approach involves stabilizing the system onto periodic orbits associated with the nonlinear modes while gradually injecting energy. Since these modes are autonomous system evolutions, the required control effort for stabilization is minimal. Even with actuator limitations of less than 1% of the maximum gravitational torque, the proposed method accomplishes the swing-up of the double pendulum by allowing sufficient time.
The information system is used for data processing to accomplish organizations' missions and business functions. However, there have been significant issues with system security in recent years due to various vuln...
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This paper studies the influence of Al doping on the crystallization and melting kinetics of the eutectic Sb 70 Te 30 fast-growth recording film under thermal and pulsed laser annealing
This paper studies the influence of Al doping on the crystallization and melting kinetics of the eutectic Sb 70 Te 30 fast-growth recording film under thermal and pulsed laser annealing
Wood plastic composites (WPC) are composite materials made of wood fiber/wood flour and thermosets/thermoplastics. The reinforcement of the wood flour is expected to give filling effects and woody designs, and consequ...
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Wood plastic composites (WPC) are composite materials made of wood fiber/wood flour and thermosets/thermoplastics. The reinforcement of the wood flour is expected to give filling effects and woody designs, and consequently WPC are used mainly in furniture applications, but automotive, transportation and building applications are also being developed in recent years. Acoustic emission (AE) is the phenomenon of radiation of acoustic waves that occurs when a material undergoes irreversible changes, such as fiber breakage, matrix crack and interfacial debonding/sliding. In the AE measurement, the damage occurrence in the mechanical test can be identified by measuring this AE waves because the frequency are different with various damages. In this study, WPC mixed wood flour and polypropylene were prepared with various wood flour addition rate, kneading speed, kneading temperature and compatibilizer. In addition, the tensile and 3point bending tests were performed, and the influences of the mechanical properties were clarified by the fracture surface observation and AE measurement. As a result, the stress-strain curve showed nonlinear behavior, and the strength and elastic modulus were increased with wood flour addition rate. On the other hand, kneading speed and kneading temperature have almost no influence on strength and elastic modulus. In addition, the damages during tensile test can be measured by AE measurement, and it was confirmed that the specimen breaks due to a large matrix crack. Furthermore, by the addition of the compatibilizer, the interface state was improved, and consequently the strength was increased, but there was no difference depending on the kind of compatibilizer. On the other hand, the load-displacement curve of the 3-point bending tests showed nonlinear behavior, and the strength and elastic modulus were increased with wood flour addition rate. But, there were no difference in the fracture toughness.
Summary form only given, as follows. Parylene-c (Pa-c) film is a pinhole-free barrier against moisture, chemical and biofluid. So it is candidate for low dielectric materials for the application of biosensors such as ...
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Summary form only given, as follows. Parylene-c (Pa-c) film is a pinhole-free barrier against moisture, chemical and biofluid. So it is candidate for low dielectric materials for the application of biosensors such as DNA and protein chip Pa-c and SiO/sub 2/ films are deposited on a Si substrate using a vapor deposition method and LPCVD, respectively. Au was then deposited on both substrates using the e-beam evaporation method. For improvement of Au adhesion on Pa-c and SiO/sub 2/ surfaces, surface modification of Pa-c and SiO/sub 2/ was performed using oxygen plasma. Pa-c and SiO/sub 2/ layers were exposed to an oxygen plasma using a reactive ion etcher at various power and times.
As the complexity of microprocessor increases, functional verification becomes more difficult and emerges as the bottleneck of the design cycle. In this paper, we suggest a functional verification methodology, especia...
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ISBN:
(纸本)0780337026
As the complexity of microprocessor increases, functional verification becomes more difficult and emerges as the bottleneck of the design cycle. In this paper, we suggest a functional verification methodology, especially for the compatible microprocessor design. To guarantee the perfect compatibility with previous microprocessors, we developed these C models in different representation levels, i.e Polaris MCV (Micro-Code Verifier) and StreC. An instruction behavioral level C model (Polaris) is verified using the slowed-down PC. In the implementation of micro-architecture, a micro-operational level model (MCV) and RTL model (StreC), both written in C, are co-simulated with consistency checking (IPC) between these two models. The simulation speed of C models makes it possible to test the "real-world" application programs on the C model with a software board model (VPC). To increase the confidence level of verifications, Pro-filer reports the verification coverage of the test program, which is fed back to the automatic test program generator (Pandora). Restartability feature also helps significantly reduce the total simulation time. Using the proposed verification methodology, we designed and verified the K 486, an Intel 486-compatible microprocessor successfully.
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